IP Library Granted Patent US 11,659,724
Granted Patent B2
US 11,659,724 · App. 17/564,484 · Granted May 23, 2023

Solid-state imaging apparatus and electronic apparatus

Inventors: Tetsuji Yamaguchi (Kanagawa, JP); Atsushi Toda (Kanagawa, JP); Itaru Oshiyama (Kanagawa, JP)
Assignee: SONY GROUP CORPORATION
H01L27/307G02B5/201G02B5/208H01L27/146H01L27/1462H01L27/1464H01L27/14621H01L27/14649H01L27/14667H01L27/281H01L27/286H01L31/10H04N5/332H04N5/379H04N9/07H04N5/378H04N5/3745H04N9/04553
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Quick Facts
Patent No.
US 11,659,724
App. No.
17/564,484
Granted
May 23, 2023
Kind
B2
Abstract

A solid-state imaging apparatus includes a pixel array part in which a plurality of pixels are two-dimensionally arranged, in which each pixel has a first photoelectric conversion region formed above a semiconductor layer, a second photoelectric conversion region formed in the semiconductor layer, a first filter configured to transmit a light in a predetermined wavelength region corresponding to a color component, and a second filter having different transmission characteristics from the first filter, one photoelectric conversion region out of the first photoelectric conversion region and the second photoelectric conversion region photoelectrically converts a light in a visible light region, the other photoelectric conversion region photoelectrically converts a light in an infrared region, the first filter is formed above the first photoelectric conversion region, and the second filter has transmission characteristics of making wavelengths of lights in an infrared region absorbed in the other photoelectric conversion region formed below the first filter the same.

Claims (28)

1. A light detecting device, comprising:

a photoelectric conversion layer disposed above a substrate and configured to selectively absorb light in a visible light region;

a photoelectric conversion region disposed in the substrate; and

a filter disposed between the photoelectric conversion layer and the substrate and configured to prevent light in a visible light region to be received by the photoelectric conversion region and allow light in an infrared region to be received by the photoelectric conversion region.

2. The light detecting device according to claim 1 , wherein the photoelectric conversion layer comprises an organic photoelectric conversion layer.

3. The light detecting device according to claim 2 , wherein the organic photoelectric conversion layer employs a bulk-hetero structure using poly(3-hexylthiophene-2,5-diyl) (P3HT) or Phenyl-C61-Butyric-Acid-Methyl-Ester (PCBM).

4. The light detecting device according to claim 1 , further comprising a first electrode, a second electrode, and a charge holding part, wherein the photoelectric conversion layer is disposed between the first electrode and the second electrode, the charge holding part is disposed in the substrate, and the charge holding part is electrically connected to one of the first electrode and the second electrode.

5. The light detecting device according to claim 4 , wherein the charge holding part is connected to the second electrode via a third electrode.

6. The light detecting device according to claim 4 , wherein the first and second electrodes are transparent electrodes.

7. The light detecting device according to claim 1 , wherein the photoelectric conversion region overlaps the photoelectric conversion layer in a plan view.

8. The light detecting device according to claim 1 , wherein the filter includes an inorganic film.

9. The light detecting device according to claim 1 , wherein the filter is a multilayered filter formed by laminating a plurality of materials with different refractive indexes.

10. The light detecting device according to claim 1 , wherein the filter is a metal thin-film filter in which a predetermined microstructural pattern is formed for a metal thin-film.

11. An electronic apparatus, comprising:

a light detecting device comprising:

a photoelectric conversion layer disposed above a substrate and configured to selectively absorb light in a visible light region;

a photoelectric conversion region disposed in the substrate; and

a filter disposed between the photoelectric conversion layer and the substrate and configured to prevent light in a visible light region to be received by the photoelectric conversion region and allow light in an infrared region to be received by the photoelectric conversion region; and

a digital signal processor.

12. The electronic apparatus according to claim 11 , wherein the photoelectric conversion layer comprises an organic photoelectric conversion layer.

13. The electronic apparatus according to claim 12 , wherein the organic photoelectric conversion layer employs a bulk-hetero structure using poly(3-hexylthiophene-2,5-diyl) (P3HT) or Phenyl-C61-Butyric-Acid-Methyl-Ester (PCBM).

14. The electronic apparatus according to claim 11 , further comprising a first electrode, a second electrode, and a charge holding part, wherein the photoelectric conversion layer is disposed between the first electrode and the second electrode, the charge holding part is disposed in the substrate, and the charge holding part is electrically connected to one of the first electrode and the second electrode.

15. The electronic apparatus according to claim 14 , wherein the charge holding part is connected to the second electrode via a third electrode.

16. The electronic apparatus according to claim 14 , wherein the first and second electrodes are transparent electrodes.

17. The electronic apparatus according to claim 11 , wherein the photoelectric conversion region overlaps the photoelectric conversion layer in a plan view.

18. The electronic apparatus according to claim 11 , wherein the filter includes an inorganic film.

19. The electronic apparatus according to claim 11 , wherein the filter is a multilayered filter formed by laminating a plurality of materials with different refractive indexes.

20. The electronic apparatus according to claim 11 , wherein the filter is a metal thin-film filter in which a predetermined microstructural pattern is formed for a metal thin-film.

Assignments (2)
CHANGE OF NAME Recorded Dec 30, 2021
From: SONY CORPORATION
To: SONY GROUP CORPORATION
Reel/Frame 058600/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2021
From: YAMAGUCHI, TETSUJI; TODA, ATSUSHI; OSHIYAMA, ITARU
To: SONY CORPORATION
Reel/Frame 058498/0995 →
Priority Claims (1)
JP 2016-101076 · May 20, 2016 · national
Continuity (3)
Continuation 17069610 · Oct 13, 2020
Continuation 16301105
Related Publication 20220123053A1 · Apr 21, 2022
Cited By (1)
US 12,339,475