IP Library Granted Patent US 12,038,797
Granted Patent B2
US 12,038,797 · App. 17/746,402 · Granted Jul 16, 2024

Avoiding ungraceful shutdowns in storage devices

Inventors: Cono J. Sammarco (San Jose, CA); Gurjit Chadha (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
G06F1/206G06F11/1441
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,038,797
App. No.
17/746,402
Granted
Jul 16, 2024
Kind
B2
Abstract

Various devices, such as storage devices or storage systems are configured to avoid ungraceful shutdowns utilizing recycled power. Storage devices typically generate heat during normal operations. Energy recycling modules disposed on various components of the storage device recycle this heat. This recycled heat can be captured and converted into electricity that can be stored for later discharge and use. These energy recycling modules can be a series of semiconductors that utilize various natural effects to convert heat applied on one side of the module into electricity that can be delivered to various power storing components. The stored power can be utilized in the event of a sudden power loss in order to power one or more components necessary to perform a graceful shutdown. In this way, even when power is totally cut off from the storage device, there is enough stored recycled electricity that an ungraceful shutdown can be avoided.

Claims (46)

1. A device comprising a plurality of components, including:

a processor;

a memory array comprising a plurality of memory devices;

an energy recycling module, wherein the energy recycling module is disposed on top of one or more components; and

an ungraceful shutdown prevention logic configured to:

enable the energy recycling module to capture heat generated from the one or more components;

convert the captured heat into an amount of electricity;

store the converted electricity within the device;

receive a signal associated with a potential ungraceful shutdown; and

utilize, in response to the received signal, the stored electricity, wherein the stored electricity is utilized in one or more components to avoid an ungraceful shutdown within the device.

2. The device of claim 1 , wherein the energy recycling module is disposed on the processor.

3. The device of claim 1 , wherein the energy recycling module is disposed on at least a portion of the memory array.

4. The device of claim 1 , wherein the device further includes a casing that encloses the plurality of components.

5. The device of claim 4 , wherein the energy recycling module is integrated into the casing.

6. The device of claim 4 , wherein the energy recycling module is encased within the casing with the other plurality of components.

7. The device of claim 1 , wherein the energy recycling module is a thermo-electric generator.

8. The device of claim 7 , wherein the energy recycling module utilizes the Seebeck effect.

9. The device of claim 1 , wherein signal is received from a component configured to transmit a signal upon loss of power to the device.

10. The device of claim 1 , wherein signal is received from a component configured to transmit a signal upon a predetermined drop in power to the device.

11. The device of claim 1 , wherein the converted electricity is stored in one or more capacitors.

12. The device of claim 11 , wherein the converted electricity undergoes a second conversion prior to being stored within the one or more capacitors.

13. The device of claim 12 , wherein the second conversion is a change in voltage.

14. The device of claim 13 , wherein the change in voltage is achieved through at least a buck-boost converter.

15. The device of claim 1 , wherein the device is configured with two or more energy recycling modules.

16. The device of claim 15 , wherein the device operates each of the two or more energy recycling modules based on temperature differences in two or more zones within the device.

17. A system comprising:

a plurality of storage devices;

at least one energy recycling module disposed on each of the storage devices;

wherein each storage device comprises at least:

a processor;

a memory array comprising a plurality of memory devices; and

an ungraceful shutdown prevention logic configured to:

enable the at least one energy recycling module to capture heat generated from one or more components;

convert the captured heat into an amount of electricity;

store the converted electricity within that storage device;

communicate with at least one other storage device within the system;

receive a signal associated with a potential ungraceful shutdown, wherein the ungraceful shutdown is associated with another storage device within the system; and

utilize, in response to the received signal, the stored electricity, wherein the stored electricity is utilized in one or more components to avoid an ungraceful shutdown within a storage device.

18. A method for recycling energy within a storage device, comprising:

enabling an energy recycling module disposed on one or more components of the storage device to capture heat generated from the one or more components;

converting the captured heat into an amount of electricity;

storing the converted electricity within the storage device;

receiving a signal associated with a potential ungraceful shutdown; and

utilizing, in response to the received signal, the stored electricity, wherein the stored electricity is utilized in one or more components to avoid an ungraceful shutdown within the storage device.

19. The method of claim 18 , wherein the energy recycling module is a thermo-electric generator configured to utilize the Seebeck effect.

20. The method of claim 18 , wherein the ungraceful shutdown avoidance comprises storing in-flight data into one or more memory devices within the storage device.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: SAMMARCO, CONO J.; CHADHA, GURJIT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059934/0094 →