Semiconductor devices having highly integrated capacitors therein
A semiconductor device includes a vertical stack of ring-shaped electrodes that are electrically connected together into a top electrode of a capacitor, on a semiconductor substrate. A bottom electrode of the capacitor is also provided, which extends vertically in a direction orthogonal to a surface of the substrate and through centers of the vertical stack of ring-shaped electrodes. An electrically insulating bottom supporting pattern is provided, which extends between a lowermost one of the ring-shaped electrodes and an intermediate one of the ring-shaped electrodes.
1. A semiconductor device, comprising:
bottom electrodes on a substrate;
a bottom supporting pattern extending between the bottom electrodes;
a top supporting pattern on the bottom electrodes, said top supporting pattern including a first portion, which is provided on top surfaces of the bottom electrodes, and a second portion, which is provided to fill an internal space within each of the bottom electrodes;
a top electrode covering the bottom electrodes, the bottom supporting pattern, and the top supporting pattern; and
a dielectric layer interposed between the bottom electrodes and the top electrode, between the bottom supporting pattern and the top electrode, and between the top supporting pattern and the top electrode.
2. The device of claim 1 , wherein the top supporting pattern further includes a third portion between the first portion and the second portion; and wherein a side surface of the third portion is aligned to an outer sidewall of each of the bottom electrodes.
3. The device of claim 2 , wherein a width of the third portion is smaller than or equal to an upper width of each of the bottom electrodes.
4. The device of claim 2 , wherein the top surfaces of the bottom electrodes are located at a level lower than a bottom surface of the first portion.
5. The device of claim 4 , wherein a height difference between the top surfaces of the bottom electrodes and the bottom surface of the first portion ranges from about 10 Å to about 150 Å.
6. The device of claim 2 , wherein a thickness of the third portion is smaller than a thickness of the first portion.
7. The device of claim 1 , wherein the top surfaces of the bottom electrodes are located at the same level as a bottom surface of the first portion.
8. The device of claim 1 , wherein the top supporting pattern further comprises a third portion between the first portion and the second portion; and wherein a side surface of the third portion is spaced apart from an outer sidewall of each of the bottom electrodes.
9. The device of claim 8 , wherein a width of the third portion is larger than an upper width of each of the bottom electrodes.
10. The device of claim 1 , wherein as a distance from the substrate increases, a width of the second portion increases and then decreases.
11. The device of claim 1 , wherein the second portion is overlapped with the bottom supporting pattern in a horizontal direction.
12. The device of claim 1 , wherein each of the top surfaces of the bottom electrodes has a doughnut shape when viewed from a plan perspective relative to a surface of the substrate.
13. The device of claim 1 , further comprising a middle supporting pattern extending between the bottom supporting pattern and the top supporting pattern.
14. The device of claim 13 , wherein the bottom supporting pattern and the middle supporting pattern enclose and contact an outer sidewall of each of the bottom electrodes.
15. A semiconductor device, comprising:
bottom electrodes on a substrate;
a bottom supporting pattern extending between the bottom electrodes;
a top supporting pattern on the bottom electrodes;
a top electrode covering the bottom electrodes, the bottom supporting pattern, and the top supporting pattern; and
a dielectric layer extending between the bottom electrodes and the top electrode, between the bottom supporting pattern and the top electrode, and between the top supporting pattern and the top electrode;
wherein each of the bottom electrodes includes a horizontal portion and a vertical portion, which is vertically extended from the horizontal portion;
wherein the horizontal portion and the vertical portion define an internal space of each of the bottom electrodes;
wherein the top supporting pattern covers top surfaces of the bottom electrodes; and
wherein at least a portion of the top supporting pattern extends into the internal space of each of the bottom electrodes.
16. The device of claim 15 , wherein the horizontal portion is located at a level lower than the bottom supporting pattern.
17. The device of claim 15 , wherein the bottom supporting pattern and the top supporting pattern comprise at least one material selected from a group consisting of silicon nitride, SiBN, and SiCN.
18. The device of claim 15 , wherein a side surface of the dielectric layer adjacent to the top supporting pattern and a side surface of the top electrode adjacent the top supporting pattern have a stepwise shape.
19. A semiconductor device, comprising:
a substrate having an active pattern therein;
an impurity region within the active pattern;
a word line that crosses the active pattern;
a bit line that crosses the word line;
a storage node contact electrically connected to the impurity region;
a landing pad electrically connected to the storage node contact;
a bottom electrode electrically connected to the landing pad;
a bottom supporting pattern and a top supporting pattern, which are provided between the bottom electrode and another bottom electrode adjacent thereto, when viewed from a plan perspective;
a top electrode covering the bottom electrode, the bottom supporting pattern, and the top supporting pattern; and
a dielectric layer extending between the bottom electrode and the top electrode, between the bottom supporting pattern and the top electrode, and between the top supporting pattern and the top electrode; and
wherein the top supporting pattern includes a first portion on a top surface of the bottom electrode and a second portion that fills an internal space within the bottom electrode.
20. The device of claim 19 ,
wherein the top supporting pattern further includes a third portion extending between the first portion and the second portion;
wherein a side surface of the third portion is aligned to an outer sidewall of the bottom electrode; and
wherein a top surface of the bottom electrode is located at a level lower than a bottom surface of the first portion.