Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
An integrated circuit device includes a substrate, and a first interlayer dielectric layer on the substrate that includes a first conductive layer and a second conductive layer. The integrated circuit device also includes a first conductive stack including a third conductive layer coupled to a portion of the second conductive layer with a first via. The integrated circuit device further includes a second conductive stack comprising a fourth conductive layer directly on a portion of the third conductive layer that is isolated from the substrate. The integrated circuit device also includes a second interlayer dielectric layer surrounding the third conductive layer and the fourth conductive layer.
1. An integrated circuit device, comprising:
a substrate;
a first interlayer dielectric layer on the substrate comprising a first conductive layer and a second conductive layer;
a first conductive stack comprising a third conductive layer coupled to a portion of the first conductive layer in which a first via couples the third conductive layer to the portion of the first conductive layer, in which the first conductive stack is not isolated from the substrate;
a second conductive stack comprising a fourth conductive layer directly on a portion of the third conductive layer that is isolated from the substrate; and
a second interlayer dielectric layer surrounding the third conductive layer and the fourth conductive layer.
2. The integrated circuit device of claim 1 , further comprising:
a third conductive stack comprising the third conductive layer coupled to a portion of the first conductive layer with a second via.
3. The integrated circuit device of claim 2 , further comprising:
a seed layer on the first interlayer dielectric layer that is coupled to the first conductive layer.
4. The integrated circuit device of claim 1 , in which the first conductive layer and the second conductive layer comprise at least a first plate and a second plate of a metal-insulator-metal (MIM) capacitor.
5. The integrated circuit device of claim 1 , further comprising:
a seed layer on the first interlayer dielectric layer that is coupled to the second conductive layer.
6. The integrated circuit device of claim 1 incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.
7. An integrated circuit device, comprising:
a substrate;
a first interlayer dielectric layer on the substrate comprising a first conductive means and a second conductive means;
a first conductive stack comprising a third conductive means coupled to a portion of the first conductive means, in which a first via couples the third conductive means to the portion of the first conductive means, in which the first conductive stack is not isolated from the substrate;
a second conductive stack comprising a fourth conductive means directly on a portion of the third conductive means that is isolated from the substrate; and
a second interlayer dielectric layer surrounding the third conductive means and the fourth conductive means.
8. The integrated circuit device of claim 7 , further comprising:
a third conductive stack comprising the third conductive means coupled to a portion of the first conductive means with a second via.
9. The integrated circuit device of claim 8 , further comprising:
a seed layer on the first interlayer dielectric layer that is coupled to the first conductive means.
10. The integrated circuit device of claim 7 , in which the first conductive means and the second conductive means comprise at least a first plate and a second plate of a metal-insulator-metal (MIM) capacitor.
11. The integrated circuit device of claim 7 , further comprising:
a seed layer on the first interlayer dielectric layer that is coupled to the second conductive means.
12. The integrated circuit device of claim 7 incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.