IP Library Granted Patent US 12,342,458
Granted Patent B2
US 12,342,458 · App. 17/743,393 · Granted Jun 24, 2025

Lead finger for printed circuit board

Inventors: Uthayarajan A/L Rasalingam (Penang Island, MY); Muhammad Afif Bin Abu Hussein (Penang Island, MY)
Assignee: Sandisk Technologies, Inc.
H05K1/117H01R12/721H01R12/724H05K2201/10189
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Quick Facts
Patent No.
US 12,342,458
App. No.
17/743,393
Granted
Jun 24, 2025
Kind
B2
Abstract

A lead finger has a v-shaped contact point and a u-shaped profile. The u-shaped profile includes a portion that is disposed below a top surface of a PCB. The v-shaped contact point aids in guiding a host connector clip to an ideal location of the lead finger, where the ideal location may allow for more contact surface area and better contact to the host connector clip. The u-shaped profile may reduce impact force of the host connector clip to the lead finger.

Claims (36)

1. A printed circuit board (PCB), comprising:

a plurality of lead fingers disposed on a body of the PCB, wherein each lead finger comprises:

a first side;

a second side;

a third side, wherein the second side is substantially parallel to the third side;

a fourth side coupled to the second side, wherein the fourth side is disposed at a first angle from the second side;

a fifth side coupled to the third side, wherein the fifth side is disposed at a second angle from the third side;

a groove portion;

a first portion coupled to the groove portion by a first slanted portion; and

a second portion coupled to the groove portion by a second slanted portion.

2. The PCB of claim 1 , wherein:

the first slanted portion is disposed at a third angle from a bottom edge of the groove portion; and

the second slanted portion is disposed at a fourth angle from the bottom edge of the groove portion, wherein the third angle and the fourth angle are substantially similar.

3. The PCB of claim 2 , wherein:

the third angle and the fourth angle are between about 40 degrees and about 45 degrees.

4. The PCB of claim 1 , wherein a height of the groove is between about 0.000254 mm and about 0.001778 mm.

5. The PCB of claim 1 , wherein a width of the groove is equal to about 15% greater than a width of a host connection clip.

6. The PCB of claim 1 , wherein the groove has a u-shaped cross-section.

7. The PCB of claim 1 , wherein:

the second side and the third side have a first length, wherein the first length is equal to a sum of a second length and a third length; and

the third length is a depth of an opening formed by a coupling of the fourth side to the second side, and a coupling of the fifth side to the third side.

8. The PCB of claim 1 , wherein each lead finger of the plurality of lead fingers is disposed at an angle between about 75 degrees and about 105 degrees relative to a male-end edge of the PCB body.

9. The PCB of claim 1 , wherein a distance between adjacent lead fingers of the plurality of lead fingers is between about 0.3 mm and about 0.5 mm.

10. A printed circuit board (PCB), comprising:

a plurality of lead fingers disposed on a body of the PCB, wherein each lead finger comprises a groove formed by:

a groove portion having a first thickness;

a first slanted portion coupled to the groove portion;

a first portion coupled to the first slanted portion;

a second slanted portion coupled to the groove portion; and

a second portion coupled to the second slanted portion, wherein:

a thickness of the first and second portions are the same; and

the thickness of the groove portion is substantially different from the thickness of the first and the second portions.

11. The PCB of claim 10 , wherein a lead finger of the plurality of lead fingers includes at least one of an electrically conductive material or a metal plated with an electrically conductive material.

12. The PCB of claim 10 , wherein the groove is partially disposed therethrough the body.

13. The PCB of claim 11 , wherein the groove is u-shaped, and wherein a height of the groove is based on a thickness of the at least one electrically conductive material or the metal plating with the electrically conductive material.

14. The PCB of claim 10 , wherein a lead finger of the plurality of lead fingers further comprises a first side, a second side, and a third side, wherein the first side is substantially perpendicular to the second side and third side.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2022
From: RASALINGAM, UTHAYARAJAN A/L; HUSSEIN, MUHAMMAD AFIF BIN ABU
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059903/0962 →