Antenna system
An antenna system comprises a substrate, an antenna positioned on the substrate, and a circuit component positioned on the substrate. The antenna is positioned on a first surface of the substrate and operable to emit a radiation pattern. The circuit component is positioned on the substrate in a null region of the radiation pattern. The thickness of portions of the substrate are modified to achieve a desired performance characteristic of the antenna.
1 . A method of fabricating an antenna system, the method comprising:
depositing an antenna on a first surface of a substrate, the antenna being configured to emit a radiation pattern having a radiation region;
positioning a circuit component on the substrate below at least a portion of the antenna outside of the radiation region;
modifying a thickness of the substrate to a desired thickness corresponding to a desired capacitance between a ground plane and the antenna, the desired capacitance being configured to help the antenna generate a predetermined fringe electric field; and
depositing the ground plane on a second surface of the substrate to obtain the desired capacitance between the ground plane and the antenna.
2 . The method of claim 1 , wherein the antenna is deposited via additive manufacturing.
3 . The method of claim 1 , wherein the thickness of the substrate is modified via at least one of laser ablation, ion milling, or etching.
4 . The method of claim 1 , further comprising a step of forming a recess on a second surface of the substrate, the second surface opposing the first surface, wherein the step of positioning the circuit component includes positioning the circuit component in the recess.
5 . The method of claim 1 , further comprising a step of forming a platform on a second surface of the substrate, the second surface opposing the first surface, wherein the step of positioning the circuit component includes positioning the circuit component on the platform.
6 . The method of claim 1 , further comprising a step of forming a chamber in the substrate below the first surface of the substrate, wherein the step of positioning the circuit component includes positioning the circuit component in the chamber.