Self-selecting memory devices
A self-selecting memory device includes a first conductive line on a substrate, a first memory cell on the first conductive line, a second conductive line on the first memory cell, a second memory cell on the second conductive line, and a third conductive line on the second memory cell. The first memory cell includes a first electrode, a first switching memory unit and a second electrode sequentially and vertically stacked. The second memory cell includes a third electrode, a second switching memory unit and a fourth electrode sequentially and vertically stacked. The first switching memory unit includes a first SSM pattern contacting an upper surface of the first electrode and including an OTS material, and a first nitrogen-containing pattern contacting an upper surface of the first SSM pattern and a lower surface of the second electrode and including an OTS material doped with nitrogen.
1. A self-selecting memory (SSM) device, comprising:
a first conductive line on a substrate;
a first memory cell on the first conductive line;
a second conductive line on the first memory cell;
a second memory cell on the second conductive line; and
a third conductive line on the second memory cell,
wherein:
the first memory cell includes a first electrode, a first switching memory unit, and a second electrode sequentially stacked in a vertical direction substantially perpendicular to an upper surface of the substrate,
the second memory cell includes a third electrode, a second switching memory unit, and a fourth electrode sequentially stacked in the vertical direction, and
the first switching memory unit includes:
a first SSM pattern contacting an upper surface of the first electrode, the first SSM pattern including an ovonic threshold switching (OTS) material; and
a first nitrogen-containing pattern contacting an upper surface of the first SSM pattern and a lower surface of the second electrode, the first nitrogen-containing pattern including an (OTS) material doped with nitrogen.
2. The SSM device as claimed in claim 1 , wherein the first nitrogen-containing pattern includes selenium nitride.
3. The SSM device as claimed in claim 2 , wherein the selenium nitride includes at least one of Se 4 N 2 , SeN 2 , SeN 3 , SeN 4 , SeN 5 , SeN, Se 3 N 2 and Se 2 N.
4. The SSM device as claimed in claim 1 , wherein the first nitrogen-containing pattern further includes germanium nitride (Ge 3 N 4 ) and arsenic nitride (AsN).
5. The SSM device as claimed in claim 1 , wherein the first SSM pattern includes selenium, germanium and arsenic.
6. The SSM device as claimed in claim 1 , wherein the second switching memory unit includes a second SSM pattern contacting an upper surface of the third electrode and a lower surface of the fourth electrode, the second SSM pattern including an OTS material.
7. The SSM device as claimed in claim 6 , wherein an area of a lower surface of the second SSM pattern is greater than an area of an upper surface of the first nitrogen-containing pattern.
8. The SSM device as claimed in claim 1 , wherein the second switching memory unit includes:
a second nitrogen-containing pattern contacting an upper surface of the third electrode, the second nitrogen-containing pattern including an OTS material doped with nitrogen; and
a second SSM pattern contacting an upper surface of the second nitrogen-containing pattern and a lower surface of the fourth electrode, the second SSM pattern including an OTS material.
9. The SSM device as claimed in claim 8 , wherein a concentration of nitrogen doped in the first nitrogen-containing pattern is higher than a concentration of nitrogen doped in the second nitrogen-containing pattern.
10. The SSM device as claimed in claim 1 , wherein each of the first conductive line and the third conductive line extends in a first direction substantially parallel to the upper surface of the substrate, and the second conductive line extends in a second direction substantially parallel to the upper surface of the substrate and crossing the first direction.
11. The SSM device as claimed in claim 1 , wherein each of the first conductive line and the third conductive line serves as a bit line, and the second conductive line serves as a word line.
