Apparatus and method for process-window characterization
A process of characterizing a process window of a patterning process, the process including: obtaining a set of inspection locations for a pattern, the pattern defining features to be applied to a substrate with a patterning process, the set of inspection locations corresponding to a set of the features, the set of features being selected from among the features according to sensitivity of the respective features to variation in one or more process characteristics of the patterning process; patterning one or more substrates under varying process characteristics of the patterning process; and determining, for each of the variations in the process characteristics, whether at least some of the set of features yielded unacceptable patterned structures on the one or more substrates at corresponding inspection locations.
1. A method comprising:
computationally analyzing a design layout of a pattern, the pattern defining features to be applied to a substrate with a patterning process, to identify a subset of features from among the features, the subset of features being selected from among the features based on an overlay value with another feature of the substrate;
obtaining a set of inspection locations corresponding to the subset of the features;
obtaining inspection results, from the set of inspection locations, of one or more substrates patterned under variations of one or more process characteristics of the patterning process; and
determining, based primarily or exclusively on the inspection results, a process window for the patterning process.
2. The method of claim 1 , wherein the computationally analyzing the design layout of the pattern comprises:
simulating, with one or more computers, the patterning process with a plurality of different simulations, each under different process characteristics;
for each of the different simulations, detecting features that the result of the respective simulation indicates are unacceptable in in terms of overlay; and
selecting the subset of the features based on the detected features.
3. The method of claim 2 , wherein simulating comprises:
obtaining a design layout of a reticle corresponding to the pattern;
obtaining parameters of a lithographic apparatus;
selecting a set of the process characteristics of the patterning process to simulate; and
estimating, with one or more computers, dimensions of a patterned structure on a substrate under the selected set of process characteristics with a lithographic apparatus having the obtained parameters.
4. The method of claim 1 , wherein the determining the process window comprises determining the process window for at least some of the varied process characteristics based on a determination of whether at least some of the subset of the features yielded unacceptable patterned structures on the one or more substrates.
5. The method of claim 1 , wherein the obtaining inspection results comprises measuring the at least some of the subset of features at the respective locations with an electron-beam inspection tool.
6. The method of claim 1 , wherein different inspection locations are specified for different exposure fields based on process conditions corresponding to the respective exposure fields.
7. The method of claim 1 , further comprising:
ranking the features based on sensitivity to variations in one or more process characteristics; and
selecting the subset of features based on the ranking.
8. The method of claim 1 , comprising specifying an inspection metric based on sensitivity of at least some of the features to variation in a process characteristic.
9. The method of claim 1 , comprising:
determining ranges of the process characteristics that produce acceptable results; and
monitoring a patterning process by sensing whether the patterning process remains within ranges of the process characteristics.
10. Non-transitory machine-readable media storing instructions that, when executed by a data processing apparatus, are configured to cause the data processing apparatus to cause performance of at least the method of claim 1 .
11. A method comprising:
computationally analyzing a design layout of a pattern, the pattern defining features to be applied to a substrate with a patterning process, to identify a set of inspection locations corresponding to a subset of the features, the subset of features being selected as those satisfying or not satisfying a rule relating to overlay between a respective feature of the features and another feature; and
determining, based primarily or exclusively on inspection results made at the inspection locations of one or more substrates patterned under variations of one or more process characteristics of the patterning process, a process window for the patterning process.
12. The method of claim 11 , wherein the computationally analyzing the design layout of the pattern comprises:
simulating, with one or more computers, the patterning process with a plurality of different simulations, each under different process characteristics;
for each of the different simulations, detecting features that the result of the respective simulation indicates as satisfying or not satisfying the rule; and
selecting the subset of the features based on the detected features.
13. The method of claim 11 , further comprising:
ranking the features based on sensitivity to variations in one or more process characteristics; and
selecting the subset of features based on the ranking.
14. The method of claim 11 , comprising:
determining ranges of the process characteristics that produce acceptable results; and
monitoring a patterning process by sensing whether the patterning process remains within ranges of the process characteristics.
15. Non-transitory machine-readable media storing instructions that, when executed by a data processing apparatus, are configured to cause the data processing apparatus to cause performance of at least the method of claim 11 .
16. The method of claim 11 , further comprising:
ranking the features based on sensitivity to variations in one or more process characteristics; and
selecting the subset of features based on the ranking.
17. Non-transitory machine-readable media storing instructions that, when executed by a data processing apparatus, are configured to cause the data processing apparatus to cause performance of at least the method of claim 11 .
18. A method comprising:
computationally analyzing a design layout of a pattern to be applied to a substrate with a patterning process, to identify a set of inspection locations corresponding to a subset of features of the pattern that are sensitive to being defective based on analysis relating to overlay between a respective feature of the features and another feature; and
determining, based primarily or exclusively on inspection results made at the inspection locations of one or more substrates patterned under variations of one or more process characteristics of the patterning process, a process window for the patterning process.
19. The method of claim 18 , wherein the computationally analyzing the design layout of the pattern comprises:
simulating, with one or more computers, the patterning process with a plurality of different simulations, each under different process characteristics;
for each of the different simulations, detecting features that the result of the respective simulation indicates as sensitive to being defective based on analysis relating to overlay between a respective feature of the features and another feature; and
selecting the subset of the features based on the detected features.
20. The method of claim 19 , comprising:
determining ranges of the process characteristics that produce acceptable results; and
monitoring a patterning process by sensing whether the patterning process remains within ranges of the process characteristics.