Substrate processing apparatus, substrate processing method, and article manufacturing method
A substrate processing apparatus that can radiate light on a composition in an optimum radiation amount based on acquired spectral sensitivity characteristics can be provided. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate includes a first radiation unit configured to radiate first light onto the substrate, a dispenser configured to apply the composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance.
1 . A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing apparatus comprising:
a first radiation unit configured to radiate first light onto the substrate;
a dispenser configured to apply the composition to a first position inside the substrate processing apparatus;
a template holding unit configured to hold a template to be brought in contact with the composition on the substrate; and
a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics, which are measured by a spectrometer, of the composition applied to the first position by the dispenser,
wherein the dispenser applies the composition to the first position, which is on a measurement plate disposed on a substrate stage configured to move while holding the substrate.
2 . The substrate processing apparatus according to claim 1 , further comprising:
the spectrometer,
wherein the controller controls the radiation amount of the first light radiated from the first radiation unit based on the spectral sensitivity characteristics of the composition measured by the spectrometer.
3 . The substrate processing apparatus according to claim 2 , wherein:
a second radiation unit radiates second light to the composition applied to the first position,
the spectrometer measures light from the composition, and then acquires the spectral sensitivity characteristics of the composition.
4 . The substrate processing apparatus according to claim 3 , further comprising an illuminance sensor configured to measure an illuminance of the first light.
5 . The substrate processing apparatus according to claim 2 , wherein the spectrometer includes:
a diffractive element configured to split light from the composition; and
an illuminance sensor configured to measure an illuminance of light split by the diffractive element.
6 . The substrate processing apparatus according to claim 2 , wherein, after the spectrometer measures the spectral sensitivity characteristics of the composition, the controller causes:
the dispenser to apply the composition to a second position on the substrate; and then
the first radiation unit to radiate the first light to the composition while bringing a mold in contact with the composition applied to the second position.
7 . The substrate processing apparatus according to claim 6 , wherein, after the composition is applied to the second position on the substrate, the controller brings the mold in contact with each of a plurality of areas of the composition at the second position, then repeats an operation of radiating the first light, and controls the radiation amount of the first light to be radiated to the composition for each of the areas.
8 . The substrate processing apparatus according to claim 1 , further comprising a planarization apparatus configured to form a planarized pattern using the composition on the substrate by bringing a planarized surface of a mold in contact with the composition on the substrate.
9 . The substrate processing apparatus according to claim 1 , wherein the first light is for curing the composition.
10 . A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing apparatus comprising:
a radiation unit configured to radiate light onto the substrate;
a dispenser configured to apply the composition to a position inside the substrate processing apparatus;
a template holding unit configured to hold a template to be brought in contact with the composition on the substrate; and
a controller configured to:
control a radiation amount of the light to be radiated by the radiation unit based on spectral sensitivity characteristics, which are measured by a spectrometer, of the composition applied to the position by the dispenser; and
measure wavelength characteristics of the light of the radiation unit.
11 . The substrate processing apparatus according to claim 10 , wherein the controller controls the radiation amount of the light based on the wavelength characteristics of the light.
12 . A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate, the substrate processing apparatus comprising:
a radiation unit configured to radiate light onto the substrate;
a dispenser configured to apply the composition to a position inside the substrate processing apparatus;
a template holding unit configured to hold a template to be brought in contact with the composition on the substrate; and
a controller configured to control:
a radiation amount of the light to be radiated by the radiation unit based on spectral sensitivity characteristics, which are measured by a spectrometer, of the composition applied to the position by the dispenser; and
at least one of a light illuminance intensity of the light of the radiation unit or a radiation time in which the light is radiated to the composition.
13 . An article manufacturing method that is performed using a substrate processing apparatus including a radiation unit configured to radiate light onto a substrate, a dispenser configured to apply the composition to a position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the light to be radiated by the radiation unit based on spectral sensitivity characteristics, which are measured by a spectrometer, of the composition applied to the position by the dispenser, and wherein the dispenser applies the composition to the position, which is on a measurement plate disposed on a substrate stage configured to move while holding the substrate, the article manufacturing method comprising:
a pattern formation step of forming a pattern on the substrate;
a processing step of processing the substrate on which the pattern has been formed in the pattern formation step; and
a step of manufacturing an article from the substrate processed in the processing step.