IP Library Granted Patent US 12,334,127
Granted Patent B2
US 12,334,127 · App. 18/161,808 · Granted Jun 17, 2025

Non-linear polar material based multi-capacitor high density bit-cell

Inventors: Rajeev Kumar Dokania (Beaverton, OR); Mustansir Yunus Mukadam (Seattle, WA); Erik Unterborn (Cary, NC); Pramod Kolar (Cary, NC); Amrita Mathuriya (Portland, OR); Debo Olaosebikan (San Francisco, CA); Tanay Gosavi (Portland, OR); Noriyuki Sato (Hillsboro, OR); Sasikanth Manipatruni (Portland, OR)
Assignee: Kepler Computing Inc.
G11C11/221G11C11/2255G11C11/2257G11C11/2259G11C11/2273
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Quick Facts
Patent No.
US 12,334,127
App. No.
18/161,808
Granted
Jun 17, 2025
Kind
B2
Abstract

Described herein is a memory bit-cell that results in lower leakage and higher sensing margin. In at least one embodiment, a memory bit-cell comprises a plurality of capacitors, wherein an individual capacitor is coupled to a node and an individual plate-line. In at least one embodiment, memory bit-cell comprises a first transistor coupled to the node. In at least one embodiment, memory bit-cell comprises a second transistor coupled in series with the first transistor, wherein the second transistor is coupled to a bit-line, wherein the first transistor or the second transistor is controllable by a word-line, and wherein the word-line is parallel to the individual plate-line.

Claims (52)

1. An apparatus comprising:

a plurality of capacitors, wherein an individual capacitor of the plurality of capacitors is coupled to a node and an individual plate-line;

a first transistor coupled to the node;

a second transistor coupled in series with the first transistor, wherein the second transistor is coupled to a sense-line; and

a third transistor coupled to the node and a bit-line, wherein the third transistor is controllable by a word-line, and wherein the word-line is parallel to the individual plate-line.

2. The apparatus of claim 1 , wherein the second transistor is controllable to reduce leakage through the node to the sense-line.

3. The apparatus of claim 1 , wherein the second transistor is controllable by the word-line.

4. The apparatus of claim 1 , wherein the first transistor is smaller in size than the second transistor.

5. The apparatus of claim 1 , wherein the second transistor is controllable by a read word-line separate from the word-line.

6. The apparatus of claim 1 , wherein the individual capacitor comprises a non-linear polar material.

7. The apparatus of claim 6 , wherein the non-linear polar material is directly on the node.

8. The apparatus of claim 6 , wherein the non-linear polar material is one of a ferroelectric material, a paraelectric material, or a non-linear dielectric material.

9. The apparatus of claim 6 , wherein the non-linear polar material is doped with one or more elements of a 3d, 4d, 5d, 6d, 4f, and 5f series of a periodic table.

10. The apparatus of claim 6 , wherein the non-linear polar material includes one of:

a perovskite material which includes one of: BaTiO 3 , PbTiO 3 , KNbO 3 , or NaTaO 3 ;

bismuth ferrite (BFO);

barium titanate (BTO);

BFO doped with one of: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Zn;

BTO doped with one of: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Zn;

LBFO doped with Mn;

lead zirconium titanate (PZT) or PZT with a first doping material, wherein the first doping material is one of La, Nb, Mn, or 5d series elements;

bismuth ferrite (BFO) with a second doping material, wherein the second doping material is one of lanthanum, elements from lanthanide series of a periodic table, or elements of a 3d, 4d, 5d, 6d, 4f, and 5f series of the periodic table;

a relaxor ferroelectric material which includes one of; lead magnesium niobate (PMN), lead magnesium niobate-lead titanate (PMN-PT), lead lanthanum zirconate titanate (PLZT), lead scandium niobate (PSN), barium titanium-bismuth zinc niobium tantalum (BT-BZNT), or barium titanium-barium strontium titanium (BT-BST);

a hexagonal ferroelectric which includes one of: YMnO 3 or LuFeO 3 ;

hexagonal ferroelectrics of a type h-RMnO 3 , wherein R is a rare earth element which includes one of: cerium (Ce), dysprosium (Dy), erbium (Er), europium (Eu), gadolinium (Gd), holmium (Ho), lanthanum (La), lutetium (Lu), neodymium (Nd), praseodymium (Pr), promethium (Pm), samarium (Sm), scandium (Sc), terbium (Tb), thulium (Tm), ytterbium (Yb), or yttrium (Y); hafnium (Hf), zirconium (Zr), aluminum (Al), silicon (Si), their oxides or their alloyed oxides;

hafnium oxides as Hf (1-x) E x O y , where E includes one of: Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, Zr, or Y, where x and y are first and second fractions, respectively;

