Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling
The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L 1 and L 2 represents a C2 to C4 alkyl group, and L 3 represents O or S) in an amount of 80 mass % or more. L 1 - L 3 - L 2 (L)
1 . A semiconductor substrate cleaning method comprising removing an adhesive layer provided on a semiconductor substrate having connection portions made of a conductive material by contacting the adhesive layer with a remover composition, wherein
the adhesive layer is a film formed from an adhesive composition comprising an adhesive component(S) containing a siloxane adhesive, and the adhesive component(S) comprises a siloxane adhesive containing a polyorganosiloxane component (A) that is curable through hydrosilylation;
the remover composition contains a solvent but no salt; and
the solvent includes an organic solvent represented by formula (L) in an amount of 80 mass % or more:
L 1 - L 3 - L 2 (L)
where L 1 and L 2 each represents a C2 to C5 alkyl group, and L 3 represents O or S.
2 . The semiconductor substrate cleaning method according to claim 1 , wherein the solvent includes the organic solvent represented by formula (L) in an amount of 85 mass % or more.
3 . The semiconductor substrate cleaning method according to claim 2 , wherein the solvent is formed of the organic solvent represented by formula (L).
4 . The semiconductor substrate cleaning method according to claim 1 , wherein L 1 and L 2 are the same group.
5 . The semiconductor substrate cleaning method according to claim 4 , wherein the C2 to C5 alkyl group is an ethyl group, an n-propyl group, or an n-butyl group.
6 . The semiconductor substrate cleaning method according to claim 1 , wherein the adhesive component(S) further comprises at least one selected from an acrylic resin adhesive, an epoxy resin adhesive, a polyamide adhesive, a polystyrene adhesive, a polyimide adhesive, and a phenolic resin adhesive.