Vehicle, a main frame, a module pocket, an electronic module, and a printed circuit board
A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
1. A printed circuit board for an electronic vehicular component, the printed circuit board comprising:
a thermal distribution layer embedded in the printed circuit board;
one or more thermal coupling areas on a surface of the printed circuit board, the one or more thermal coupling areas comprising one or more spacer dice disposed on the surface of the printed circuit board and configured to thermally couple the thermal distribution layer to a housing surrounding the printed circuit board and to mechanically stabilize the printed circuit board within the housing;
wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board through the housing, and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
2. The printed circuit board according to claim 1 , further comprising one or more contacts for grounding the thermal distribution layer.
3. The printed circuit board according to claim 1 , wherein the thermal coupling areas are electrically coupled to the thermal distribution layer.
4. The printed circuit board according to claim 1 , further comprising one or more sensors embedded in the printed circuit board.
5. The printed circuit board according to claim 4 , wherein the one or more sensors comprise at least one of a temperature sensor, a temperature sensor with energy harvesting device, a mechanical deformation sensor, and a mechanical deformation sensor with energy harvesting device.
6. The printed circuit board according to claim 4 , wherein the one or more sensors comprise at least one combined mechanical deformation and temperature sensor.
7. The printed circuit board according to claim 1 , further comprising a grid of distributed sensors.
8. An electronic module for a vehicle comprising:
a printed circuit board, comprising
a thermal distribution layer embedded in the printed circuit board;
one or more thermal coupling areas on a surface of the printed circuit board, the one or more thermal coupling areas comprising one or more spacer dice disposed on the surface of the printed circuit board and configured to thermally couple the thermal distribution layer to a housing surrounding the printed circuit board and to mechanically stabilize the printed circuit board within the housing,
wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board through the housing and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
9. The electronic module according to claim 8 , further comprising
electronic components, mounted on the printed circuit board;
a housing for the printed circuit board with the electronic components; and
thermal interface material, configured to thermally couple the electronic components and the housing.
10. The electronic module according to claim 9 , wherein the housing is configured to shield the printed circuit board from electromagnetic radiation.
11. The electronic module according to claim 8 , further comprising one or more sensors embedded in the printed circuit board.
12. The electronic module according to claim 11 , further comprising thermal interface material configured to thermally couple at least one of the one or more spacer dice to the housing.
13. The electronic module according to claim 11 , wherein the spacer dice are configured to be grounded together with the housing.
14. The electronic module according to claim 11 , wherein the one or more spacer dice are further configured to mechanically stabilize the printed circuit board in the housing.
15. The electronic module according to claim 8 , further comprising a module connector, configured to provide an electrical coupling to the printed circuit board from the outside of the electronic module.
16. An electronic apparatus for a vehicle comprising:
a pocket module comprising two cooling blades; and
a printed circuit board coupled to the pocket module, the printed circuit board comprising
a thermal distribution layer embedded in the printed circuit board;
one or more thermal coupling areas on a surface of the printed circuit board, the one or more thermal coupling areas comprising one or more spacer dice disposed on the surface of the printed circuit board and configured to thermally couple the thermal distribution layer to a housing surrounding the printed circuit board and to mechanically stabilize the printed circuit board within the housing,
wherein the one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board through the housing, and wherein the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
17. The electronic apparatus according to claim 16 , further comprising
electronic components, mounted on the printed circuit board;
a housing for the printed circuit board with the electronic components; and
thermal interface material, configured to thermally couple the electronic components and the housing.
18. The electronic apparatus according to claim 16 , further comprising one or more sensors embedded in the printed circuit board.
19. The electronic apparatus according to claim 18 , further comprising thermal interface material configured to thermally couple at least one of the one or more spacer dice to the housing.
20. The electronic apparatus according to claim 18 , wherein the spacer dice are configured to be grounded together with the housing.