IP Library Granted Patent US 12,248,249
Granted Patent B2
US 12,248,249 · App. 17/623,995 · Granted Mar 11, 2025

Resist material and pattern forming method

Inventors: Kimiko Hattori (Tokyo, JP); Kazuyo Morita (Tokyo, JP)
Assignee: OJI HOLDINGS CORPORATION
G03F7/039C08F220/22C08F220/283G03F7/2059
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Quick Facts
Patent No.
US 12,248,249
App. No.
17/623,995
Granted
Mar 11, 2025
Kind
B2
Abstract

It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R 1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R 1 may be the same or different. R 11 represents a hydrogen atom or an alkyl group optionally having a substituent. R 2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 1 represents a single bond or a linking group.

Claims (32)

1. A resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101):

wherein R 1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R 1 may be the same or different; R 11 represents a hydrogen atom or an alkyl group optionally having a substituent; R 2 represents a fluorine atom, a chlorine atom, or a bromine atom; and Y 1 represents a single bond or a linking group.

2. The resist material according to claim 1 , wherein the polymer further comprises a unit derived from a structure represented by the following formula (102):

wherein X 1 represents an alkyl group optionally having a substituent, an acyl group optionally having a substituent, or an allyl group optionally having a substituent; R 3 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 2 represents a single bond or a linking group.

3. The resist material according to claim 1 , wherein the polymer further comprises a unit derived from a structure represented by the following formula (103):

wherein X 2 represents an aryl group optionally having a substituent; R 4 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 3 represents a single bond or a linking group.

4. The resist material according to claim 1 , wherein, in the formula (101), R 11 is a hydrogen atom.

5. The resist material according to claim 2 , wherein, in the formula (102), R 3 represents a fluorine atom, a chlorine atom, or a bromine atom.

6. A resist film formed from the resist material according to claim 1 , wherein the resist film is formed by applying the resist material on a substrate and heating.

7. A pattern forming method, comprising:

applying the resist material according to claim 1 onto a substrate to form a resist film,

exposing, and

developing.

8. The pattern forming method according to claim 7 , further comprising:

introducing a metal before the developing.

9. The pattern forming method according to claim 7 , wherein, in the exposing, an electromagnetic wave having a wavelength of 15 nm or less is applied to the resist film.

10. The pattern forming method according to claim 7 , wherein a developing solution used in the developing comprises at least one selected from the group consisting of an ester compound, a ketone compound, and an alcohol compound.

11. A resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101), wherein the polymer further comprises a unit derived from a structure represented by the following formula (102):

wherein R 1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R 1 may be the same or different; R 11 represents a hydrogen atom or an alkyl group optionally having a substituent; R 2 represents a fluorine atom, a chlorine atom, or a bromine atom; and Y 1 represents a single bond or a linking group;

wherein X 1 represents an alkyl group optionally having a substituent, an acyl group optionally having a substituent, or an allyl group optionally having a substituent; R 3 represents a fluorine atom, a chlorine atom, or a bromine atom, or a halogenated alkyl group; and Y 2 represents a single bond or a linking group.

12. The resist material according to claim 11 , wherein the polymer further comprises a unit derived from a structure represented by the following formula (103):

wherein X 2 represents an aryl group optionally having a substituent; R 4 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 3 represents a single bond or a linking group.

13. The resist material according to claim 11 , wherein, in the formula (101), R 11 is a hydrogen atom.

14. A resist film formed from the resist material according to claim 11 , wherein the resist film is formed by applying the resist material on a substrate and heating.

15. A pattern forming method, comprising:

applying the resist material according to claim 11 onto a substrate to form a resist film,

exposing, and

developing.

16. The pattern forming method according to claim 15 , further comprising:

introducing a metal before the developing.

17. The pattern forming method according to claim 15 , wherein, in the exposing, an electromagnetic wave having a wavelength of 15 nm or less is applied to the resist film.

18. The pattern forming method according to claim 15 , wherein a developing solution used in the developing comprises at least one selected from the group consisting of an ester compound, a ketone compound, and an alcohol compound.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2021
From: HATTORI, KIMIKO; MORITA, KAZUYO
To: OJI HOLDINGS CORPORATION
Reel/Frame 058506/0971 →
Priority Claims (1)
JP 2019-123878 · Jul 2, 2019 · national
Continuity (1)
Related Publication 20220373886A1 · Nov 24, 2022
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Cited By (1)
US 12,449,737