Systems and processes for increasing semiconductor device reliability
A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.
1. A system configured to increase a reliability of electrical connections in a device, the system comprising:
a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component;
the lead includes a first pad connection portion that includes a first upper surface;
the first pad connection portion configured to connect the lead to the pad of at least one support structure;
the lead includes a second pad connection portion that includes a second upper surface;
the second pad connection portion configured to connect the lead to the pad of at least one electrical component;
the lead includes an upper portion that includes a lower surface arranged on a lower surface thereof;
the upper portion being arranged between the first pad connection portion and the second pad connection portion; and
an element configured to alleviate signaling degradation through the lead,
wherein the lower surface of the upper portion is arranged vertically above the first upper surface of the first pad connection portion;
wherein the lower surface of the upper portion is arranged vertically above the second upper surface of the second pad connection portion; and
wherein the element is arranged under the lead.
2. The system according to claim 1 wherein the element comprises at least one of the following: a metallic portion, a metallic component, and/or a metallic pad.
3. The system according to claim 1 wherein a width of the element is greater than a width of the pad of at least one support structure.
4. The system according to claim 1 further comprising:
at least one support structure; and
wherein the element comprises a metallic construction; and
wherein the element is arranged in one of the following: on the at least one support structure or within the at least one support structure.
5. The system according to claim 4 wherein:
the at least one support structure comprises a zone that includes a limited number of additional features; and
the element is arranged in the zone.
6. The system according to claim 5 wherein:
the at least one support structure comprises a Co-Planar Wave Guide (CPWG) printed circuit board (PCB) having vias; and
the zone that includes the element does not include the vias.
7. The system according to claim 6 further comprising at least one electrical component,
wherein the electrical component comprises an RF (Radio Frequency) component.
8. The system according to claim 1 wherein the upper portion comprises a curved convex construction.
9. The system according to claim 1 wherein:
the lead is configured to reduce stress in a first lead—solder interface arranged between the first pad connection portion of the lead and the pad of at least one support structure; and
the lead is configured to reduce stress in a second lead—solder interface arranged between the second pad connection portion of the lead and the pad of at least one electrical component.
10. The system according to claim 1 wherein:
the lead includes a first connection portion that connects between the first pad connection portion and the upper portion; and
the lead includes a second connection portion that connects between the second pad connection portion and the upper portion,
wherein portions of the first connection portion are arranged vertically above the first upper surface of the first pad connection portion; and
wherein portions of the second connection portion are arranged vertically above the second upper surface of the second pad connection portion.
11. The system according to claim 1 wherein
the lead includes a first connection portion that connects between the first pad connection portion and the upper portion; and
the lead includes a second connection portion that connects between the second pad connection portion and the upper portion,
wherein the first connection portion and the second connection portion each comprise a concave construction.
12. The system according to claim 1 wherein:
the lead includes a first end portion and a second end portion;
the first end portion forming a terminating end of the lead and the second end portion forming another terminating end of the lead; and
a curved distance from the first end portion to the second end portion along the lead is greater than a linear distance from the first end portion to the second end portion.
13. A process configured to increase a reliability of electrical connections in a device, the process comprising:
forming a lead that is configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component;
providing the lead with a first pad connection portion that includes a first upper surface;
configuring the first pad connection portion to connect the lead to the pad of at least one support structure;
providing the lead with a second pad connection portion that includes a second upper surface;
configuring the second pad connection portion to connect the lead to the pad of at least one electrical component;
arranging the lead to include an upper portion that includes a lower surface arranged on a lower surface thereof;
arranging the upper portion between the first pad connection portion and the second pad connection portion;
arranging the lower surface of the upper portion to be vertically above the first upper surface of the first pad connection portion;
arranging the lower surface of the upper portion to be arranged vertically above the second upper surface of the second pad connection portion; and
arranging an element configured to alleviate signaling degradation through the lead,
wherein the element is arranged under the lead.
14. The process according to claim 13 wherein the element comprises at least one of the following: a metallic portion, a metallic component, and/or a metallic pad.
15. The process according to claim 13 wherein a width of the element is greater than a width of the pad of at least one support structure.
16. The process according to claim 13 further comprising:
providing at least one support structure; and
wherein the element comprises a metallic construction; and
wherein the element is arranged in one of the following: on the at least one support structure or within the at least one support structure.
17. The process according to claim 16 further comprising:
forming a zone that includes a limited number of additional features in the at least one support structure; and
arranging the element in the zone.
18. The process according to claim 17 wherein:
the at least one support structure comprises a Co-Planar Wave Guide (CPWG) printed circuit board (PCB) having vias; and
the zone that includes the element does not include the vias.
19. The process according to claim 18 further comprising providing at least one electrical component,
wherein the electrical component comprises an RF (Radio Frequency) component.
20. The process according to claim 13 further comprising forming the upper portion to have a curved convex construction.
21. The process according to claim 13 further comprising:
implementing the lead to reduce stress in a first lead—solder interface arranged between the first pad connection portion of the lead and the pad of at least one support structure; and
implementing the lead to reduce stress in a second lead—solder interface arranged between the second pad connection portion of the pad of at least one electrical component.
22. The process according to claim 13 further comprising:
configuring the lead to include a first connection portion that connects between the first pad connection portion and the upper portion;
configuring the lead to include a second connection portion that connects between the second pad connection portion and the upper portion;
arranging portions of the first connection portion vertically above the first upper surface of the first pad connection portion; and
arranging portions of the second connection portion vertically above the second upper surface of the second pad connection portion.
23. The process according to claim 13 wherein
arranging the lead to include a first connection portion that connects between the first pad connection portion and the upper portion;
arranging the lead to include a second connection portion that connects between the second pad connection portion and the upper portion; and
configuring the first connection portion and the second connection portion to each have a concave construction.
24. The process according to claim 13 further comprising:
configuring the lead to include a first end portion and a second end portion, the first end portion forming a terminating end of the lead and the second end portion forming another terminating end of the lead; and
configuring the lead such that a curved distance from the first end portion to the second end portion along the lead is greater than a linear distance from the first end portion to the second end portion.