Nitride semiconductor device
A nitride semiconductor device includes: a substrate; a nitride semiconductor layer above the substrate; a high-resistance layer above the nitride semiconductor layer; a p-type nitride semiconductor layer above the high-resistance layer; a first opening penetrating through the p-type nitride semiconductor layer and the high-resistance layer to the nitride semiconductor layer; an electron transport layer and an electron supply layer covering an upper portion of the p-type nitride semiconductor layer and the first opening; a gate electrode above the electron supply layer; a source electrode in contact with the electron supply layer; a second opening penetrating through the electron supply layer and the electron transport layer to the p-type nitride semiconductor layer; a potential fixing electrode in contact with the p-type nitride semiconductor layer at a bottom part of the second opening; and a drain electrode.
1. A nitride semiconductor device comprising:
a substrate;
a first nitride semiconductor layer above the substrate;
a first high-resistance layer above the first nitride semiconductor layer, the first high-resistance layer having a resistance higher than a resistance of the first nitride semiconductor layer;
a first p-type nitride semiconductor layer above the first high-resistance layer;
a first opening penetrating through the first p-type nitride semiconductor layer and the first high-resistance layer to the first nitride semiconductor layer;
an electron transport layer and an electron supply layer provided in stated order from a substrate side, the electron transport layer and the electron supply layer covering an upper portion of the first p-type nitride semiconductor layer and the first opening;
a gate electrode above the electron supply layer and covering the first opening;
a source electrode away from the gate electrode and in contact with the electron supply layer;
a second opening penetrating through the electron supply layer and the electron transport layer to the first p-type nitride semiconductor layer;
a potential fixing electrode in contact with the first p-type nitride semiconductor layer at a bottom part of the second opening; and
a drain electrode below the substrate.
2. The nitride semiconductor device according to claim 1 ,
wherein the first high-resistance layer is a GaN layer containing carbon.
3. The nitride semiconductor device according to claim 1 ,
wherein the first high-resistance layer is an undoped GaN layer.
4. The nitride semiconductor device according to claim 1 ,
wherein the potential fixing electrode includes a material in Schottky contact with the first p-type nitride semiconductor layer.
5. The nitride semiconductor device according to claim 1 ,
wherein a contact portion of the first p-type nitride semiconductor layer which is in contact with the potential fixing electrode has a thickness greater than or equal to 50 percent of a thickness of a non-contact portion of the first p-type nitride semiconductor layer which is not in contact with the potential fixing electrode, and
the thickness of the non-contact portion is greater than or equal to 400 nm.
6. The nitride semiconductor device according to claim 1 , further comprising:
a second p-type nitride semiconductor layer between the gate electrode and the electron supply layer.
7. The nitride semiconductor device according to claim 1 , further comprising:
a second high-resistance layer above the first p-type nitride semiconductor layer, the second high-resistance layer having a resistance higher than a resistance of the first p-type nitride semiconductor layer,
wherein the first opening further penetrates through the second high-resistance layer, and the electron transport layer and the electron supply layer cover an upper portion of the second high-resistance layer.
8. The nitride semiconductor device according to claim 1 ,
wherein the potential fixing electrode is electrically connected to the source electrode.
9. A nitride semiconductor device comprising:
a substrate;
a first nitride semiconductor layer above the substrate;
a first p-type nitride semiconductor layer above the first nitride semiconductor layer;
a first opening penetrating through the first p-type nitride semiconductor layer to the first nitride semiconductor layer;
an electron transport layer and an electron supply layer provided in stated order from a substrate side, the electron transport layer and the electron supply layer covering an upper portion of the first p-type nitride semiconductor layer and the first opening;
a gate electrode above the electron supply layer and covering the first opening;
a source electrode away from the gate electrode and in contact with the electron supply layer;
a second opening penetrating through the electron supply layer and the electron transport layer to the first p-type nitride semiconductor layer;
a potential fixing electrode in contact with the first p-type nitride semiconductor layer at a bottom part of the second opening; and
a drain electrode below the substrate,
wherein the potential fixing electrode includes a material in Schottky contact with the first p-type nitride semiconductor layer.
10. A nitride semiconductor device comprising:
a substrate;
a first nitride semiconductor layer above the substrate;
a first p-type nitride semiconductor layer above the first nitride semiconductor layer;
a first opening penetrating through the first p-type nitride semiconductor layer to the first nitride semiconductor layer;
an electron transport layer and an electron supply layer provided in stated order from a substrate side, the electron transport layer and the electron supply layer covering an upper portion of the first p-type nitride semiconductor layer and the first opening;
a gate electrode above the electron supply layer and covering the first opening;
a source electrode away from the gate electrode and in contact with the electron supply layer;
a second opening penetrating through the electron supply layer and the electron transport layer to the first p-type nitride semiconductor layer;
a potential fixing electrode in contact with the first p-type nitride semiconductor layer at a bottom part of the second opening; and
a drain electrode below the substrate, wherein:
a contact portion of the first p-type nitride semiconductor layer which is in contact with the potential fixing electrode has a thickness greater than or equal to 50 percent of a thickness of a non-contact portion of the first p-type nitride semiconductor layer which is not in contact with the potential fixing electrode,
the thickness of the non-contact portion is greater than or equal to 400 nm, and
the potential fixing electrode includes a material in Schottky contact with the first p-type nitride semiconductor layer.