12. A self-selecting memory (SSM) device, comprising:
a first conductive line on a substrate, the first conductive line extending in a first direction substantially parallel to an upper surface of the substrate;
a second conductive line over the first conductive line, the second conductive line extending in a second direction substantially parallel to the upper surface of the substrate and crossing the first direction; and
a memory cell at an area where the first conductive line and the second conductive line overlap in a third direction substantially perpendicular to the upper surface of the substrate, the memory cell contacting the first conductive line and the second conductive line,
wherein:
the memory cell includes:
a first electrode contacting an upper surface of the first conductive line;
a switching memory unit contacting an upper surface of the first electrode; and
a second electrode contacting an upper surface of the switching memory unit,
an area of a lower surface of the switching memory unit is greater than an area of an upper surface of the switching memory unit, and
the switching memory unit includes:
an SSM pattern contacting the upper surface of the first electrode, the SSM pattern including an ovonic threshold switching (OTS) material; and
a nitrogen-containing pattern contacting an upper surface of the SSM pattern and a lower surface of the second electrode, the nitrogen-containing pattern including an OTS material doped with nitrogen.
13. The SSM device as claimed in claim 12 , wherein the nitrogen-containing pattern includes selenium nitride.
14. The SSM device as claimed in claim 12 , wherein the SSM pattern includes selenium, germanium and arsenic.
15. The SSM device as claimed in claim 12 , wherein:
the first conductive line is one of a plurality of first conductive lines spaced apart from each other in the second direction, and the second conductive line is one of a plurality of second conductive lines spaced apart from each other in the first direction, and
the memory cell is one of a plurality of memory cells spaced apart from each other in the first and second directions.
16. A self-selecting memory (SSM) device, comprising:
first conductive lines on a substrate, each of the first conductive lines extending in a first direction substantially parallel to an upper surface of the substrate, and the first conductive lines being spaced apart from each other in a second direction substantially parallel to the upper surface of the substrate and crossing the first direction;
second conductive lines over the first conductive lines, each of the second conductive lines extending in the second direction, and the second conductive lines being spaced apart from each other in the first direction;
third conductive lines over the second conductive lines, each of the third conductive lines extending in the first direction, and the third conductive lines being spaced apart from each other in the second direction;
first memory cells at respective areas where the first conductive lines and the second conductive lines overlap in a third direction substantially perpendicular to the upper surface of the substrate, each of the first memory cells contacting a respective first conductive line and a respective second conductive line; and
second memory cells at respective areas where the second conductive line and the third conductive lines overlap in the third direction, each of the second memory cells contacting a respective second conductive line and a respective third conductive line,
wherein:
each of the first memory cells includes a first electrode, a first switching memory unit and a second electrode sequentially stacked in the third direction,
each of the second memory cells includes a third electrode, a second switching memory unit and a fourth electrode sequentially stacked in the third direction, and
the first switching memory unit includes:
a first SSM pattern contacting an upper surface of the first electrode, the first SSM pattern including an ovonic threshold switching (OTS) material; and
a first nitrogen-containing pattern contacting an upper surface of the first SSM pattern and a lower surface of the second electrode, the first nitrogen-containing pattern including an OTS material doped with nitrogen.
17. The SSM device as claimed in claim 16 , wherein the first nitrogen-containing pattern includes selenium nitride.
18. The SSM device as claimed in claim 16 , wherein the first SSM pattern includes selenium, germanium and arsenic.
19. The SSM device as claimed in claim 16 , wherein:
the second switching memory unit includes a second SSM pattern contacting an upper surface of the third electrode and a lower surface of the fourth electrode, the second SSM pattern including an OTS material, and
an area of a lower surface of the second SSM pattern is greater than an area of an upper surface of the first nitrogen-containing pattern.
20. The SSM device as claimed in claim 16 , wherein the second switching memory unit includes:
a second nitrogen-containing pattern contacting an upper surface of the third electrode, the second nitrogen-containing pattern including an OTS material doped with nitrogen; and
a second SSM pattern contacting an upper surface of the second nitrogen-containing pattern and a lower surface of the fourth electrode, the second SSM pattern including an OTS material,
wherein a concentration of nitrogen doped in the first nitrogen-containing pattern is higher than a concentration of nitrogen doped in the second nitrogen-containing pattern.