Manufacturing metal inlays for dual interface metal cards
A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.
1. A contactless communication device, comprising:
an antenna structure including a coil defining an interior region; and
at least one isolated portion within the interior region, wherein each of the at least one isolated portion is electrically conductive, and wherein the at least one isolated portion does not overlap the coil.
2. The contactless communication device of claim 1 , wherein the at least one isolated portion comprises a plurality of isolated portions.
3. The contactless communication device of claim 2 , wherein the plurality of isolated portions is formed of a same material as the antenna structure.
4. The contactless communication device of claim 2 , wherein the plurality of isolated portions includes at least four isolated portions.
5. The contactless communication device of claim 2 , wherein the plurality of isolated portions includes at least seventy-nine isolated portions.
6. The contactless communication device of claim 2 , wherein the plurality of isolated portions are configured to adjust a resonance frequency of the antenna structure.
7. The contactless communication device of claim 1 , wherein at least one of the plurality of isolated portions comprises at least one of a different size or a different shape from at least one other of the plurality of isolated portions.
8. The contactless communication device of claim 2 , wherein the resonance frequency of the antenna structure changes when a user touches the plurality of isolated portions.
9. The contactless communication device of claim 2 , wherein the plurality of isolated portions comprises a majority of surface area in the interior region.
10. The contactless communication device of claim 9 , wherein the plurality of isolated portions comprises at least 90% of surface area in the interior region.
11. The contactless communication device of claim 1 wherein the plurality of isolated portions is formed in a same layer with the antenna structure.
12. A contactless communication device, comprising:
a chip;
an antenna structure electrically connected to the chip, wherein the antenna structure includes a coil defining an interior region; and
a plurality of isolated portions within the interior region, wherein each of the plurality of isolated portions is electrically conductive, and wherein the plurality of isolated portions is formed in a same layer and of a same material with the antenna structure, and wherein the plurality of isolated portions do not overlap the coil.
13. The contactless communication device of claim 12 , wherein the chip, the antenna structure, and the plurality of isolated portions are included in a transponder chip module.
14. The contactless communication device of claim 13 , wherein the transponder chip module further comprises a plurality of contact pads electrically connected to the chip.
15. The contactless communication device of claim 14 , wherein the transponder chip module further comprises a module tape, wherein the contact pads are positioned above the module tape, and wherein the chip, the antenna structure, and the plurality of isolated portions are positioned below the module tape.
16. The contactless communication device of claim 15 , further comprising a coupling frame including a slit extending from an inner region of the coupling frame to a peripheral location of the coupling frame.
17. The contactless communication device of claim 16 , wherein the coupling frame includes a module opening configured to receive at least a portion of the transponder chip module, and wherein the slit extends from the module opening to the peripheral location of the coupling frame.
18. The contactless communication device of claim 17 , wherein the coupling frame at least partially overlaps the antenna structure.
19. The contactless communication device of claim 12 , wherein the plurality of isolated portions are configured to adjust a resonance frequency of the antenna structure.
20. The contactless communication device of claim 12 , wherein the plurality of isolated portions comprises at least 90% of surface area in the interior region.