Polishing pad and polishing method
A polishing pad adapted for polishing an object and having a polishing track region is provided. The polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface opposite to each other, and the rough bottom surface includes a plurality of discontinuous dents. The adhesive layer is adhered to the rough bottom surface.
1. A polishing pad, adapted for polishing an object and having a polishing track region, wherein the polishing pad comprises:
a polishing layer, having a polishing surface and a rough bottom surface opposite to each other, wherein the rough bottom surface comprises a plurality of discontinuous dents, at least one of the discontinuous dents has a hook shape with a depth gradient along the rough bottom surface; and
an adhesive layer, directly adhering to the rough bottom surface of the polishing layer so that all of the discontinuous dents on the rough bottom surface are filled with the adhesive layer.
2. The polishing pad according to claim 1 , wherein the plurality of discontinuous dents have fixed spacing, such that the plurality of discontinuous dents are regularly distributed on the rough bottom surface.
3. The polishing pad according to claim 1 , wherein the plurality of discontinuous dents have non-fixed spacing, such that the plurality of discontinuous dents are irregularly distributed on the rough bottom surface.
4. The polishing pad according to claim 1 , wherein a distribution pattern of the plurality of discontinuous dents comprises a parallel pattern, a non-parallel pattern, a mesh pattern, a radial pattern, or a ring pattern.
5. The polishing pad according to claim 1 , wherein at least two of the plurality of discontinuous dents are located on a same virtual extension line.
6. The polishing pad according to claim 1 , wherein the plurality of discontinuous dents are disposed in the polishing track region.
7. The polishing pad according to claim 1 , wherein the plurality of discontinuous dents comprises wear marks, knife marks, imprint marks, impact marks, or a combination thereof.
8. The polishing pad according to claim 1 , wherein a region other than the plurality of discontinuous dents in the rough bottom surface is a continuous plane.
9. The polishing pad according to claim 8 , wherein the polishing layer is a non-porous layer.
10. The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, and the non-porous layer covers the porous layer.
11. The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, the porous layer is located under the non-porous layer, and the rough bottom surface is located on a bottom surface of the porous layer.
12. The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, the non-porous layer is located under the porous layer, and the rough bottom surface is located on a bottom surface of the non-porous layer.
13. A polishing method, comprising:
providing the polishing pad according to claim 1 ;
applying a pressure to an object to place the object on the polishing surface of the polishing pad; and
performing relative movement between the object and the polishing pad for a polishing process.
14. A polishing pad, adapted for polishing an object and having a polishing track region, wherein the polishing pad comprises:
a polishing layer;
a base layer, comprising an upper surface and a lower surface that are relatively disposed, disposed below the polishing layer with the upper surface facing the polishing layer, wherein the base layer has a rough surface on the lower surface, and the rough surface comprises a plurality of discontinuous dents, wherein a material of the base layer is selected from at least one of polyurethane, polybutadiene, polyethylene, polypropylene, a copolymer of polyethylene and ethylene vinyl acetate, and a copolymer of polypropylene and ethylene vinyl acetate, and at least one of the discontinuous dents has a hook shape with a depth gradient along the rough surface; and
an adhesive layer, directly adhering to the rough surface of the base layer so that all of the discontinuous dents on the rough bottom surface are filled with the adhesive layer.
15. The polishing pad according to claim 14 , wherein the plurality of discontinuous dents have fixed spacing, such that the plurality of discontinuous dents are regularly distributed on the rough surface.
16. The polishing pad according to claim 14 , wherein the plurality of discontinuous dents have non-fixed spacing, such that the plurality of discontinuous dents are irregularly distributed on the rough surface.
17. The polishing pad according to claim 14 , wherein a distribution pattern of the plurality of discontinuous dents comprises a parallel pattern, a non-parallel pattern, a mesh pattern, a radial pattern, or a ring pattern.
18. The polishing pad according to claim 14 , wherein at least two of the plurality of discontinuous dents are located on a same virtual extension line.
19. The polishing pad according to claim 14 , wherein the plurality of discontinuous dents are disposed in the polishing track region.
20. The polishing pad according to claim 14 , wherein the plurality of discontinuous dents comprises wear marks, knife marks, imprint marks, impact marks, or a combination thereof.
21. The polishing pad according to claim 14 , wherein a region other than the plurality of discontinuous dents in the rough surface is a continuous plane.
22. The polishing pad according to claim 21 , wherein the base layer is a non-porous layer.
23. The polishing pad according to claim 21 , wherein the base layer comprises a porous layer and a non-porous layer, and the non-porous layer covers the porous layer.
24. The polishing pad according to claim 21 , wherein the rough surface is located on the upper surface and the lower surface of the base layer.
25. A polishing method, comprising:
providing the polishing pad according to claim 14 ;
applying a pressure to an object to place the object on the polishing surface of the polishing pad; and
performing relative movement between the object and the polishing pad for a polishing process.