Three-dimensional heat transfer device
View Patent ↗A three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber.
1. A three-dimensional heat transfer device, comprising:
a vapor chamber including a bottom plate and a cover, the bottom plate comprising a main portion, a recessed portion, and a plurality of first supports, the recessed portion is recessed from the main portion, the plurality of first supports is coupled to the recessed portion and protrudes therefrom, the cover is disposed on the bottom plate and the plurality of first supports, the bottom plate and the cover together surround a fluid chamber, the cover has a plurality of through holes;
a plurality of flatten heat pipes, respectively disposed through the plurality of through holes and on the main portion and recessed portion and arranged in an array along an extension direction of a short side of the vapor chamber; and
a plurality of thermal conductive structures, the plurality of thermal conductive structures is coupled to the recessed portion and protrudes therefrom, the plurality of thermal conductive structures comprises a rectangular shape, whereby the plurality of thermal conductive structures is parallel to a long side of the vapor chamber;
wherein, each plurality of thermal conductive structures is coupled to at least two of the plurality of first supports; and
wherein, major axes of cross-sections of the plurality of flatten heat pipes are parallel to a long side of the vapor chamber.
2. The three-dimensional heat transfer device according to claim 1 , wherein in the extension direction of the short side of the vapor chamber, a distance between two of the plurality of flatten heat pipes which are located adjacent to each other is larger than a thickness of each of the plurality of flatten heat pipes.
3. The three-dimensional heat transfer device according to claim 1 , further comprising a first capillary structure, wherein the first capillary structure is located in the fluid chamber and stacked on the bottom plate, the plurality of flatten heat pipes are in thermal contact with the first capillary structure.
4. The three-dimensional heat transfer device according to claim 3 , further comprising a second capillary structure, wherein the second capillary structure is located in the fluid chamber and stacked on the cover.
5. The three-dimensional heat transfer device according to claim 1 , wherein each of the plurality of flatten heat pipes has an opening end and a notch located at the opening end, and the notch is configured to enable a flow of working fluid inside of the fluid chamber to transport into and out of an inner space of each plurality of flatten heat pipes via the notch, whereby the flow is perpendicular to the long side of the vapor chamber.
6. The three-dimensional heat transfer device according to claim 1 , wherein the bottom plate further comprises a plurality of second supports, the plurality of second supports is coupled to the main portion and protrudes therefrom, and a diameter of each of the plurality of second supports is larger than a diameter of each of the plurality of first supports.
7. The three-dimensional heat transfer device according to claim 1 , further comprising a heat dissipation fin, wherein the heat dissipation fin is mounted on the plurality of flatten heat pipes.
8. The three-dimensional heat transfer device according to claim 1 , wherein the recessed portion is recessed from the main portion such that one part of the main portion is disposed on one perimeter side of the recessed portion and an other part of the main portion is disposed on an other perimeter side of the recessed portion opposite the one part of the main portion.