Semiconductor device structure with magnetic element
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.
1. A semiconductor device structure, comprising:
a substrate;
a magnetic element over the substrate;
an adhesive element between the magnetic element and the substrate, wherein the adhesive element extends exceeding opposite edges of the magnetic element;
an isolation element extending exceeding the opposite edges of the magnetic element, wherein the isolation element partially covers a top surface of the magnetic element; and
a conductive line over the isolation element.
2. The semiconductor device structure as claimed in claim 1 , wherein the isolation element extends exceeding opposite edges of the adhesive element.
3. The semiconductor device structure as claimed in claim 1 , wherein the adhesive element extends exceeding an interface between the magnetic element and the isolation element.
4. The semiconductor device structure as claimed in claim 1 , wherein the adhesive element is in direct contact with the isolation element.
5. The semiconductor device structure as claimed in claim 1 , wherein the adhesive element comprises titanium, aluminum, copper, or a combination thereof.
6. The semiconductor device structure as claimed in claim 1 , further comprising a dielectric layer in direct contact with the magnetic element, the isolation element, and the conductive line.
7. The semiconductor device structure as claimed in claim 1 , wherein the magnetic element comprises multiple sub-layers, and each sub-layers is larger than another sub-layer above it.
8. The semiconductor device structure as claimed in claim 7 , wherein a topmost sub-layer of the sub-layers has a first portion and a second portion, the second portion surrounds the first portion, and the first portion is thicker than the second portion.
9. The semiconductor device structure as claimed in claim 1 , wherein the isolation element, the adhesive layer, and the conductive line together surround a hole.
10. The semiconductor device structure as claimed in claim 1 , wherein the isolation element is wider than the conductive line.
11. A semiconductor device structure, comprising:
a substrate;
a magnetic element over the substrate;
an isolation element partially covering the magnetic element and extending exceeding opposite edges of the magnetic element; and
a conductive line extending exceeding the opposite edges of the magnetic element, wherein the isolation element is between the conductive line and the magnetic element.
12. The semiconductor device structure as claimed in claim 11 , further comprising an adhesive layer between the magnetic element and the substrate.
13. The semiconductor device structure as claimed in claim 11 , wherein the isolation element covers an entirety of a top surface of the adhesive layer.
14. The semiconductor device structure as claimed in claim 11 , wherein the adhesive layer is separated from the conductive line by a hole.
15. The semiconductor device structure as claimed in claim 11 , further comprising a dielectric layer surrounding the magnetic element, the isolation element, and the conductive line.
16. A semiconductor device structure, comprising:
a substrate;
a magnetic element over the substrate;
an isolation element extending across the magnetic element, wherein opposite edges of the isolation element are laterally between opposite edges of the magnetic element; and
a conductive line over the isolation element.
17. The semiconductor device structure as claimed in claim 16 , wherein opposite edges of the conductive line are between the opposite edges of the isolation element.
18. The semiconductor device structure as claimed in claim 16 , further comprising an adhesive layer between the magnetic element and the substrate.
19. The semiconductor device structure as claimed in claim 16 , wherein the adhesive layer is electrically isolated from the conductive line.
20. The semiconductor device structure as claimed in claim 16 , further comprising:
a second isolation element extending across the magnetic element; and
a second conductive line extending across the magnetic element, wherein the second isolation element is between the second conductive line and the magnetic element.