Composition for forming resist underlayer film
A composition for forming a resist underlayer film which enables to form a flat film with a favorable coating even on a so-called stepped substrate and a small film thickness difference after embedding, and also a polymer as an important component of the composition for forming a resist underlayer film, a resist underlayer film formed using the composition for forming a resist underlayer film, and a method of producing a semiconductor device. The composition for forming a resist underlayer film, includes a compound of the following Formula (1) and a solvent: (wherein, Ar 1 , Ar 2 , Ar 3 and Ar 4 are each independently a substitutable monovalent aromatic hydrocarbon group, a, b, c, and d are each 0 or 1, and a+b+c+d=1).
1 . A composition for forming a resist underlayer film, the composition comprising a compound of the following Formula (1) and a solvent:
wherein, Ar 1 , Ar 2 , Ar 3 and Ar 4 are each independently an aromatic hydrocarbon group selected from the group consisting of a phenyl group, a naphthyl group, an anthracenyl group, a pyrenyl group and combinations thereof, each being unsubstituted.
2 . The composition for forming a resist underlayer film according to claim 1 ,
wherein the solvent is a solvent having a boiling point of 160° C. or higher.
3 . A resist underlayer film which is a baked product of a coating film composed of the composition for forming a resist underlayer film according to claim 1 .
4 . A method of producing a semiconductor device, comprising:
a step of forming a resist underlayer film using the composition for forming a resist underlayer film according to claim 1 on a semiconductor substrate;
a step of forming a resist film on the formed resist underlayer film;
a step of forming a resist pattern by emitting light or an electron beam to the formed resist film and performing development;
a step of etching and patterning the resist underlayer film with the formed resist pattern; and
a step of processing the semiconductor substrate with the patterned resist underlayer film.