Crosstalk cancelation structures having metal layers between signal lines semiconductor packages
The embodiments herein are directed to technologies for crosstalk cancellation structures. One semiconductor package includes conductive metal layers separated by insulating layers, the conductive metal layers for routing signals between external package terminals and pads on an integrated circuit device. Signal lines formed in the conductive metal layers have electrode structure (capacitor electrode-like structures) formed for at least adjacent signaling lines of the package terminals. Two of the electrode structures from the adjacent signaling lines are formed opposite each other on different metal layers.
1. A semiconductor package comprising:
an integrated circuit device comprising a plurality of conductive pads;
a plurality of package terminals;
a plurality of conductive metal layers separated by insulating layers, wherein the plurality of conductive metal layers comprising signal lines formed in the plurality of conductive metal layers to route signals between the plurality of package terminals and the plurality of conductive pads of the integrated circuit device, wherein:
a first signal line coupled to a first package terminal of the plurality of package terminals;
a second signal line coupled to a second package terminal of the plurality of package terminals, the first signal line and second signal line being adjacent signal lines and conductively isolated;
the first signal line comprises a first electrode structure disposed in a first layer of the plurality of conductive metal layers;
the second signal line comprises a second electrode structure disposed in a second layer of the plurality of conductive metal layers;
the first electrode structure and the second electrode structure are formed opposite each other on the first layer and the second layer, respectively, such that the first electrode structure and the second electrode structure are aligned on a common axis perpendicular to the first layer and the second layer;
a third signal line coupled to a third package terminal of the plurality of package terminals, the third signal line being adjacent to at least one of the first signal line or the second signal line, and the third signal line comprises a third electrode structure disposed in a third layer of the plurality of conductive metal layers; and
the first signal line further comprises a fourth electrode structure disposed in a fourth layer of the plurality of conductive metal layers.
2. The semiconductor package of claim 1 , further comprising a first via coupled to the fourth electrode structure in the fourth layer and the first electrode structure in the first layer.
3. The semiconductor package of claim 1 , further comprising:
the first via coupled to the first package terminal and the first electrode structure; and
a second via coupled to the second package terminal and the second electrode structure.
4. The semiconductor package of claim 3 , further comprising:
a third via coupled to the third package terminal;
wherein the second electrode structure and the third electrode structure are formed opposite each other on the second layer and the third layer, respectively.
5. The semiconductor package of claim 4 , further comprising:
a fourth package terminal of the plurality of package terminals;
a fourth via coupled to the fourth package terminal; and
a fourth signal line coupled to the fourth package terminal, the fourth signal line comprising a fourth electrode structure disposed in a fourth layer of the plurality of conductive metal layers, wherein the third electrode structure and the fourth electrode structure are formed opposite each other on the third layer and the fourth layer, respectively.
6. A semiconductor package comprising:
a first signal line in a first conductive metal layer;
a second signal line in the first conductive metal layer, wherein the first signal line and the second signal line are adjacent signal lines;
a first electrode structure disposed in a second conductive metal layer;
a first insulating layer disposed between the first conductive metal layer and the second conductive metal layer;
a first via coupled to the first signal line in the first conductive metal layer and the first electrode structure disposed in the second conductive metal layer;
a second electrode structure disposed in the first conductive metal layer and coupled to the second signal line, wherein the second electrode structure and the first electrode structure are disposed opposite each other such that the first electrode structure and the second electrode structure are aligned on a common axis perpendicular to the first conductive metal layer and the second conductive metal layer;
a third signal line in the first conductive metal layer;
a third electrode structure in a third conductive metal layer, wherein the third signal line and the second signal line are adjacent signal lines in the first conductive metal layer;
a second insulating layer disposed between the second conductive metal layer and the third conductive metal layer;
a second via coupled to the third signal line in the first conductive metal layer and the third electrode structure in the third conductive metal layer, wherein the third electrode structure and the second electrode structure are disposed opposite each other:
a fourth electrode structure in a fourth conductive metal layer;
a third insulating layer disposed between the third conductive metal layer and the fourth conductive metal layer, wherein the first via is coupled to the fourth electrode structure in the fourth conductive metal layer; and
a first ball grid array (BGA) pad, wherein the first electrode structure, the second electrode structure, the third electrode structure, and the fourth electrode structure are aligned with the first BGA pad, wherein the first BGA pad is coupled to the fourth electrode structure.
7. The semiconductor package of claim 6 , wherein a first width of the first electrode structure is equal to a second width of the first BGA pad.
8. A semiconductor package comprising:
a first package terminal and a second package terminal;
a first electrode structure disposed in a first conductive metal layer;
a second electrode structure disposed in a second conductive metal layer, wherein the second conductive metal layer is separated from the first conductive metal layer by a first insulating layer, wherein the first electrode structure and the second electrode structure are formed opposite each other on the first conductive metal layer and the second conductive metal layer, respectively, such that the first electrode structure and the second electrode structure are aligned on a common axis perpendicular to the first conductive metal layer and the second conductive metal layer;
a first signal line disposed in the second conductive metal layer, the first signal line being coupled to the first package terminal;
a second signal line disposed in the second conductive metal layer, the second signal line being coupled to the second package terminal;
a first via coupled to the first electrode structure in the first conductive metal layer and the first signal line in the second conductive metal layer; and
a second via coupled to the second electrode structure in the second conductive metal layer and the second signal line in the second conductive metal layer.
9. The semiconductor package of claim 8 , further comprising:
a third package terminal;
a third electrode structure disposed in a third conductive metal layer, wherein the third conductive metal layer is separated from the first conductive metal layer by the first insulating layer and is separated from the second conductive metal layer by a second insulating layer, wherein the first electrode structure and the third electrode structure are formed opposite each other on the first conductive metal layer and the third conductive metal layer, respectively and the second electrode structure and the third electrode structure are formed opposite each other on the second conductive metal layer and the third conductive metal layer, respectively;
a third signal line disposed in the second conductive metal layer, the third signal line being coupled to the third package terminal; and
a third via coupled to the third electrode structure in the third conductive metal layer and the third signal line in the second conductive metal layer.
10. The semiconductor package of claim 9 , further comprising:
a fourth package terminal;
a fourth electrode structure disposed in a fourth conductive metal layer, wherein the fourth conductive metal layer is separated from the second conductive metal layer by the second insulating layer and is separated from the third conductive metal layer by a third insulating layer, wherein the first electrode structure, the second electrode structure, the third electrode structure, and the fourth electrode structure are aligned on the common axis; and
a fourth signal line disposed in the second conductive metal layer, the fourth signal line being coupled to the fourth package terminal.
11. The semiconductor package of claim 8 , further comprising
an integrated circuit device comprising a first conductive pad and a second conductive pad, the first conductive pad being coupled to the first signal line and the second conductive pad being coupled to the second signal line.
12. The semiconductor package of claim 8 , wherein the first package terminal is at least one of a first ball grid array (BGA) pad, a first controlled collapse chip connection (C4) solder bump, or a first copper-pillar bump, and the second package terminal is at least one of a second BGA pad, a second C4 solder bump, or a second copper-pillar bump.