Heterogenous integration scheme for III-V/Si and Si CMOS integrated circuits
A method includes bonding a III-V die directly to a Complementary Metal-Oxide-Semiconductor (CMOS) die to form a die stack. The III-V die includes a (111) semiconductor substrate, and a first circuit including a III-V based n-type transistor formed at a surface of the (111) semiconductor substrate. The CMOS die includes a (100) semiconductor substrate, and a second circuit including an n-type transistor and a p-type transistor on the (100) semiconductor substrate. The first circuit is electrically connected to the second circuit.
1. A method comprising:
bonding a III-V die directly to a Complementary Metal-Oxide-Semiconductor (CMOS) die through solder bonding or micro bump bonding to form a die stack, wherein the III-V die comprises:
a (111) semiconductor substrate; and
a first circuit comprising:
a III-V based n-type transistor formed at a surface of the (111) semiconductor substrate, and wherein the CMOS die comprises:
a (100) semiconductor substrate;
a second circuit comprising:
an n-type transistor on the (100) semiconductor substrate; and
a p-type transistor on the (100) semiconductor substrate, wherein the first circuit is electrically connected to the second circuit;
dispensing an underfill into a gap between the III-V die and the CMOS die;
forming a through-via in the III-V die;
polishing the (111) semiconductor substrate to reveal the through-via; and
attaching a heat sink to the III-V die through a thermal interface material, wherein the thermal interface material physically contacts the through-via.
2. The method of claim 1 , wherein the CMOS die is over the III-V die, and the method further comprises:
forming a through-via in the CMOS die;
polishing the (100) semiconductor substrate to reveal the through-via; and
attaching a heat sink to the CMOS die through a thermal interface material, wherein the thermal interface material physically contacts the through-via.
3. The method of claim 1 , wherein the III-V die is free from p-type transistors.
4. The method of claim 1 , wherein the III-V based n-type transistor is directly connected to an additional p-type transistor in the CMOS die to form a functional circuit.
5. The method of claim 4 , wherein the III-V based n-type transistor in the III-V die is directly connected to the additional p-type transistor in the CMOS die to form an inverter.
6. The method of claim 1 , wherein the III-V based n-type transistor uses Two-Dimensional Electron Gas (2DEG) as a channel.
7. The method of claim 1 , wherein a first major surface of the (111) semiconductor substrate is on a (111) plane of the (111) semiconductor substrate, and a second major surface of the (100) semiconductor substrate is on a (100) plane of the (111) semiconductor substrate.
8. The method of claim 1 , wherein the (111) semiconductor substrate is a silicon substrate, and wherein the III-V based n-type transistor is formed on the silicon substrate.
9. The method of claim 1 , wherein the III-V die is bonded to the CMOS die through solder bonding.
10. The method of claim 1 , wherein the III-V die is bonded to the CMOS die through micro bump bonding.
11. A method comprising:
forming a III-V die comprising:
forming a III-V based n-type transistor at a surface of a (111) semiconductor substrate;
forming a Complementary Metal-Oxide-Semiconductor (CMOS) die comprising:
forming an n-type transistor on a (100) semiconductor substrate; and
forming a p-type transistor on the (100) semiconductor substrate;
bonding the CMOS die to, and over, the III-V die through hybrid bonding;
forming a through-via in the III-V die;
forming a thermal interface material over and physically contacting the through-via; and
attaching a heat sink over and joined to the thermal interface material.
12. The method of claim 11 further comprising dispensing an underfill between, and in physical contact with, the III-V die and the CMOS die.
13. The method of claim 11 , wherein the III-V die is free from p-type transistors.
14. The method of claim 11 , wherein the forming the CMOS die comprises forming an additional p-type transistor, and wherein the III-V based n-type transistor is directly connected to the additional p-type transistor.
15. The method of claim 11 , wherein the III-V based n-type transistor in the III-V die is directly connected to an additional p-type transistor in the CMOS die to form an inverter.
16. The method of claim 11 , wherein a first major surface of the (111) semiconductor substrate is on a (111) plane of the (111) semiconductor substrate, and a second major surface of the (100) semiconductor substrate is on a (100) plane of the (111) semiconductor substrate.
17. The method of claim 11 , wherein the (111) semiconductor substrate is a silicon substrate, and wherein the III-V based n-type transistor is formed over the silicon substrate.
18. A method comprising:
forming a III-V die comprising:
forming a III-V based n-type transistor at a surface of a (111) semiconductor substrate; and
forming a first electrical connector connected to the III-V based n-type transistor;
forming a Complementary Metal-Oxide-Semiconductor (CMOS) die comprising:
forming a p-type transistor at a surface of a (100) semiconductor substrate; and
forming a second electrical connector connecting to the p-type transistor, wherein the first electrical connector and the second electrical connector interconnect the III-V based n-type transistor and the p-type transistor; and
bonding the CMOS die directly to the III-V die, wherein the III-V based n-type transistor and the p-type transistor form an inverter, and wherein the III-V based n-type transistor and the p-type transistor are directly interconnected to form a functional circuit.
19. The method of claim 18 , wherein the III-V die is free from p-type transistors.
20. The method of claim 18 , wherein a first major surface of the (111) semiconductor substrate is on a (111) plane of the (111) semiconductor substrate, and a second major surface of the (100) semiconductor substrate is on a (100) plane of the (111) semiconductor substrate.