Cladding structure in the back end of line of photonics chips
IC chips for photonics applications are disclosed. An example IC chip includes a substrate, an optical component above the substrate, and a first connection level above the substrate. The first connection level includes the optical component and a first cladding structure, in which the optical component is covered by the first cladding structure. The IC chip also includes a second connection level on the first connection level. The second connection level includes a first interlayer dielectric material. The IC chip further includes a second cladding structure directly above the optical component. The second cladding structure has at least a section within the second connection level. The second cladding structure is on the first cladding structure. The second cladding structure is laterally adjacent to and in direct contact with the first interlayer dielectric material. The second cladding structure includes a material different from the first interlayer dielectric material.
1 . An integrated circuit (IC) chip comprising:
a substrate;
an optical component above the substrate;
an active layer above the substrate;
a transistor on the active layer, the transistor includes a source or drain region;
a contact structure on the source or drain region;
a first connection level above the substrate, the first connection level includes the optical component, the transistor, the contact structure, and a first cladding structure, wherein the optical component is covered by the first cladding structure;
a second connection level on the first connection level, the second connection level includes a conductive line, the conductive line is disposed directly on the contact structure in the first connection level;
a third connection level on the second connection level;
a fourth connection level on the third connection level, the third connection level and the fourth connection level include an interlayer dielectric material;
a second cladding structure directly above the optical component, the second cladding structure having at least a section within the second connection level, the second cladding structure is directly on the first cladding structure, wherein the second cladding structure includes a material different from the interlayer dielectric material in the third and the fourth connection levels;
a photonics region above the substrate, the photonics region includes an edge coupler section and a waveguide section, wherein the optical component is positioned in the photonics region;
a third cladding structure on the second cladding structure, the third cladding structure is positioned in the photonics region, wherein the third cladding structure is positioned within the edge coupler section and not present in the waveguide section, and the second cladding structure extends laterally across the edge coupler section and the waveguide section; and
a logic region above the substrate, wherein the transistor, the contact structure, and the conductive line are positioned in the logic region.
2 . The IC chip of claim 1 , wherein the second cladding structure is within the second connection level.
3 . The IC chip of claim 2 , wherein the second cladding structure is positioned within the photonics region.
4 . The IC chip of claim 1 , wherein the second cladding structure has a lower section in the second connection level, a middle section in the third connection level, and an upper section in the fourth connection level, and wherein the second cladding structure is positioned within the photonics region.
5 . The IC chip of claim 4 , wherein the second connection level includes an interlayer dielectric material, and wherein the second cladding structure includes a material different from the interlayer dielectric material in the second connection level.
6 . The IC chip of claim 5 , wherein the interlayer dielectric material in the second connection level is laterally adjacent to and in direct contact with the lower section of the second cladding structure, and wherein the interlayer dielectric material in the third and the fourth connection levels is laterally adjacent to and in direct contact with the middle section and the upper section of the second cladding structure.
7 . The IC chip of claim 1 , wherein the third cladding structure has a width, the second cladding structure has a width, and the width of the third cladding structure is different from the width of the second cladding structure, and the second cladding structure is vertically between the first cladding structure and the third cladding structure.
8 . The IC chip of claim 7 , further comprising an optical fiber directly adjacent to the edge coupler section and the third cladding structure, wherein the optical component is a waveguide and the optical fiber is in lateral alignment with the waveguide.
9 . The IC chip of claim 7 , wherein the substrate includes a cavity, the cavity is positioned within the photonics region, and the edge coupler section is aligned vertically above the cavity.
10 . The IC chip of claim 1 , wherein the transistor includes a gate in the first connection level, and the optical component is positioned above the gate.
11 . The IC chip of claim 1 , wherein the first cladding structure extends from the photonics region to the logic region, the first cladding structure is positioned over the transistor, and the contact structure is in the first cladding structure.
12 . An IC chip comprising:
a substrate;
an active layer above the substrate;
a transistor on the active layer, the transistor includes a source or drain region;
a contact structure on the source or drain region;
an optical component above the substrate;
a first connection level above the substrate, the first connection level includes the optical component, the transistor, the contact structure, and a first cladding structure, wherein the optical component is covered by the first cladding structure;
a second connection level on the first connection level, the second connection level includes a first interlayer dielectric material level, and a conductive line, wherein the conductive line in the second connection level is disposed directly on the contact structure in the first connection level;
a second cladding structure directly above the optical component, the second cladding structure having at least a section within the second connection level, the second cladding structure is directly on the first cladding structure, the second cladding structure is laterally adjacent to and in direct contact with the first interlayer dielectric material, wherein the second cladding structure includes a material different from the first interlayer dielectric material;
a photonics region above the substrate, the photonics region includes an edge coupler section and a waveguide section, wherein the optical component is positioned in the photonics region;
a third cladding structure on the second cladding structure, the third cladding structure is positioned in the photonics region, wherein the third cladding structure is positioned within the edge coupler section and not present in the waveguide section, and the second cladding structure extends laterally across the edge coupler section and the waveguide section; and
a logic region above the substrate, wherein the transistor, the contact structure, and the conductive line are positioned in the logic region.
13 . The IC chip of claim 12 , wherein the third cladding structure has a width, the second cladding structure has a width, and the width of the third cladding structure is smaller than the width of the second cladding structure.
14 . The IC chip of claim 13 , further comprising:
a third connection level on the second connection level; and
a fourth connection level on the third connection level, wherein the second cladding structure extends through the third connection level and terminates in the fourth connection level.
15 . The IC chip of claim 14 , wherein the second cladding structure has a first section in the second connection level, a second section in the third connection level, and a third section in the fourth connection level.
16 . The IC chip of claim 14 , further comprising a second interlayer dielectric material in the third connection level and the fourth connection level, the second interlayer dielectric material is laterally adjacent to and in direct contact with the second cladding structure, wherein the second cladding structure includes a material different from the second interlayer dielectric material.
17 . The IC chip of claim 13 , wherein the second cladding structure is within the second connection level.