Granted Patent B2

US 12,243,793 · App. 17/750,026 · Granted Mar 4, 2025

Inventors: Nadav Tsur (Bet Herut, IL); Yair Sommer (Even Yehuda, IL)

Assignee: Sandisk Technologies, Inc.

H01L23/32B65D25/56B65D83/0805B65D2585/86

Abstract

Claims (38)

1. An integrated circuit (IC) device container comprising:

a cartridge part comprising:

a plurality of faces, and

a device housing slot recessed from at least one of the faces, each slot configured to house at least one IC device; and

a lid part rotatably coupled with the cartridge, the lid part comprising a window recess configured to align with each device housing slot for accessing a corresponding IC device.

2. The container of claim 1 , wherein at least one of the plurality of faces is configured as a lock face without a corresponding device housing slot recessed from the lock face.

3. The container of claim 1 , wherein the window recess is configured for accessing the corresponding IC device translated from the device housing slot to the window recess.

4. The container of claim 1 , wherein the cartridge part further comprises a respective groove extending inward from a corresponding face and intersecting with each device housing slot.

5. The container of claim 4 , wherein each groove and corresponding device housing slot intersect to form a T-shape extending along a height of the cartridge part.

6. The container of claim 4 , wherein each groove is configured to provide visibility to the corresponding device housing slot.

7. The container of claim 1 , comprising a number n of faces and a number n−1 of corresponding device housing slots.

8. The container of claim 1 , wherein at least one device housing slot is configured to house a plurality of IC devices.

9. The container of claim 1 , wherein each device housing slot is configured having an equal width.

10. The container of claim 1 , wherein a first device housing slot is configured having a first width and a second device housing slot is configured having a different second width.

11. A method comprising:

inserting at least one first integrated circuit (IC) chip into a first slot recessed from a first side surface of a plurality of sides of a carrier cartridge component of an IC container assembly; and

rotating an access lid component, relative to the carrier cartridge component, away from a first open position corresponding to the first slot to a lock position.

12. The method of claim 11 , further comprising:

rotating the access lid component relative to the carrier cartridge component to the first open position;

urging the at least one first IC chip from the first slot of the carrier cartridge component into a recessed receiver window of the access lid component; and

removing the at least one first IC chip from the receiver window.

13. The method of claim 11 , further comprising:

inserting at least one second IC chip into a second slot recessed from a second side surface of the plurality of sides of the carrier cartridge component;

rotating the access lid component relative to the carrier cartridge component to the first open position;

urging the at least one first IC chip into a recessed receiver window of the access lid component;

removing the at least one first IC chip from the receiver window;

rotating the access lid component relative to the carrier cartridge component to the second open position;

urging the at least one second IC chip into the recessed receiver window; and

removing the at least one second IC chip from the receiver window.

14. The method of claim 13 , wherein a first width of the first slot is different from a second width of the second slot.

15. The method of claim 13 , wherein a first width of the first slot is same as a second width of the second slot.

16. The method of claim 11 , further comprising:

prior to rotating the access lid component to the lock position, inserting a second IC chip into the first slot;

rotating the access lid component relative to the carrier cartridge component to the first open position;

urging the second IC chip into a recessed receiver window of the access lid component;

removing the second IC chip from the receiver window;

urging the first IC chip into the recessed receiver window; and

removing the first IC chip from the receiver window.

Assignments (8)

Continuity (1)

References Cited (9)