Al (1-x) Sc (x) N, Ga (1-x) Sc (x) N, Al (1-x) Y (x) N or Al (1-x-y) Mg (x) Nb (y) N, where x and y are third and fourth fractions, respectively;

y doped HfO 2 , where y includes one of: Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, or Y; or

niobate type compounds LiNbO 3 , LiTaO 3 , lithium iron tantalum oxyfluoride, barium strontium niobate, sodium barium niobate, or potassium strontium niobate;

an improper ferroelectric material which includes one of: [PTO/STO]n or [LAO/STO]n, wherein ‘n’ is between 1 and 100, or a paraelectric material that comprises SrTiO 3 , Ba (x) Sr (y) TiO 3 Ba (x) Sr (y) TiO 3 , HfZrO 2 , Hf—Si—O, La-substituted PbTiO 3 , or PMN-PT based relaxor ferroelectrics; or

a paraelectric material that comprises SrTiO 3 , Ba (x) Sr (y) TiO 3 , HfZrO 2 , Hf—Si—O, or PMN-PT based relaxor ferroelectrics.

11. The apparatus of claim 1 , wherein the plurality of capacitors are planar capacitors that are arranged in a stacked and/or folded configuration.

12. The apparatus of claim 1 , wherein the bit-line is orthogonal to the word-line and the individual plate-line.

13. An apparatus comprising:

a plurality of capacitors, wherein an individual capacitor of the plurality of capacitors is coupled to a node and an individual plate-line;

a first transistor having a first gate terminal coupled to the node, and a first drain terminal coupled to a reference;

a second transistor coupled in series with the first transistor such that a first source terminal of the first transistor is coupled to a second drain terminal of the second transistor, wherein a second source terminal of the second transistor is coupled to a sense-line; and

a third transistor having a third source terminal coupled to a bit-line, a third drain terminal coupled the node, and a third gate terminal coupled to a word-line.

14. The apparatus of claim 13 , wherein the word-line is parallel to the individual plate-line, wherein the word-line is orthogonal to the bit-line.

15. The apparatus of claim 13 , wherein the second transistor has a second gate terminal which is controllable by the word-line, or wherein the second gate terminal is controllable by a read word-line.

16. The apparatus of claim 13 , wherein the second transistor is controllable to reduce leakage through the node to the sense-line.

17. The apparatus of claim 13 , wherein the second transistor is smaller in size than the first transistor.

18. The apparatus of claim 13 , wherein the individual capacitor comprises a non-linear polar material.

19. The apparatus of claim 18 , wherein the non-linear polar material is directly on the node.

20. A system comprising:

a memory to store instructions;

a processor circuitry to execute the instructions; and

a communication interface to allow the processor circuitry to communicate with another device, wherein the memory includes:

a plurality of capacitors, wherein an individual capacitor of the plurality of capacitors is coupled to a node and an individual plate-line;

a first transistor having a first drain terminal coupled to a reference;

a second transistor coupled in series with the first transistor such that a first source terminal of the first transistor is coupled to a second drain terminal of the second transistor, wherein a second source terminal of the second transistor is coupled to a sense-line, and wherein the second transistor has a gate terminal coupled to the node; and

