IP Library Granted Patent US 11,803,217
Granted Patent B2
US 11,803,217 · App. 17/543,463 · Granted Oct 31, 2023

Management of composite cold temperature for data storage devices

Inventors: Bret Dee Winkler (Mission Viejo, CA); Mark James Hardiman (Los Altos, CA); Jeff Furlong (Irvine, CA); Christian Khanh Phan (Cypress, CA); Jeffrey James Levie (Gilbert, AZ); David Allen Wright (San Tan Valley, AZ)
Assignee: Western Digital Technologies, Inc.
G06F1/206G06F11/3034G06F11/3058G11C5/14
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Quick Facts
Patent No.
US 11,803,217
App. No.
17/543,463
Granted
Oct 31, 2023
Kind
B2
Abstract

Methods and apparatus for thermal management in data storage devices are provided. One such data storage device includes a non-volatile memory (NVM), at least one ambient temperature sensor configured to detect an ambient temperature of the data storage device, at least one component temperature sensor configured to detect one or more component temperatures of one or more components of the data storage device, and a processor coupled to the NVM, the at least one ambient temperature sensor, and the at least one component temperature sensor. The processor is configured to determine a composite temperature of the data storage device based on the one or more component temperatures and the ambient temperature. The processor is further configured to determine whether the composite temperature exceeds a threshold and perform a thermal management operation if the composite temperature exceeds the threshold.

Claims (69)

1. A data storage device, comprising:

a non-volatile memory (NVM);

at least one ambient temperature sensor configured to detect an ambient temperature of the data storage device;

at least one component temperature sensor configured to detect one or more component temperatures of one or more components of the data storage device; and

a processor coupled to the NVM, the at least one ambient temperature sensor, and the at least one component temperature sensor, the processor configured to:

determine a composite temperature of the data storage device based on the one or more component temperatures and the ambient temperature, wherein the processor is further configured to determine the composite temperature as a function of the ambient temperature scaled by a scaling factor responsive to the ambient temperature being within a preselected temperature range,

determine whether the composite temperature exceeds a threshold, and

perform a thermal management operation responsive to the composite temperature exceeding the threshold.

2. The data storage device of claim 1 , wherein the processor is further configured to:

refrain from performing the thermal management operation responsive to the composite temperature not exceeding the threshold.

3. The data storage device of claim 1 , wherein the processor configured to determine the composite temperature is further configured to:

determine the composite temperature as a function of only the one or more component temperatures responsive to the ambient temperature exceeding a highest temperature of the preselected temperature range.

4. The data storage device of claim 1 , wherein the processor configured to perform the thermal management operation is further configured to perform at least one of:

indicate a warning composite temperature;

indicate a critical composite temperature;

throttle power of the data storage device; or

shutdown power of the data storage device.

5. The data storage device of claim 1 , wherein the processor configured to determine the composite temperature is further configured to:

receive the ambient temperature from the at least one ambient temperature sensor;

receive the one or more component temperatures from the at least one component temperature sensor;

determine one or more adjusted component temperatures by applying a respective offset to a respective one of the one or more component temperatures;

determine a highest adjusted component temperature among the one or more adjusted component temperatures; and

determine the composite temperature based on the ambient temperature and the highest adjusted component temperature.

6. The data storage device of claim 5 , wherein the respective offset applied to a respective component temperature corresponds to an amount of temperature headroom remaining before reaching a shutdown threshold temperature of a component associated with the respective component temperature.

7. The data storage device of claim 5 , wherein the processor is further configured to determine the composite temperature based on an equation:

Composite temperature=α(Composite hot )+(1−α)(Composite cold ),

wherein Composite hot is the highest adjusted component temperature, Composite cold is the ambient temperature, and α is a value that varies based on a value of the ambient temperature.

8. The data storage device of claim 7 , wherein:

α is equal to 1 if the ambient temperature is greater than a preselected upper threshold temperature;

α is equal to 0 if the ambient temperature is less than or equal to a lower threshold temperature; and

α is equal to the ambient temperature divided by the preselected upper threshold temperature if the ambient temperature is greater than the lower threshold temperature and less than or equal to the preselected upper threshold temperature.

9. The data storage device of claim 8 , wherein the lower threshold temperature is 0° C., and wherein the preselected upper threshold temperature is 15° C.

10. A method for use with a data storage device including a non-volatile memory (NVM), the method comprising:

detecting an ambient temperature of the data storage device;

detecting one or more component temperatures of one or more components of the data storage device;

determining a composite temperature of the data storage device based on the one or more component temperatures and the ambient temperature, wherein the composite temperature is determined as a function of the ambient temperature scaled by a scaling factor when the ambient temperature is within a preselected temperature range;

determining whether the composite temperature exceeds a threshold; and

performing a thermal management operation responsive to the composite temperature exceeding the threshold.

11. The method of claim 10 , further comprising:

refraining from performing the thermal management operation responsive to the composite temperature not exceeding the threshold.

12. The method of claim 10 , wherein determining the composite temperature comprises:

determining the composite temperature as a function of only the one or more component temperatures responsive to the ambient temperature exceeding a highest temperature of the preselected temperature range.

13. The method of claim 10 , wherein performing the thermal management operation comprises at least one of:

indicating a warning composite temperature;

indicating a critical composite temperature;

throttling power of the data storage device; or

shutting down power of the data storage device.

14. The method of claim 10 , wherein determining the composite temperature comprises:

determining one or more adjusted component temperatures by applying a respective offset to a respective one of the one or more component temperatures;

determining a highest adjusted component temperature among the one or more adjusted component temperatures; and

determining the composite temperature based on the ambient temperature and the highest adjusted component temperature.

15. The method of claim 14 , wherein the respective offset applied to a respective component temperature corresponds to an amount of temperature headroom remaining before reaching a shutdown threshold temperature of a component associated with the respective component temperature.

16. The method of claim 14 , wherein the composite temperature is determined based on an equation:

Composite temperature=α(Composite hot )+(1−α)(Composite cold ),

wherein Composite hot is the highest adjusted component temperature, Composite cold is the ambient temperature, and α is a value that varies based on a value of the ambient temperature.

17. The method of claim 16 , wherein:

α is equal to 1 if the ambient temperature is greater than a preselected upper threshold temperature;

α is equal to 0 if the ambient temperature is less than or equal to a lower threshold temperature; and

α is equal to the ambient temperature divided by the preselected upper threshold temperature if the ambient temperature is greater than the lower threshold temperature and less than or equal to the preselected upper threshold temperature.

18. The method of claim 17 , wherein the lower threshold temperature is 0° C., and wherein the preselected upper threshold temperature is 15° C.

19. A data storage device, comprising:

a non-volatile memory (NVM);

means for detecting an ambient temperature of the data storage device;

means for detecting one or more component temperatures of one or more components of the data storage device;

means for determining a composite temperature of the data storage device based on the one or more component temperatures and the ambient temperature, wherein the composite temperature is determined as a function of the ambient temperature scaled by a scaling factor when the ambient temperature is within a preselected temperature range;

means for determining whether the composite temperature exceeds a threshold; and

means for performing a thermal management operation if the composite temperature exceeds the threshold.

20. The data storage device of claim 1 , wherein the scaling factor is a value greater than 0 and less than 1.

21. The method of claim 10 , wherein the scaling factor is a value greater than 0 and less than 1.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2022
From: WINKLER, BRET DEE; HARDIMAN, MARK JAMES; FURLONG, JEFF; PHAN, CHRISTIAN KHANH; LEVIE, JEFFREY JAMES; WRIGHT, DAVID ALLEN
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058531/0005 →