Array dependent voltage compensation in a memory device
The memory device that includes a die with a CMOS wafer with programming and erasing circuitry. The die also includes a plurality of array wafers coupled with and in electrical communication with the CMOS wafer and having different programming and erasing efficiencies. Each of the array wafers includes memory blocks with memory cells. The control circuitry of the CMOS wafer is configured to output at least one of different initial programming voltages and unique erase voltages to the plurality of array wafers.
1. A memory device, comprising:
a die including a CMOS wafer that includes programming and erasing circuitry;
a plurality of array wafers coupled with and in electrical communication with the CMOS wafer, the plurality of array wafers including memory blocks with memory cells;
the plurality of array wafers including a first array wafer that is bonded with the CMOS layer and a second array wafer that is bonded with the first array wafer on an opposite side of the first array wafer from the CMOS layer, the first array wafer having high programming and erasing efficiencies, and the second array wafer having low programming and erasing efficiencies; and
the programming and erasing circuitry of the CMOS wafer being configured to output at least one of different initial programming voltages and unique erase voltages to the plurality of array wafers.
2. The memory device as set forth in claim 1 wherein the programming and erasing circuitry of the CMOS wafer is configured to output different initial programming voltages to the memory blocks of the first array wafer and to the memory blocks of the second array wafer during programming operations.
3. The memory device as set forth in claim 2 wherein the programming and erasing circuitry is configured to output a first initial programming voltage to the memory blocks of the first array wafer and is configured to apply a second initial programming voltage to the memory blocks of the second array wafer and wherein the second initial programming voltage has a greater magnitude than the first initial programming voltage.
4. The memory device as set forth in claim 2 wherein the different initial programming voltages that the programming and erasing circuitry is configured to output to the memory blocks of the first array wafer and to the memory blocks of the second array wafer include different programming voltages VPGMSLC for programming the memory cells to one bit per memory cell in a single pulse programming operation.
5. The memory device as set forth in claim 2 wherein the different initial programming voltages that the programming and erasing circuitry is configured to output to the memory blocks of the first array wafer and to the memory blocks of the second array wafer include different starting programming voltages VPGMU for programming the memory cells to multiple bits per memory cell in a multi-loop programming operation.
6. The memory device as set forth in claim 1 wherein the programming and erasing circuitry of the CMOS wafer is configured to output different erase voltages to the memory blocks of the first array wafer and to the memory blocks of the second array wafer during erase operations.
7. The memory device as set forth in claim 6 wherein the programming and erasing circuitry is configured to output a first erase voltage to the memory blocks of the first array wafer and to output a second erase voltage to the memory blocks of the second array wafer and wherein the first erase voltage has a greater magnitude than the second erase voltage.
8. A method of operating a memory device, comprising the steps of:
preparing a die that includes a CMOS wafer and a plurality of array wafers that are coupled with and in electrical communication with the CMOS wafer, the plurality of array wafers including memory blocks with memory cells, and the plurality of array wafers including a first array wafer and a second array wafer, the first array wafer being bonded with the CMOS layer and having high programming and erasing efficiencies, and the second array wafer being bonded with the first array wafer on an opposite side of the die from the CMOS wafer and having low programming and erasing efficiencies; and
in programming operations, with programming circuitry in the CMOS wafer, applying a first initial programming voltage to the memory blocks of the first array wafer and applying a second initial programming voltage to the memory blocks of the second array wafer, the first initial programming voltage being different than the second initial programming voltage, or
in erase operations, with erasing circuitry in the CMOS wafer, applying a first erase voltage to the memory blocks of the first array wafer and applying a second erase voltage to the memory blocks of the second array wafer, the first erase voltage being different than the second erase voltage.
9. The method as set forth in claim 8 further including the steps of in programming operations, with the programming circuitry in the CMOS wafer, applying the first initial programming voltage to the memory blocks of the first array wafer and applying the second initial programming voltage to the memory blocks of the second array wafer.
10. The method as set forth in claim 9 wherein the second initial programming voltage has a greater magnitude than the first initial programming voltage.
11. The method as set forth in claim 9 wherein the first initial programming voltage is a VPGMSLC voltage that programs the memory cells in the memory blocks of the first array in a single programming pulse, and wherein the second initial programming voltage is also a VPGMSLC voltage that programs the memory cells in the memory blocks of the second array in a single programming pulse.
12. The method as set forth in claim 9 wherein the first programming voltage is a VPGMU voltage that programs the memory cells in the memory blocks of the first array wafer in a first programming pulse of a multi-loop programming operation, and
wherein the second programming voltage is also a VPGMU voltage that programs the memory cells in the memory blocks of the second array wafer in a first programming pulse of a multi-loop programming operation.
13. The method as set forth in claim 8 further including the steps of in the erase operations, with the erasing circuitry in the CMOS wafer, applying the first erase voltage to the memory blocks of the first array wafer and applying the second erase voltage to the memory blocks of the second array wafer, the first erase voltage being different than the second erase voltage.
14. The method as set forth in claim 13 wherein the second erase voltage has a greater magnitude than the first erase voltage.