Gate oxide formation for fin field-effect transistor
A variety of applications can include devices implementing one or more fin field-effect transistors (FinFETs) with gate oxide thickness that address thicker gate oxide quality with minimum material loss in the fins of the FinFETs for high voltage devices. The gate oxides can be fabricated with thicker oxides than gate oxides of FinFETs used with capacitors in memory cells of memory arrays. These gate oxides can be formed as oxide liners by oxidation with use of a protective liner to maintain uniform composition of material for the fin during FinFET processing.
1. A method of forming a device having a fin field-effect transistor, the method comprising:
forming a protective liner on an oxide liner with the oxide liner disposed on and contacting sides and top of a fin, the fin disposed extending from a substrate for the fin;
forming gap fill material in gaps about the protective liner, including on the protective liner;
removing a portion of the gap fill material in the gaps, revealing a portion of a combination of the fin with the oxide liner on the fin and the protective liner on the oxide liner;
removing the protective liner from the oxide liner of the revealed portion; portion, and maintaining the oxide liner on and contacting the sides and top of the fin; and
forming a gate for the fin field-effect transistor adjacent the oxide liner, after removing the protective liner from the oxide liner of the revealed portion.
2. The method of claim 1 , wherein the method includes forming the gate above a level of a remaining portion of the fin with the oxide liner on the fin and the protective liner on the oxide liner, the remaining portion formed from removing the portion of the gap fill material.
3. The method of claim 1 , wherein the protective liner is a dielectric nitride.
4. The method of claim 1 , wherein the method includes:
forming a high-k dielectric on the oxide liner, after removing the protective liner from the oxide liner of the revealed portion; and
forming the gate on the high-k dielectric.
5. The method of claim 1 , wherein the method includes, prior to formation of the oxide liner on the fin:
forming the fin between shallow trench isolation regions; and
etching the shallow trench isolation regions.
6. The method of claim 1 , wherein the method includes, after forming the gap fill material in the gaps, subjecting the gap fill material to chemical mechanical planarization prior to removing the portion of the gap fill material.
7. The method of claim 1 , wherein the method includes forming the oxide liner disposed on the fin by oxidation.
8. The method of claim 7 , wherein forming the oxide liner disposed on the fin by oxidation includes forming the oxide liner by in situ steam generation.
9. A method of forming a device having a fin field-effect transistor, the method comprising:
removing shallow trench isolation regions contacting a fin, the fin disposed extending from a substrate for the fin, leaving an oxide layer on a top surface of the fin and a nitride layer on the oxide layer;
removing the oxide layer and the nitride layer from the top surface of the fin;
forming an oxide liner on the fin by oxidation;
forming a protective liner on the oxide liner;
forming gap fill material on the protective liner in gaps about the fin;
removing a portion of the gap fill material in the gaps about the fin, revealing a portion of a combination of the fin with the oxide liner on the fin and the protective liner on the oxide liner;
removing the protective liner from the oxide liner of the revealed portion; and
forming a gate for the fin field-effect transistor adjacent the oxide liner, after removing the protective liner from the oxide liner of the revealed portion.
10. The method of claim 9 , wherein the method includes forming the gate above a level of a remaining portion of the fin with the oxide liner on the fin and the protective liner on the oxide liner, the remaining portion formed from removing the portion of the gap fill material in the gaps.
11. The method of claim 9 , wherein the protective liner is a dielectric nitride.
12. The method of claim 9 , wherein the method includes:
forming a high-k dielectric on the oxide liner, after removing the protective liner from the oxide liner of the revealed portion; and
forming the gate on the high-k dielectric.
13. The method of claim 9 , wherein forming the oxide liner on the fin by oxidation includes forming the oxide liner on the fin by rapid thermal oxidation.
14. The method of claim 9 , wherein forming the oxide liner on the fin by oxidation provides the fin with a uniform composition, the uniform composition defined by the oxidation of the oxide liner.
15. The method of claim 1 , wherein the protective liner on and contacting the top of the fin is composed of a material different from material of the protective liner on and contacting the sides of the fin.
16. The method of claim 1 , wherein the oxide liner includes silicon oxide.
17. The method of claim 1 , wherein the method includes forming the fin field-effect transistor in a peripheral region to a memory array of a memory device.
18. The method of claim 9 , wherein the protective liner is formed by chemical vapor deposition or atomic layer deposition.
19. The method of claim 9 , wherein the fin includes silicon.
20. The method of claim 9 , wherein the method includes:
forming the fin field-effect transistor in a peripheral region to a memory array of a dynamic random-access memory; and
forming the oxide liner on the fin by oxidation in the peripheral region with a thickness that is thick relative to gate oxides for fin field-effect transistors for memory cell capacitors of the random-access memory.