IP Library Granted Patent US 12,353,257
Granted Patent B2
US 12,353,257 · App. 17/746,090 · Granted Jul 8, 2025

Storage device energy recycling and cooling

Inventors: Cono J. Sammarco (San Jose, CA); Gurjit Chadha (San Jose, CA)
Assignee: Sandisk Technologies, Inc.
G06F1/20H02N99/00
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Quick Facts
Patent No.
US 12,353,257
App. No.
17/746,090
Granted
Jul 8, 2025
Kind
B2
Abstract

Various devices, such as storage devices or storage systems are configured to recycle heat generated during normal operation. This recycled heat can be captured and converted into electricity that can be stored for later discharge and use. The recycling can be done through a variety of energy recycling modules that can be placed on various components within a storage device. These energy recycling modules can be a series of semiconductors that utilize various natural effects to convert heat applied on one side of the module into electricity that can be delivered to various power storing components or used in other areas of the storage device or system. These energy recycling modules can include versions that act as a generator of electricity by capturing heat, or as a component that actively cools via received power. These modules can be placed on heat-generating components within a storage device, such as a processor.

Claims (52)

1. A storage device comprising a plurality of components, including:

a processor;

a memory array comprising a plurality of memory devices;

an energy recycling module, wherein the energy recycling module is disposed on top of the plurality of components; and

a controller configured to:

determine amount of received power from a host-computing device;

enable the energy recycling module to capture excess heat generated from the plurality of components;

convert the captured heat into an amount of electricity;

store the converted electricity in a power storing component within the storage device; and

determine whether an event has occurred, wherein the event is based on one or more of a thermal temperature reading, received operations from the host-computing device, and a level of stored charge;

discharge the stored electricity from the power storing component in response to determining that the event has occurred, wherein the event is based on a received operation from the host-computing device; and

utilize the discharged electricity to power the energy recycling module to generate a cooling surface, whereby the energy recycling module is configured to lower an operating temperature of at least one of the plurality of components.

2. The storage device of claim 1 , wherein the energy recycling module is disposed on the processor.

3. The storage device of claim 1 , wherein the energy recycling module is disposed on at least a portion of the memory array.

4. The storage device of claim 1 , wherein the storage device further includes a casing that encloses the plurality of components.

5. The storage device of claim 4 , wherein the energy recycling module is integrated into the casing.

6. The storage device of claim 4 , wherein the energy recycling module is encased within the casing with the plurality of components.

7. The storage device of claim 1 , wherein the energy recycling module is configured to use Peltier effect to utilize electricity to cool at least one of the plurality of components; and

the energy recycling module is configured to use Seebeck effect to generate electricity.

8. The storage device of claim 1 , wherein the energy recycling module is a thermo-electric cooler.

9. The storage device of claim 8 , wherein the stored electricity is utilized to cool one or more components of the plurality of components.

10. The storage device of claim 1 , wherein the energy recycling module is a thermo-electric generator.

11. The storage device of claim 10 , wherein the stored electricity is utilized to power one or more components of the plurality of components.

12. The storage device of claim 1 , wherein the storage device is configured with at least one temperature sensor.

13. The storage device of claim 1 , wherein the storage device is configured with two or more energy recycling modules.

14. The storage device of claim 13 , wherein the storage device operates each of the two or more energy recycling modules based on temperatures in two or more zones within the storage device.

15. A storage system comprising:

a plurality of storage devices;

at least one energy recycling module disposed on each of the storage devices;

wherein the at least one energy recycling module is connected to a power storing component; and

wherein each of the storage devices comprises at least:

a plurality of components;

a processor;

a memory array comprising a plurality of memory devices;

a controller configured to:

determine an amount of received power from a host-computing device;

enable the at least one energy recycling module to capture heat generated from the plurality of components;

convert the captured heat into an amount of electricity;

store the converted electricity in the power storing component within the storage device;

determine whether an event has occurred, wherein the event is based on one or more of a thermal temperature reading, received operations from the host-computing device, and a level of stored charge;

discharge the stored electricity from the power storing component in response to determining that the event has occurred, wherein the event is based on a received operation from the host-computing device; and

utilize the discharged electricity to power the energy recycling module to generate a cooling surface, whereby the at least one energy recycling module is configured to lower an operating temperature of at least one of the plurality of components.

16. A method for recycling energy within a storage device, comprising:

determining power being received from a host-computing device to operate the storage device, wherein the storage device comprises a memory array and a plurality of memory devices;

enabling an energy recycling module disposed on one or more components of the storage device to capture heat generated from the one or more components;

receiving electricity from one or more power sources to generate a cooling surface, whereby the energy recycling module is configured to lower an operating temperature of the one or more components;

converting the captured heat into an amount of electricity;

storing the converted electricity in a power storing component within the storage device;

determining whether an event has occurred, wherein the event is based on one or more of a thermal temperature reading, received operations from the host-computing device, and a level of stored charge; and

discharging the stored electricity from the power storing component in response to determining that the event has occurred, wherein the event is based on a received operation from the host-computing device; and

utilizing the discharged electricity to generate the cooling surface, whereby the at least one energy recycling module is configured to lower the operating temperature of the at least one of the plurality of components.

17. The method of claim 16 , wherein the stored electricity is utilized to provide power to one or more components of the storage device.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: SAMMARCO, CONO J.; CHADHA, GURJIT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059930/0198 →
Continuity (1)
Related Publication 20230376087A1 · Nov 23, 2023
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