Cut EPI process and structures
A device includes a substrate, an isolation structure over the substrate, and two fins extending from the substrate and above the isolation structure. Two source/drain structures are over the two fins respectively and being side by side along a first direction generally perpendicular to a lengthwise direction of the two fins from a top view. Each of the two source/drain structures has a near-vertical side, the two near-vertical sides facing each other along the first direction. A contact etch stop layer (CESL) is disposed on at least a lower portion of the near-vertical side of each of the two source/drain structures. And two contacts are disposed over the two source/drain structures, respectively, and over the CESL.
1. A device, comprising:
a substrate;
an isolation structure over the substrate;
two fins extending from the substrate and above the isolation structure;
two source/drain structures over the two fins respectively and being side by side along a first direction generally perpendicular to a lengthwise direction of the two fins from a top view, each of the two source/drain structures having a near-vertical side, the two near-vertical sides facing each other along the first direction;
a contact etch stop layer (CESL) disposed on at least a lower portion of the near-vertical side of each of the two source/drain structures; and
two contacts disposed over the two source/drain structures, respectively, and over the CESL,
wherein the isolation structure includes a dip between the two source/drain structures and the CESL is also disposed on a surface of the dip.
2. The device of claim 1 , wherein each of the two source/drain structures further includes a sloped side, wherein the sloped side and the near-vertical side of each of the two source/drain structures are on opposing sides of the fin where the respective source/drain structure is grown.
3. The device of claim 2 , wherein the CESL is also disposed on the sloped sides of the two source/drain structures.
4. The device of claim 2 , wherein each of the contacts extends lower on the near-vertical side than on the sloped side of the respective source/drain structure.
5. The device of claim 1 , further comprising:
silicide layers disposed on at least an upper portion of the near-vertical side of each of the two source/drain structures, wherein the contacts are disposed on the silicide layers.
6. The device of claim 1 , further comprising fin sidewall spacers, wherein each of the two source/drain structures extend through a space between two opposing fin sidewall spacers.
7. The device of claim 6 , wherein the CESL is also disposed on sidewalls of the fin sidewall spacers.
8. The device of claim 2 , wherein the sloped side of each of the two source/drain structures has a continuous curved profile.
9. A device, comprising:
a substrate;
an isolation structure over the substrate;
two fins extending from the substrate and surrounded by the isolation structure;
two source/drain structures over the two fins respectively, each of the two source/drain structures having a bottom portion and a top portion;
a contact etch stop layer (CESL) disposed on each of the two source/drain structures; and
two contacts directly over and electrically connected to the two source/drain structures, respectively,
wherein the bottom portion of each of the source/drain structures extends below a top surface of the isolation structure,
wherein the top portion of each of the source/drain structures has a sloped surface and a near-vertical surface on two sides of the respective fin, and the near-vertical surfaces of the two source/drain structures face each other.
10. The device of claim 9 , further comprising:
a silicide layer between each of the source/drain structures and the respective contact.
11. The device of claim 9 , wherein the top portion of each of the source/drain structures has a shape that is asymmetric with respect to a plane going through a centerline of the respective fin.
12. The device of claim 9 , wherein in a cross-sectional view cut perpendicular to a lengthwise direction of the fins, each of the contacts extends from a first point on the respective near-vertical surface to a second point on the respective sloped surface, wherein the first point is lower than the second point.
13. The device of claim 9 , further comprising an inter-level dielectric layer over the CESL and between the near-vertical surfaces of the two source/drain structures.
14. The device of claim 9 , wherein the isolation structure includes a dip between the two source/drain structures and the CESL is also disposed on a surface of the dip.
15. The device of claim 9 , wherein each of the two source/drain structures has an outer layer over an inner layer, and the inner layer includes a higher dopant concentration than the outer layer.
16. The device of claim 15 , wherein a distance between a centerline of one of the two fins to the outer layer of the one of the two fins is greater than half of a fin pitch between the two fins.
17. A device, comprising:
a substrate;
first and second fins protruding out of the substrate, each of the first and the second fins extending lengthwise along a first direction and spaced apart from each other along a second direction perpendicular to the first direction;
an isolation structure over the substrate and disposed between the first fin and the second fin;
first and second source/drain structures over the first and the second fins respectively, each of the first and the second source/drain structures having a sloped surface and a near-vertical surface, thereby presenting a shape that is asymmetric with respect to a plane going through a centerline of the respective fin;
a contact etch stop layer (CESL) disposed directly on a first portion of each of the first and the second source/drain structures;
silicide layers disposed directly on a second portion of each of the first and the second source/drain structures;
contacts directly over and contacting the silicide layers; and
an inter-level dielectric layer over and in direct contact with the CESL and between the near-vertical surfaces of the two source/drain structures, and the inter-level dielectric layer directly interfaces the contacts,
wherein the near-vertical surfaces of the two source/drain structures face each other.
18. The device of claim 17 , wherein the CESL is also disposed directly on the isolation structure.
19. The device of claim 17 , wherein along the second direction, a spacing between the near-vertical surface of the first fin to a centerline of the first fin is smaller than a spacing between the sloped surface of the first fin to the centerline of the first fin.
20. The device of claim 19 , wherein along the second direction, a spacing between the near-vertical surface of the second fin to a centerline of the second fin is smaller than a spacing between the sloped surface of the second fin to the centerline of the second fin.