Semiconductor device
A semiconductor device having a novel structure is provided. The semiconductor device includes a p-channel transistor and an n-channel transistor provided over a silicon substrate. One of a source and a drain of the p-channel transistor is electrically connected to a first power supply line, one of a source and a drain of the n-channel transistor is electrically connected to a second power supply line, and the other of the source and the drain of the p-channel transistor is connected to the other of the source and the drain of the n-channel transistor. The p-channel transistor includes a first gate electrode and a first back gate electrode provided to face the first gate electrode with a first channel formation region therebetween. The first back gate electrode is formed using a region where an impurity element imparting conductivity is selectively introduced to the silicon substrate. The n-channel transistor is provided above a layer including the p-channel transistor.
1. A semiconductor device comprising:
a p-channel transistor and a first n-channel transistor provided over a silicon substrate,
wherein one of a source and a drain of the p-channel transistor is electrically connected to a first power supply line, one of a source and a drain of the first n-channel transistor is electrically connected to a second power supply line, and the other of the source and the drain of the p-channel transistor is electrically connected to the other of the source and the drain of the first n-channel transistor,
wherein the p-channel transistor comprises a first gate electrode and a first back gate electrode provided to face the first gate electrode with a first channel formation region therebetween,
wherein the first back gate electrode is electrically connected to one of a source and a drain of a second n-channel transistor,
wherein the second n-channel transistor comprises a semiconductor layer including a metal oxide,
wherein the first back gate electrode is formed using a region where an impurity element imparting conductivity is selectively introduced to the silicon substrate,
wherein the first n-channel transistor comprises a second gate electrode and a second back gate electrode provided to face the second gate electrode with a second channel formation region therebetween,
wherein the first n-channel transistor is provided above a layer comprising the p-channel transistor, and
wherein a potential supplied to the first back gate electrode is different from a potential supplied to the second back gate electrode.
2. The semiconductor device according to claim 1 , wherein the second channel formation region comprises a metal oxide.
3. The semiconductor device according to claim 2 , wherein the metal oxide comprises In, Ga, and Zn.
4. The semiconductor device according to claim 1 , wherein a potential supplied to the first back gate electrode is higher than a potential supplied to the second back gate electrode.