Micro solder joint and stencil aperture design
Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
1. A method of assembling an electronic device using a stencil, the method comprising:
depositing a solder paste at a plurality of stencil apertures on a printed circuit board (PCB) pad, wherein the PCB pad has a first predefined area and one stencil aperture of the plurality of stencil apertures has an aperture wall defining a second predefined area that is less than or equal to the first predefined area;
providing a surface mount circuit component on top of the solder paste, wherein the surface mount circuit component includes at least one terminal with a non-solderable side surface; and
performing a reflow process to form a non-convex solder joint between the at least one terminal and the PCB pad.
2. The method of claim 1 , wherein the solder paste has a first side surface and the at least one terminal has a second side surface that is substantially parallel to the first side surface, and
wherein, prior to performing the reflow process, the first side surface and the second side surface combine to form a combined side surface in a first direction.
3. The method of claim 1 , wherein the non-convex solder joint is a concave solder joint.
4. The method of claim 1 , wherein the non-convex solder joint is a straight solder joint.
5. The method of claim 1 , wherein the surface mount circuit component is a quad flat no-lead (QFN) package.
6. The method of claim 1 , wherein the PCB pad is a copper material.
7. The method of claim 1 , wherein a maximum principal stress level exerted by the non-convex solder joint is less than or equal to 42 megapascal (MPa).
8. The method of claim 7 , wherein the maximum principal stress level exerted by a concave solder joint is approximately equal to 30 MPa.
9. The method of claim 1 , wherein a width of the solder paste is 0.2 millimeters (mm) prior to the reflow process.