IP Library Granted Patent US 12,557,435
Granted Patent B2
US 12,557,435 · App. 17/952,350 · Granted Feb 17, 2026

Electronic device

Inventors: Tzu-Min Yan (Miao-Li County, TW); Chun-Hsien Lin (Miao-Li County, TW)
Assignee: InnoLux Corporation
H10H20/01H01L25/0753H10H20/857H10H20/0364
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Quick Facts
Patent No.
US 12,557,435
App. No.
17/952,350
Granted
Feb 17, 2026
Kind
B2
Abstract

An electronic device with an active region comprising a substrate; a first conducting layer, disposed on the substrate, comprising a first pad in the active region; a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region; a first electronic component, disposed on the first pad, and electronically connected to the first pad; and a second electronic component, disposed on the second pad, and electronically connected to the second pad.

Claims (32)

1 . An electronic device with an active region, comprising:

a substrate;

a first conducting layer, disposed on the substrate, comprising a first pad in the active region;

a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region;

a first electronic component, disposed on the first pad, and electronically connected to the first pad; and

a second electronic component, disposed on the second pad, and electronically connected to the second pad;

wherein the first pad and the second pad comprise different materials.

2 . The electronic device of claim 1 , wherein a first state of the first electronic component is a normal state, and a second state of the second electronic component is a defective state; or the first state of the first electronic component is the defective state, and the second state of the second electronic component is the normal state.

3 . The electronic device of claim 1 , wherein a first thickness of the first pad and a second thickness of the second pad are different.

4 . The electronic device of claim 1 , further comprising:

a first insulating layer, disposed on the substrate, comprising a first opening overlapping with the first pad; and

a second insulating layer, disposed on the substrate, comprising a second opening overlapping with the second pad.

5 . The electronic device of claim 4 , wherein a first depth of the first opening and a second depth of the second opening are different.

6 . The electronic device of claim 4 , wherein a first aperture diameter of the first opening and a second aperture diameter of the second opening are different.

7 . A method of producing an electronic device with an active region, comprising:

providing a substrate;

forming a first conducting layer comprising a first pad in the active region, on the substrate;

forming a second conducting layer comprising a second pad in the active region, on the first conducting layer;

disposing a first electronic component on the first pad, so that the first electronic component is electronically connected to the first pad; and

disposing a second electronic component on the second pad, so that the second electronic component is electronically connected to the second pad,

wherein a first state of the first electronic component is a normal state, and a second state of the second electronic component is a defective state; or the first state of the first electronic component is the defective state, and the second state of the second electronic component is the normal state,

wherein when the first state of the first electronic component is the defective state, the method further comprises:

performing a laser cutting process, so that the first pad is in a floating state.

8 . The method of claim 7 , wherein the first electronic component is disposed on the first pad via a fluid transfer method.

9 . The method of claim 7 , wherein the second electronic component is disposed on the second pad via a pick-and-place method.

10 . An electronic device with an active region, comprising:

a substrate;

a first conducting layer, disposed on the substrate, comprising a first pad in the active region;

a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region;

a first electronic component, disposed on the first pad, and electronically connected to the first pad; and

a second electronic component, disposed on the second pad, and electronically connected to the second pad,

wherein a first thickness of the first pad and a second thickness of the second pad are different.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2022
From: YAN, TZU-MIN; LIN, CHUN-HSIEN
To: INNOLUX CORPORATION
Reel/Frame 061206/0792 →
Priority Claims (1)
CN 202111248980.3 · Oct 26, 2021 · national
Continuity (1)
Related Publication 20230132292A1 · Apr 27, 2023
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