Mechanism for assembling force sensor patch into earphone device
An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.
1. An earphone device, comprising:
a housing subassembly;
an inner casing subassembly, disposed in the housing subassembly and integrated with a printed circuit board having at least one specific electrode;
an audio processor, disposed on the printed circuit board; and
a force sensor patch, pasted onto the at least one specific electrode of the printed circuit board to be coupled to the audio processor through the at least one specific electrode;
wherein the force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly;
and, the force sensor patch comprises:
a top electrically conductive layer portion at a top surface;
an intermediate dielectric layer portion;
a compressible conductive portion, coupled to a bottom of the top electrically conductive layer portion; and
a bottom electrically conductive layer portion, coupled to a bottom of the intermediate dielectric layer portion;
wherein the compressible conductive portion is adhered to a second electrode of the printed circuit board, and the bottom electrically conductive layer portion is adhered to a first electrode of the printed circuit board.
2. The earphone device of claim 1 , wherein the first electrode of the printed circuit board is a sensing electrode, and the second electrode of the printed circuit board is a ground electrode.
3. The earphone device of claim 1 , further comprising:
a compressible spacer, disposed between the top electrically conductive layer portion and the part of the housing subassembly, to preload a pressure.
4. An earphone device, comprising:
a housing subassembly;
an inner casing subassembly, disposed in the housing subassembly and integrated with a printed circuit board having at least one specific electrode;
an audio processor, disposed on the printed circuit board;
a force sensor patch, pasted onto the at least one specific electrode of the printed circuit board to be coupled to the audio processor through the at least one specific electrode; and
a battery device, integrated with the inner casing subassembly;
wherein the force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly;
and, the force sensor patch is further adhered to a portion of a surface of the battery device and arranged as a gravity sensing circuit to detect sudden acceleration or deceleration of the battery device to sense sudden acceleration or deceleration of the earphone device.
5. A method for assembling an earphone device, comprising:
providing a housing subassembly;
providing and disposing an inner casing subassembly inside the housing subassembly to be integrated with a printed circuit board having at least one specific electrode;
providing and installing an audio processor on the printed circuit board;
providing and pasting a force sensor patch onto the at least one specific electrode of the printed circuit board to be coupled to the audio processor through the at least one specific electrode;
providing a battery device integrated with the inner casing subassembly;
adhering the force sensor patch to a portion of a surface of the battery device; and
using the force sensor patch as a gravity sensing circuit to detect sudden acceleration or deceleration of the battery device to sense sudden acceleration or deceleration of the earphone device;
wherein the force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.