Gate structure of semiconductor device and method of forming same
A semiconductor device and a method of forming the same are provided. The method includes forming a fin extending from a substrate. A dummy gate is formed over the fin. The dummy gate extends along sidewalls and a top surface of the fin. The dummy gate is removed to form a recess. A replacement gate is formed in the recess. Forming the replacement gate includes forming an interfacial layer along sidewalls and a bottom of the recess. A dipole layer is formed over the interfacial layer. The dipole layer includes metal atoms. Fluorine atoms are incorporated in the dipole layer. The fluorine atoms and the metal atoms are driven from the dipole layer into the interfacial layer. The dipole layer is removed.
1. A method comprising:
forming a fin extending from a substrate;
forming a dummy gate over the fin, the dummy gate extending along sidewalls and a top surface of the fin;
removing the dummy gate to form a recess; and
forming a replacement gate in the recess, wherein forming the replacement gate comprises:
forming an interfacial layer along sidewalls and a bottom of the recess;
forming a dipole layer over the interfacial layer, the dipole layer comprising metal atoms;
incorporating fluorine atoms in the dipole layer;
driving the fluorine atoms and the metal atoms from the dipole layer into the interfacial layer; and
removing the dipole layer.
2. The method of claim 1 , wherein the dipole layer comprises a metal oxide material.
3. The method of claim 1 , wherein incorporating the fluorine atoms in the dipole layer comprises soaking the dipole layer in a fluorine-containing chemical.
4. The method of claim 3 , wherein the fluorine-containing chemical comprises WF 6 or NF 3 .
5. The method of claim 1 , wherein driving the fluorine atoms and the metal atoms from the dipole layer into the interfacial layer comprises performing an anneal process.
6. The method of claim 1 , wherein removing the dipole layer comprises etching the dipole layer.
7. The method of claim 1 , wherein forming the dipole layer comprises performing an atomic layer deposition (ALD) process.
8. A method comprising:
patterning a substrate to form a fin;
forming a dummy gate over the fin, the dummy gate extending along sidewalls and a top surface of the fin;
etching the dummy gate to form a recess; and
forming a replacement gate in the recess, wherein forming the replacement gate comprises:
depositing an interfacial layer along sidewalls and a bottom of the recess;
depositing a dipole layer over the interfacial layer, the dipole layer comprising metal atoms;
performing a fluorine soaking process on the dipole layer to form a doped dipole layer, the doped dipole layer comprising fluorine atoms;
performing an anneal process to drive the fluorine atoms and the metal atoms from the doped dipole layer into the interfacial layer and form a doped interfacial layer;
etching the doped dipole layer to expose the doped interfacial layer;
depositing a gate dielectric layer over the doped interfacial layer; and
depositing a gate electrode layer over the gate dielectric layer.
9. The method of claim 8 , wherein the dipole layer comprises lanthanum oxide, yttrium oxide, zinc oxide, aluminum oxide, or gallium oxide.
10. The method of claim 8 , wherein the anneal process drives some of the fluorine atoms and some of the metal atoms to an interface between the doped interfacial layer and the fin.
11. The method of claim 8 , wherein the interfacial layer comprises silicon oxide.
12. The method of claim 8 , wherein the fluorine soaking process and the anneal process are performed two or more times.
13. The method of claim 8 , wherein performing the fluorine soaking process on the dipole layer comprises soaking the dipole layer in WF 6 or NF 3 .
14. The method of claim 8 , wherein the metal atoms are lanthanum atoms, yttrium atoms, zinc atoms, aluminum atoms, or gallium atoms.
15. A method comprising:
forming an interfacial layer over a channel region;
forming a dipole layer over the interfacial layer, the dipole layer comprising metal atoms;
incorporating fluorine atoms into the dipole layer to form a fluorine-doped dipole layer;
driving fluorine atoms and metal atoms from the fluorine-doped dipole layer into the interfacial layer;
removing remaining portions of the fluorine-doped dipole layer; and
after removing remaining portions of the fluorine-doped dipole layer, forming a gate electrode over the interfacial layer.
16. The method of claim 15 , wherein the fluorine-doped dipole layer has a fluorine concentration between about 0.01 at % and about 25 at %.
17. The method of claim 15 , wherein after removing remaining portion of the fluorine-doped dipole layer, the interfacial layer has fluorine concentration between about 0.001 att % and about 20 att %.
18. The method of claim 15 , wherein driving fluorine atoms and metal atoms into the interfacial layer drives some of the fluorine atoms and some of the metal atoms to bottom surface of the interfacial layer.
19. The method of claim 15 , wherein incorporating fluorine atoms into the dipole layer is performed at least in part by soaking the dipole layer in WF 6 or NF 3 .
20. The method of claim 15 , wherein driving fluorine atoms and metal atoms into the interfacial layer is performed at least in part by an anneal.