Electron beam inspection apparatus
In one embodiment, an electron beam inspection apparatus includes an optical system irradiating a substrate with primary electron beams, a beam separator separating, from the primary electron beams, secondary electron beams emitted as a result of irradiating the substrate with the primary electron beams, a detector detecting the secondary electron beams separated, a movable stage on which the substrate is placed, a support base supporting the substrate on the stage, and an applying unit applying a first voltage to the substrate. The support base includes a plurality of support pins that support the substrate from below. The support pins each include a columnar insulator and a metal film disposed in the insulator. A second voltage is applied to the metal film.
1. An electron beam inspection apparatus comprising:
an optical system irradiating a substrate with primary electron beams;
a beam separator separating, from the primary electron beams, secondary electron beams emitted as a result of irradiating the substrate with the primary electron beams;
a detector detecting the secondary electron beams separated;
a movable stage on which the substrate is placed;
a support base supporting the substrate on the stage; and
an applying unit applying a first voltage to the substrate,
wherein the support base includes a plurality of support pins that support the substrate from below,
the support pins each include a columnar insulator and a metal film disposed in the insulator, and
a second voltage is applied to the metal film.
2. The apparatus according to claim 1 , wherein the first voltage and the second voltage are equal.
3. The apparatus according to claim 1 , wherein the metal film is covered with the insulator.
4. The apparatus according to claim 3 , wherein the metal film is disposed to extend in a direction orthogonal to a height direction of the support pin, and
a gap between a side surface of the support pin and an end portion of the metal film is greater than or equal to 0.3 mm and less than or equal to 2 mm.
5. The apparatus according to claim 3 , wherein the insulator includes a base portion with a recess in an upper surface thereof and a tip portion with a protrusion in a lower surface thereof, and the protrusion is fitted in the recess, and
the metal film is disposed between a bottom surface of the recess and a lower end surface of the protrusion.
6. The apparatus according to claim 1 , wherein the metal film is disposed to extend in a direction orthogonal to a height direction of the support pin; and
a wire for voltage application extends vertically from a lower surface of the metal film.
7. The apparatus according to claim 6 , wherein the support base includes a plate-like mount,
the support pin protrudes upward from the mount, and
a height of the metal film from a principal surface of the mount is greater than or equal to 30% of a height of the support pin.
8. The apparatus according to claim 7 , wherein the height of the support pin is greater than or equal to 15 mm and less than or equal to 30 mm.
9. The apparatus according to claim 1 , wherein the support pins are columnar members, each having a convex surface at an upper end thereof.
10. The apparatus according to claim 9 , wherein the support pins each include
a tip portion having a flat circular bottom surface, a peripheral side surface extending upward from an outer edge of the bottom surface, and the convex surface extending continuously from an upper end of the periphery, and
a columnar base portion.
11. The apparatus according to claim 10 , wherein the tip portion has a first metal film on the bottom surface thereof, the base portion has a second metal film on an upper surface thereof, and the first metal film is joined to the second metal film.
12. The apparatus according to claim 10 , wherein the bottom surface of the tip portion is bonded to an upper surface of the base portion with a conductive adhesive.