IP Library › Granted Patent US 9,972,395
Granted Patent B2
US 9,972,395 · App. 14/875,533 · Granted May 15, 2018

Row and column decoders comprising fully depleted silicon-on-insulator transistors for use in flash memory systems

Inventors: Hieu Van Tran (San Jose, CA); Anh Ly (San Jose, CA); Thuan Vu (San Jose, CA); Hung Quoc Nguyen (Fremont, CA)
Assignee: Silicon Storage Technology, Inc.
G11C16/14G11C7/065G11C8/08G11C16/08G11C16/10G11C16/26G11C16/28H01L27/112G11C2216/04
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Quick Facts
Patent No.
US 9,972,395
App. No.
14/875,533
Granted
May 15, 2018
Kind
B2
Abstract

The present invention relates to a flash memory system wherein one or more circuit blocks utilize fully depleted silicon-on-insulator transistor design to minimize leakage.

Claims (37)

1. A flash memory system comprising:

an array of flash memory cells arranges into rows and columns; and

a row decoder for selecting a row of flash memory cells in the array for a read or program operation, the row decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors and one or more fully depleted silicon-on-insulator PMOS transistors;

wherein each of the one or more fully depleted silicon-on-insulator NMOS transistors comprises an n-well under a buried oxide layer and coupled to a first dynamic voltage source that provides a forward body bias or a reverse body bias to the NMOS transistor; and

wherein each of the one or more fully depleted silicon-on-insulator PMOS transistors comprises a p-well under a buried oxide layer and coupled to a second dynamic voltage source that provides a forward body bias or a reverse body bias to the PMOS transistor.

2. The flash memory system of claim 1 , wherein the flash memory cells comprise source side injection flash memory cells.

3. The flash memory system of claim 2 , wherein each source side injection flash memory cell comprises:

an erase gate to provide erasing;

a coupling gate; and

a source line to provide programming current.

4. The flash memory system of claim 1 , wherein the row decoder comprises:

a row driver comprising a PMOS transistor comprising a p-well underneath a channel and coupled to the first dynamic voltage source that provides a forward body bias or a reverse body bias to the PMOS transistor and an NMOS transistor with an n-well underneath a channel and coupled to the second dynamic voltage source that provides a forward body bias or a reverse body bias to the NMOS transistor.

5. The flash memory system of claim 4 wherein the row decoder further comprises:

a row pre-driver comprising a PMOS transistor comprising a p-well underneath a channel and a NMOS transistor comprising an n-well underneath a channel.

6. The flash memory system of claim 5 , wherein the row pre-driver further comprises a decoding PMOS transistor with a p-well underneath a channel.

7. The flash memory system of claim 1 wherein the row decoder further comprises a NAND gate and an INVERTER gate comprising a PMOS transistor comprising a p-well underneath a channel and an NMOS transistor comprising an n-well underneath channel.

8. A flash memory system comprising:

an array of flash memory cells arranges into rows and columns; and

a row decoder for selecting a row of flash memory cells in the array for a read or write operation, the row decoder comprising one or more fully depleted silicon-on-insulator NMOS transistors and one or more fully depleted silicon-on-insulator PMOS transistors;

wherein the row decoder comprises:

one or more fully depleted silicon-on-insulator NMOS transistors comprising a p-well under a buried oxide layer and coupled to a first dynamic voltage source that provides a forward body bias or a reverse body bias to the NMOS transistor; and

one or more fully depleted silicon-on-insulator PMOS transistors comprising an n-well under a buried oxide layer and coupled to a second dynamic voltage source that provides a forward body bias or a reverse body bias to the PMOS transistor.

9. The flash memory system of claim 8 , wherein the row decoder comprises:

a row driver comprising a PMOS transistor and an NMOS transistor comprising an n-well underneath a channel.

10. The flash memory system of claim 9 , wherein the row decoder further comprises: a row pre-driver comprising a row address decoder comprising a NAND gate comprising a p-well underneath a channel and an INVERTER gate comprising an n-well underneath a channel.

11. The flash memory system of claim 9 , wherein the row decoder further comprises a row pre-driver comprising a PMOS transistor and an NMOS transistor comprising a p-well underneath a channel.

12. The flash memory system of claim 9 , wherein the row pre-driver further comprises a decoding PMOS transistor with an n-well underneath a channel.

13. The flash memory system of claim 9 wherein the row pre-driver further comprises a row address decoder comprising a NAND gate with p-well underneath a channel and an INVERTER gate comprising an n-well underneath a channel.

14. A flash memory system comprising:

an array of flash memory cells arranges into rows and columns; and

a column decoder for selecting a column of flash memory cells in the array for a read or write operation, the column decoder comprising:

a plurality of fully depleted silicon-on-insulator NMOS transistors each comprising a p-well under a buried oxide layer for column de-selection and coupled to a first dynamic voltage source that provides a forward body bias or a reverse body bias to the NMOS transistor; and

a plurality of fully depleted silicon-on-insulator NMOS transistors each comprising an n-well under a buried oxide layer for column selection and coupled to a second dynamic voltage source that provides a forward body bias or a reverse body bias to the NMOS transistor.

15. The flash memory system of claim 14 , wherein the memory cells comprise source side injection flash memory cells, each comprising:

an erase gate to provide erasing;

a coupling gate; and

a source line to provide programming current.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2015
From: TRAN, HIEU VAN; VU, THUAN; LY, ANH; NGUYEN, HUNG QUOC
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 036870/0217 →
Continuity (1)
Related Publication 20170098474A1 · Apr 6, 2017