Substrate processing apparatus, substrate processing method, and article manufacturing method
A substrate processing apparatus that can radiate light on a composition in an optimum radiation amount based on acquired spectral sensitivity characteristics can be provided. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate includes a first radiation unit configured to radiate first light onto the substrate, a dispenser configured to apply the composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance.
1. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing apparatus comprising:
a first radiation unit configured to radiate first light onto the substrate;
a dispenser configured to apply the composition to a first position inside the substrate processing apparatus;
a template holding unit configured to hold a template to be brought in contact with the composition on the substrate;
a spectrometer configured to measure spectral sensitivity characteristics of the composition applied to the first position by the dispenser; and
a controller configured to control a radiation amount of the first light radiated from the first radiation unit based on the spectral sensitivity characteristics of the composition measured in advance by the spectrometer.
2. The substrate processing apparatus according to claim 1 , further comprising:
a second radiation unit configured to radiate second light to the composition applied to the first position,
wherein the spectrometer measures light from the composition, and then the spectrometer acquires the spectral sensitivity characteristics of the composition.
3. The substrate processing apparatus according to claim 2 , further comprising an illuminance sensor configured to measure an illuminance of the first light.
4. The substrate processing apparatus according to claim 1 , wherein the spectrometer includes:
a diffractive element configured to split light from the composition; and
an illuminance sensor configured to measure an illuminance of light split by the diffractive element.
5. The substrate processing apparatus according to claim 1 , wherein, after the spectrometer measures the spectral sensitivity characteristics of the composition, the controller causes:
the dispenser to apply the composition to a second position on the substrate; and then
the first radiation unit to radiate the first light to the composition while bringing a mold in contact with the composition applied to the second position.
6. The substrate processing apparatus according to claim 5 , wherein, after the composition is applied to the second position on the substrate, the controller brings the mold in contact with each of a plurality of areas of the composition at the second position, then repeats an operation of radiating the first light, and controls the radiation amount of the first light to be radiated to the composition for each of the areas.
7. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing apparatus comprising:
a first radiation unit configured to radiate first light onto the substrate;
a dispenser configured to apply the composition to a first position inside the substrate processing apparatus;
a template holding unit configured to hold a template to be brought in contact with the composition on the substrate;
a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance; and
a measurement plate on which the composition is applied disposed at a different position from a substrate stage holding and moving the substrate.
8. A substrate processing method for a substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing method comprising:
radiating, using a first radiation unit, first light onto the composition on the substrate;
applying, with a dispenser, the composition to a first position inside the substrate processing apparatus;
contacting, with a template holding unit, a template with the composition on the substrate;
measuring, with a spectrometer, spectral sensitivity characteristics of the composition applied to the first position in the applying; and
controlling, with a controller, a radiation amount of the first light radiated onto the substrate in the radiating based on spectral sensitivity characteristics of the composition that are measured in advance in the measuring.
9. An article manufacturing method performed using a substrate processing apparatus including a first radiation unit configured to radiate first light onto a substrate, a dispenser configured to apply a composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, a spectrometer configured to measure spectral sensitivity characteristics of the composition applied to the first position by the dispenser, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance by the spectrometer, the article manufacturing method comprising:
forming a pattern on the substrate;
processing the substrate on which the pattern has been formed; and
manufacturing an article from the processed substrate.