IP Library Granted Patent US 11,972,151
Granted Patent B2
US 11,972,151 · App. 18/071,340 · Granted Apr 30, 2024

Memory device using CbA technology

Inventors: Uri Peltz (Hod Hasharon, IL); Karin Inbar (Ramat Hasharon, IL)
Assignee: Western Digital Technologies, Inc.
G06F3/0659G06F3/0604G06F3/0679G06F11/1068G06F12/10G11C16/26
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Quick Facts
Patent No.
US 11,972,151
App. No.
18/071,340
Granted
Apr 30, 2024
Kind
B2
Abstract

The present disclosure generally relates to efficiently relocating data within a data storage device. By implementing an error correction code (ECC) module in a complementary metal oxide semiconductor (CMOS) chip for each memory die within a memory array of a memory device, the data can be relocated more efficiently. The ECC decodes the codewords at the memory die. The metadata is then extracted from the decoded codewords and transferred to a controller of the data storage device. A flash translation layer (FTL) module at the controller then checks whether the data is valid by comparing the received metadata to FTL tables. If the metadata indicates the data is valid, then the data is relocated.

Claims (29)

1. A non-volatile memory device configured to be coupled to a controller that is separate and distinct from the non-volatile memory device, the non-volatile memory device comprising:

at least one memory die; and

at least one complementary metal oxide semiconductor (CMOS) device coupled to the at least one memory die, wherein the CMOS device comprises an error correction code (ECC) unit, and wherein the ECC unit comprises a flash translation layer (FTL) module, an encoder, and a decoder.

2. The non-volatile memory device of claim 1 , wherein a number of CMOS devices is equal to a number of memory dies.

3. The non-volatile memory device of claim 1 , wherein the non-volatile memory device is configured to:

decode data;

extract metadata from the decoded data; and

transfer the extracted metadata to the controller.

4. The non-volatile memory device of claim 1 , wherein the at least one memory die comprises a plurality of memory dies, wherein the at least one CMOS device comprises a plurality of CMOS devices, and wherein the plurality of memory dies and the plurality of CMOS devices are vertically arranged in an alternating fashion.

5. The non-volatile memory device of claim 1 , wherein the at least one CMOS device comprises at least one sense amplifier and at least one latch.

6. The non-volatile memory device of claim 1 , wherein the controller includes a flash translation layer (FTL) module.

7. The non-volatile memory device of claim 3 , wherein the non-volatile memory device is configured to receive results from the controller comparing the extracted metadata to data stored in a flash translation layer (FTL) table.

8. The non-volatile memory device of claim 7 , wherein the non-volatile memory device is further configured to transfer valid data to the controller in response to the comparing performed by the controller.

9. The non-volatile memory device of claim 8 , wherein the non-volatile memory device includes a plurality of dies.

10. The non-volatile device of claim 8 , wherein the non-volatile memory device is further configured to assign a new logical block address (LBA) to valid data.

11. A non-volatile memory device configured to be coupled to a controller that is separate and distinct from the non-volatile memory device, wherein the non-volatile memory device is configured to:

decode data;

extract metadata from the decoded data; and

transfer the extracted metadata to the controller, wherein the non-volatile memory device is configured to receive results from the controller comparing the extracted metadata to data stored in a flash translation layer (FTL) table, wherein the non-volatile memory device is further configured to transfer valid data to the controller in response to the comparing performed by the controller, wherein the non-volatile memory device is further configured to assign a new logical block address (LBA) to valid data, wherein the non-volatile memory device is further configured to encode a new codeword with new metadata header for the new LBA.

12. The non-volatile memory device of claim 11 , wherein the non-volatile memory device is further configured to program the new codeword to a new physical block address (PBA).

13. The non-volatile memory device of claim 12 , wherein the non-volatile memory device comprises a memory die and an error correction code (ECC) unit coupled to the memory die.

14. A non-volatile memory device configured to be coupled to a controller that is separate and distinct from the non-volatile memory device, the non-volatile memory device comprising:

means for decoding data stored in the non-volatile memory device;

means for extracting metadata from decoded data;

means for sending the extracted metadata to the controller;

at least one memory die; and

at least one complementary metal oxide semiconductor (CMOS) device coupled to the at least one memory die, wherein the at least one CMOS device comprises an error correction code (ECC) unit, and wherein the ECC unit comprises a flash translation layer (FTL) module, and an encoder.

15. The non-volatile memory device of claim 14 , further comprising sense amplifiers and latches.

16. The non-volatile memory device of claim 15 , wherein the latches are coupled to the ECC unit.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2022
From: PELTZ, URI; INBAR, KARIN
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 061922/0942 →