Enclosure fitting for electronic device
A data storage device includes an enclosure and a Printed Circuit Board Assembly (PCBA) extending in a basal plane, and a plurality of semiconductor memory packages electromechanically bonded to the PCBA and coupled to the enclosure with thermal interface material. The data storage device further includes a first fitting coupled to a first end of the PCBA and the enclosure, restricting movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane. The data storage device further includes a second fitting coupled to a second end of the PCBA, allowing movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane.
1. A solid-state drive, comprising:
an enclosure having a top portion and a bottom portion forming an interior cavity;
a printed circuit board (PCB) assembly, wherein the PCB assembly:
is disposed in the interior cavity of the enclosure;
extends in a basal plane; and
has a top surface, a bottom surface, a first end, and a second end;
a first plurality of semiconductor memory packages electromechanically bonded to the top surface of the PCB assembly and coupled to the top portion of the enclosure with thermal interface material;
a second plurality of semiconductor memory packages electromechanically bonded to the bottom surface of the PCB assembly and coupled to the bottom portion of the enclosure with thermal interface material;
a first fitting comprising a first screw that is coupled to the first end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure, wherein the first fitting:
restricts movement of the PCB assembly in the basal plane with respect to the enclosure; and
restricts movement of the PCB assembly out of the basal plane; and
a second fitting coupled to the second end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure, wherein the second fitting comprises:
a second screw that is:
coupled to the top portion of the enclosure and the bottom portion of the enclosure; and
decoupled from the PCB assembly; and
first and second structural elements that are:
respectively coupled to the top and bottom portions of the enclosure;
respectively coupled to the top and bottom surfaces of the PCB assembly; and
decoupled from the second screw;
wherein the first and second structural elements:
allow movement of the PCB assembly in the basal plane with respect to the enclosure; and
restrict movement of the PCB assembly out of the basal plane; and
wherein:
the first structural element comprises a first helical spring disposed about a portion of the second screw above the top surface of the PCB assembly;
the second structural element comprises a second helical spring disposed about a portion of the second screw below the bottom surface of the PCB assembly;
the first helical spring is directly coupled to the top portion of the enclosure and the top surface of the PCB assembly; and
the second helical spring is directly coupled to the bottom portion of the enclosure and the bottom surface of the PCB assembly.
2. The solid-state drive of claim 1 , wherein the second fitting comprises:
the first structural element comprises a first low-shear modulus block disposed about a portion of the second screw above the top surface of the PCB assembly; and
the first structural element comprises a second low-shear modulus block disposed about a portion of the second screw below the bottom surface of the PCB assembly.
3. The solid-state drive of claim 2 , wherein:
the first low-shear modulus block is directly coupled to the top portion of the enclosure and the top surface of the PCB assembly; and
the second low-shear modulus block is directly coupled to the bottom portion of the enclosure and the bottom surface of the PCB assembly.
4. The solid-state drive of claim 1 , further comprising a connector coupled to the PCB assembly.
5. The solid-state drive of claim 4 , wherein:
the connector is disposed at the first end of the PCB assembly; and
the first and second pluralities of semiconductor memory packages are disposed at the second end of the PCB assembly.
6. The solid-state drive of claim 1 , wherein the first and second pluralities of semiconductor memory packages are electromechanically bonded to the PCB assembly with solder joint arrays.
7. A solid-state drive, comprising:
an enclosure having a top portion and a bottom portion forming an interior cavity;
a printed circuit board (PCB) assembly, wherein the PCB assembly:
is disposed in the interior cavity of the enclosure;
extends in a basal plane; and
has a top surface, a bottom surface, a first end, and a second end;
a first plurality of semiconductor memory packages electromechanically bonded to the top surface of the PCB assembly and coupled to the top portion of the enclosure with thermal interface material;
a second plurality of semiconductor memory packages electromechanically bonded to the bottom surface of the PCB assembly and coupled to the bottom portion of the enclosure with thermal interface material;
a first fitting comprising a first screw that is coupled to the first end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure, wherein the first fitting:
restricts movement of the PCB assembly in the basal plane with respect to the enclosure; and
restricts movement of the PCB assembly out of the basal plane; and
a second fitting coupled to the second end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure, wherein the second fitting comprises:
a second screw that is:
coupled to the top portion of the enclosure and the bottom portion of the enclosure; and
decoupled from the PCB assembly; and
first and second structural elements that are:
respectively coupled to the top and bottom portions of the enclosure;
respectively coupled to the top and bottom surfaces of the PCB assembly; and
decoupled from the second screw;
wherein the first and second structural elements:
allow movement of the PCB assembly in the basal plane with respect to the enclosure; and
restrict movement of the PCB assembly out of the basal plane; and
wherein the second fitting comprises:
the first structural element comprises a first plurality of ball bearings disposed about a portion of the second screw above the top surface of the PCB assembly; and
the first structural element comprises a second plurality of ball bearings disposed about a portion of the second screw below the bottom surface of the PCB assembly.
8. The solid-state drive of claim 7 , wherein:
the first plurality of ball bearings are in contact with the top portion of the enclosure and the top surface of the PCB assembly; and
the second plurality of ball bearings are in contact with the bottom portion of the enclosure and the bottom surface of the PCB assembly.
9. A solid-state drive, comprising:
an enclosure having a top portion and a bottom portion forming an interior cavity;
a printed circuit board (PCB) assembly, wherein the PCB assembly:
is disposed in the interior cavity of the enclosure; and
has a top surface, a bottom surface, a first end, and a second end;
a first plurality of semiconductor memory packages electromechanically bonded to the top surface of the PCB assembly and coupled to the top portion of the enclosure with thermal interface material;
a second plurality of semiconductor memory packages electromechanically bonded to the bottom surface of the PCB assembly and coupled to the bottom portion of the enclosure with thermal interface material;
a first screw coupled to the first end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure;
a second screw coupled to the second end of the PCB assembly, the top portion of the enclosure, and the bottom portion of the enclosure;
a first helical spring disposed adjacent to the first screw and directly coupled to the top portion of the enclosure and the top surface of the PCB assembly;
a second helical spring disposed adjacent to the first screw and directly coupled to the bottom portion of the enclosure and the bottom surface of the PCB assembly;
a third helical spring disposed adjacent to the second screw and directly coupled to the top portion of the enclosure and the top surface of the PCB assembly; and
a fourth helical spring disposed adjacent to the second screw and directly coupled to the bottom portion of the enclosure and the bottom surface of the PCB assembly.
10. The solid-state drive of claim 9 , wherein:
the first helical spring is disposed between the first screw and a first semiconductor memory package of the first plurality of semiconductor memory packages;
the second helical spring is disposed between the first screw and a first semiconductor memory package of the second plurality of semiconductor memory packages;
the third helical spring is disposed between the second screw and a second semiconductor memory package of the first plurality of semiconductor memory packages; and
the fourth helical spring is disposed between the second screw and a second semiconductor memory package of the second plurality of semiconductor memory packages.
11. The solid-state drive of claim 9 , wherein:
the first and second helical springs are configured to balance compression of the enclosure caused by the first screw; and
the third and fourth helical springs are configured to balance compression of the enclosure caused by the second screw.
12. The solid-state drive of claim 9 , wherein the first and second pluralities of semiconductor memory packages are electromechanically bonded to the PCB assembly with solder joint arrays.