Semiconductor devices and methods of manufacturing semiconductor devices
In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.
1. A semiconductor device, comprising:
a first substrate comprising:
a first conductive structure;
a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body;
a first interface dielectric over the first body; and
a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure;
a second substrate over the first substrate and comprising:
a second interface dielectric contacting the first interface dielectric;
a second body over the second interface dielectric; and
a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric;
an electronic component in the cavity; and
an underfill in the cavity between a lateral side of the electronic component and a lateral side of the first body;
wherein the second internal interconnect is coupled with the first internal interconnect at an interface between the first internal interconnect and the second internal interconnect.
2. The semiconductor device of claim 1 , wherein a width of the first internal interconnect at the interface is substantially equal to a width of the second internal interconnect at the interface.
3. The semiconductor device of claim 1 , wherein a first side of the first internal interconnect is coplanar with a first side of the first interface dielectric, and a first side of the second internal interconnect is coplanar with a first side of the second interface dielectric, and wherein the first side of the first interface dielectric contacts the first side of the second interface dielectric.
4. The semiconductor device of claim 3 , wherein the first side of the first internal interconnect contacts the first side of the second internal interconnect.
5. The semiconductor device of claim 1 , wherein the first body comprises a first inorganic material, and the first interface dielectric comprises a second inorganic material different than the first inorganic material.
6. The semiconductor device of claim 1 , wherein at least one of the first interface dielectric or the second interface dielectric comprise silicon oxide.
7. The semiconductor device of claim 1 , wherein at least one of the first interface dielectric or the second interface dielectric comprises benzocyclobutane or polyimide.
8. The semiconductor device of claim 1 , wherein at least one of the first internal interconnect or the second internal interconnect comprises copper or nickel.
9. The semiconductor device of claim 1 , further comprising an interconnecting material between the first internal interconnect and the second internal interconnect.
10. The semiconductor device of claim 1 , further comprising a gold plating on at least one of the first internal interconnect or the second internal interconnect.
11. A semiconductor device, comprising:
a first substrate comprising:
a first conductive structure;
a first interface dielectric over the first conductive structure; and
a first internal interconnect in the first interface dielectric and coupled with the first conductive structure;
a second substrate over the first substrate and comprising:
a second interface dielectric contacting the first interface dielectric;
a second conductive structure over the second interface dielectric; and
a second internal interconnect in the second interface dielectric and coupled with the second conductive structure and the first internal interconnect; and
an electronic component between the first substrate and the second substrate;
wherein a first side of the first internal interconnect contacts a first side of the second internal interconnect.
12. The semiconductor device of claim 11 , further comprising an interconnect material coupled between the first internal interconnect and the second internal interconnect.
13. The semiconductor device of claim 12 , wherein at least one of a first side of the first internal interconnect is recessed with respect to a first side of the first interface dielectric or a first side of the second internal interconnect is recessed with respect to a first side of the second interface dielectric, the first side of the first internal interconnect being oriented toward the first side of the second internal interconnect, and the first side of the first interface dielectric contacting the first side of the second interface dielectric.
14. The semiconductor device of claim 13 , wherein the interconnect material extends into at least one of the first interface dielectric or the second interface dielectric.
15. The semiconductor device of claim 11 , wherein at least one of a first side of the first internal interconnect is coplanar with a first side of the first interface dielectric or a first side of the second internal interconnect is coplanar with a first side of the second interface dielectric, the first side of the first internal interconnect being oriented toward the first side of the second internal interconnect, and the first side of the first interface dielectric contacting the first side of the second interface dielectric.
16. The semiconductor device of claim 11 , wherein at least one of the first interface dielectric or the second interface dielectric comprise silicon oxide.
17. The semiconductor device of claim 11 , wherein at least one of the first interface dielectric or the second interface dielectric comprises benzocyclobutane or polyimide.
18. The semiconductor device of claim 11 , wherein a top side of the electronic component contacts the second interface dielectric.
19. A method to manufacture semiconductor device, comprising:
providing a first substrate comprising:
a first conductive structure;
a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body; and
a first internal interconnect in the first body and coupled with the first conductive structure;
providing an electronic component in the cavity;
providing an underfill in the cavity between a lateral side of the electronic component and a lateral side of the first body;
providing a first interface dielectric over the first body, wherein the first internal interconnect is in the first interface dielectric; and
providing a second substrate over the first substrate and comprising:
a second interface dielectric contacting the first interface dielectric;
a second body over the second interface dielectric; and
a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric; and
wherein the second internal interconnect is coupled with the first internal interconnect at an interface between the first internal interconnect and the second internal interconnect.
20. The method of claim 19 , wherein a width of the first internal interconnect at the interface is substantially equal to a width of the second internal interconnect at the interface.
21. The method of claim 19 , wherein a first side of the first internal interconnect is coplanar with a first side of the first interface dielectric, and a first side of the second internal interconnect is coplanar with a first side of the second interface dielectric, and wherein the first side of the first interface dielectric contacts the first side of the second interface dielectric.