Granted Patent B2

US 12,588,338 · App. 18/078,103 · Granted Mar 24, 2026

Inventors: Chuan-Lan Lin (Chiayi City, TW); Yu-Ping Wang (Hsinchu City, TW); Chien-Ting Lin (Tainan City, TW); Chun-Ting Yeh (Taipei City, TW)

Assignee: UNITED MICROELECTRONICS CORP.

H10H20/857H01L25/0753H10H20/0364

Abstract

Claims (23)

1 . A method for fabricating a micro display device, comprising:

providing a wafer comprising a first area, a second area, and a third area;

forming first bonding pads on the first area;

forming second bonding pads on the second area, wherein the first bonding pads and the second bonding pads comprise different materials;

forming a chip on the second bonding pads; and

forming a micro display on the third area after forming the chip.

2 . The method of claim 1 , further comprising:

forming third bonding pads on the third area, wherein the first bonding pads and the third bonding pads comprise different materials.

3 . The method of claim 2 , wherein the second bonding pads and the third bonding pads comprise different materials.

4 . The method of claim 2 , wherein a pitch between the first bonding pads is greater than a pitch between the third bonding pads.

5 . The method of claim 1 , wherein a pitch between the first bonding pads is greater than a pitch between the second bonding pads.

6 . The method of claim 1 , wherein the first area comprises a bonding area.

7 . A micro display device, comprising:

a wafer comprising a first area, a second area, and a third area;

first bonding pads on the first area;

second bonding pads on the second area, wherein the first bonding pads and the second bonding pads comprise different materials; and

third bonding pads on the third area, wherein the first bonding pads and the third bonding pads comprise different materials.

8 . The micro display device of claim 7 , wherein the second bonding pads and the third bonding pads comprise different materials.

9 . The micro display device of claim 7 , wherein a pitch between the first bonding pads is greater than a pitch between the third bonding pads.

10 . The micro display device of claim 7 , wherein a pitch between the first bonding pads is greater than a pitch between the second bonding pads.

11 . The micro display device of claim 7 , wherein the first area comprises a bonding area.

12 . The micro display device of claim 7 , wherein the second area comprises a chip to wafer area.

13 . The micro display device of claim 7 , wherein the third area comprises a micro-display area.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (13)