Systems and methods for suppressing sound leakage
A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
1. A speaker, comprising:
a housing;
a transducer residing inside the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing and causing a leaked sound wave spreading outside the housing from a portion of the housing;
at least one sound guiding hole located on the housing and configured to guide the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the guided sound wave having a phase different from a phase of the leaked sound wave, the guided sound wave interfering with the leaked sound wave in a target region; and
a first microphone and a second microphone disposed in the housing, wherein the first microphone and the second microphone are disposed at different positions of a circuit board.
2. The speaker of claim 1 , wherein the circuit board includes a main circuit board, and a first branch circuit board and a second branch circuit board connected to the main circuit board.
3. The speaker of claim 2 , wherein the first microphone is disposed on one end of the first branch circuit board away from the main circuit board.
4. The speaker of claim 2 , wherein the second branch circuit board extends perpendicular to the main circuit board.
5. The speaker of claim 3 , wherein the second microphone is disposed on one end of the second branch circuit board away from the main circuit board.
6. The speaker of claim 2 , wherein the first microphone and the second microphone are disposed on a same side of the circuit board.
7. The speaker of claim 1 , wherein the housing is disposed with a first sound inlet corresponding to the first microphone, and a waterproof membrane component is attached to an inner surface of the housing at a periphery of the first sound inlet.
8. The speaker of claim 7 , further comprising:
a rigid support plate pressed the waterproof membrane component on the inner surface of the housing, and the rigid support plate being disposed with a second sound inlet.
9. The speaker of claim 8 , wherein the waterproof membrane component includes a waterproof membrane body and a first annular rubber gasket disposed on one side of the waterproof membrane body towards the rigid support plate, wherein
the first annular rubber gasket is disposed on the periphery of the first sound inlet and a periphery of the second sound inlet; and
the rigid support plate is pressed against the first annular rubber gasket.
10. The speaker of claim 9 , wherein the first annular rubber gasket is arranged to form a sealed chamber communicating with the first microphone only through the second sound inlet of the rigid support plate.
11. The speaker of claim 9 , wherein the waterproof membrane component further includes a second annular rubber gasket disposed on one side of the waterproof membrane body towards the inner surface of the housing.
12. The speaker of claim 7 , wherein the housing includes an annular blocking wall integrally formed on the inner surface of the housing and disposed on the periphery of the first sound inlet, thereby defining an accommodation space connected to the first sound inlet.
13. The speaker of claim 12 , wherein the waterproof membrane component and the rigid support plate are disposed in the accommodation space.
14. The speaker of claim 8 , further comprising a pad adjacent to the first microphone, the pad being supported by the rigid support plate.
15. The speaker of claim 1 , wherein the at least one sound guiding hole includes a damping layer, the damping layer being configured to adjust the phase of the guided sound wave in the target region.
16. The speaker of claim 15 , wherein the damping layer includes tuning paper, tuning cotton, nonwoven fabric, silk, cotton, sponge, or rubber.
17. The speaker of claim 1 , wherein the guided sound wave includes at least two sound waves having different phases.
18. The speaker of claim 16 , wherein the at least one sound guiding hole includes two sound guiding holes located on the housing.
19. The speaker of claim 18 , wherein the two sound guiding holes are arranged to generate the at least two sound waves having different phases to reduce the sound pressure level of the leaked sound wave having different wavelengths.
20. The speaker of claim 1 , wherein at least a portion of the leaked sound wave whose sound pressure level is reduced is within a range of 1500 Hz to 3000 Hz.