Method for manfacturing semiconductor device for reducing partcle-induced defects
A method for manufacturing a semiconductor structure including the following steps is provided. First, a first insulating layer with a conductive contact is formed over a substrate, and a second insulating layer having an opening is formed on the first insulating layer, wherein the opening corresponds to and exposes a top surface of the conductive contact. A conductive line structure is formed in the opening, wherein a contact void is formed between the second insulating layer and the conductive line structure, and then a plasma oxide layer is conformally deposited over the substrate. Then, a wet cleaning process is performed by using an aqueous solution containing negatively charged ions. A capping layer is formed on the plasma oxide layer, the capping layer filling the contact void, and an etching back process to remove the capping layer above the contact void.
1. A method for manufacturing a semiconductor structure, comprising:
forming a first insulating layer over a substrate;
forming a conductive contact in the first insulating layer;
forming a second insulating layer having an opening on the first insulating layer, the opening exposing a top surface of the conductive contact;
forming a conductive line structure in the opening of the second insulating layer, the conductive line structure covering a portion of the exposed top surface of the conductive contact thereby forming a contact void between the second insulating layer and the conductive line structure;
forming a plasma oxide layer to cover exposed surfaces of the conductive line structure, the second insulating layer, and the conductive contact;
performing a wet cleaning process by using an aqueous solution containing negatively charged ions;
forming a capping layer over the plasma oxide layer, the capping layer filling the contact void; and
performing an etching back process to remove the capping layer above the contact void.
2. The method of claim 1 , wherein the negatively charged ions are selected from the group consisting of carbonate ions, bicarbonate ions, and combinations thereof.
3. The method of claim 1 , wherein the aqueous solution containing negatively charged ions are selected from the group consisting of deionized water dissolved with carbon dioxide, deionized water dissolved with sodium carbonate, deionized water dissolved with sodium bicarbonate, and combinations thereof.
4. The method of claim 1 , wherein the etching back process is performed by using a wet etchant comprising phosphorus acid.
5. The method of claim 4 , wherein the phosphorus acid comprises silicate ions.
6. The method of claim 1 , wherein forming a second insulating layer having an opening on the first insulating layer comprises:
forming a second insulating layer on the first insulating layer; and
forming an opening in the second insulating layer to expose a top surface of the opening contact, wherein a width of the opening is greater than a width of the top surface of the conductive contact.
7. The method of claim 6 , wherein a top surface of the conductive contact is fully exposed by the opening.
8. The method of claim 1 , wherein the contact void surrounds the conductive line structure.
9. The method of claim 1 , wherein prior to forming the plasma oxide layer, the method further comprises conformally depositing a nitride spacer layer over the substrate.
10. The method of claim 9 , wherein the plasma oxide layer is conformally disposed on the nitride spacer layer.
11. The method of claim 1 , wherein prior to performing the wet cleaning process, the plasma oxide layer comprises a plurality of positively charged ions on the surface thereof.
12. The method of claim 11 , wherein after performing the wet cleaning process, the plasma oxide layer is free of positively charged ions on the surface thereof.
13. The method of claim 1 , wherein the etching back process is performed by using the plasma oxide layer as an etch stop layer.
14. The method of claim 13 , wherein after performing the etching back process to remove the capping layer above the contact void, the plasma oxide layer is free of crystalline silicate particles on the surface thereof.