a third transistor having a third source terminal coupled to a bit-line, a third drain terminal coupled the node, and a third gate terminal coupled to a word-line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2023
From: DOKANIA, RAJEEV KUMAR; MUKADAM, MUSTANSIR YUNUS; UNTERBORN, ERIK; KOLAR, PRAMOD; MATHURIYA, AMRITA; OLAOSEBIKAN, DEBO; GOSAVI, TANAY; SATO, NORIYUKI; MANIPATRUNI, SASIKANTH
To: KEPLER COMPUTING INC.
Reel/Frame 064669/0596 →
Continuity (1)
Related Publication 20240257854A1 · Aug 1, 2024
References Cited (256)
US 4809225A · Dimmier et al. · 1989 [cited by applicant]
US 4853893A · Eaton, Jr. et al. · 1989 [cited by applicant]
US 5086412A · Jaffe et al. · 1992 [cited by applicant]
US 5218566A · Papaliolios · 1993 [cited by applicant]
US 5270967A · Moazzami et al. · 1993 [cited by applicant]
US 5381364A · Chern et al. · 1995 [cited by applicant]
US 5383150A · Nakamura et al. · 1995 [cited by applicant]
US 5539279A · Takeuchi et al. · 1996 [cited by applicant]
US 5541872A · Lowrey et al. · 1996 [cited by applicant]
US 5638318A · Seyyedy · 1997 [cited by applicant]
US 5640030A · Kenney · 1997 [cited by applicant]
US 5760432A · Abe et al. · 1998 [cited by applicant]
US 5917746A · Seyyedy · 1999 [cited by applicant]
US 5926413A · Yamada et al. · 1999 [cited by applicant]
US 5969380A · Seyyedy · 1999 [cited by applicant]
US 6002608A · Tanabe · 1999 [cited by applicant]
US 6028784A · Mori et al. · 2000 [cited by applicant]
US 6031754A · Derbenwick et al. · 2000 [cited by applicant]
US 6043526A · Ochial · 2000 [cited by applicant]
US 6147895A · Kamp · 2000 [cited by applicant]
US 6346741B1 · Buskirk et al. · 2002 [cited by applicant]
US 6358810B1 · Dornfest et al. · 2002 [cited by applicant]
US 6388281B1 · Jung et al. · 2002 [cited by applicant]
US 6483737B2 · Takeuchi et al. · 2002 [cited by applicant]
US 6500678B1 · Aggarwal et al. · 2002 [cited by applicant]
US 6515957B1 · Newns et al. · 2003 [cited by applicant]
US 6538914B1 · Chung · 2003 [cited by applicant]
US 6548343B1 · Summerfelt et al. · 2003 [cited by applicant]
US 6587367B1 · Nishimura et al. · 2003 [cited by applicant]
US 6590245B2 · Ashikaga · 2003 [cited by applicant]
US 6610549B1 · Aggarwal et al. · 2003 [cited by applicant]
US 6643163B2 · Takashima · 2003 [cited by examiner]
US 6646906B2 · Salling · 2003 [cited by applicant]
US 6656301B2 · Kirby · 2003 [cited by applicant]
US 6656748B2 · Hall et al. · 2003 [cited by applicant]
US 6713342B2 · Celii et al. · 2004 [cited by applicant]
US 6717838B2 · Hosoi · 2004 [cited by applicant]
US 6720600B2 · Okita · 2004 [cited by applicant]
US 6728128B2 · Nishimura et al. · 2004 [cited by applicant]
US 6734477B2 · Moise et al. · 2004 [cited by applicant]
US 6795331B2 · Noro · 2004 [cited by applicant]
US 6798686B2 · Takashima · 2004 [cited by applicant]
US 6809949B2 · Ho · 2004 [cited by applicant]
US 6819584B2 · Noh · 2004 [cited by applicant]
US 6856534B2 · Rodriguez et al. · 2005 [cited by applicant]
US 6873536B2 · Komatsuzaki · 2005 [cited by applicant]
US 6906944B2 · Takeuchi et al. · 2005 [cited by applicant]
US 6924997B2 · Chen et al. · 2005 [cited by applicant]
US 7029925B2 · Celii et al. · 2006 [cited by applicant]
US 7173844B2 · Lee et al. · 2007 [cited by applicant]
US 7405959B2 · Koide et al. · 2008 [cited by applicant]
US 7426130B2 · Jeon · 2008 [cited by applicant]
US 7514734B2 · Aggarwal et al. · 2009 [cited by applicant]
US 7642099B2 · Fukada et al. · 2010 [cited by applicant]
US 7791922B2 · Doumae et al. · 2010 [cited by applicant]
US 7812385B2 · Noda · 2010 [cited by applicant]
US 8129200B2 · Kang · 2012 [cited by applicant]
US 8177995B2 · Kobayashi et al. · 2012 [cited by applicant]
US 8300446B2 · Qidwai · 2012 [cited by applicant]
US 8441833B2 · Summerfelt et al. · 2013 [cited by applicant]
US 8508974B2 · Clinton et al. · 2013 [cited by applicant]
US 8665628B2 · Kawashima · 2014 [cited by applicant]
US 8717800B2 · Clinton et al. · 2014 [cited by applicant]
US 8865628B2 · Manabe et al. · 2014 [cited by applicant]
US 9472560B2 · Ramaswamy et al. · 2016 [cited by applicant]
US 9786348B1 · Kawamura et al. · 2017 [cited by applicant]
US 9812204B1 · Yan et al. · 2017 [cited by applicant]
US 9818468B2 · Müller · 2017 [cited by applicant]
US 9830969B2 · Slesazeck et al. · 2017 [cited by applicant]
US 10043567B2 · Slesazeck et al. · 2018 [cited by applicant]
US 10354712B2 · Derner et al. · 2019 [cited by applicant]
US 10600808B2 · Schröder · 2020 [cited by applicant]
US 10847201B2 · Manipatruni et al. · 2020 [cited by applicant]
US 10854265B2 · Toops · 2020 [cited by examiner]
US 10872905B2 · Müller · 2020 [cited by applicant]
US 10963776B2 · Mulaosmanovic et al. · 2021 [cited by applicant]
US 10998025B2 · Manipatruni et al. · 2021 [cited by applicant]
US 11482270B1 · Dokania et al. · 2022 [cited by applicant]
US 11532635B1 · Dokania · 2022 [cited by examiner]
US 20020079520A1 · Nishihara et al. · 2002 [cited by applicant]
US 20020125517A1 · Nakamura · 2002 [cited by applicant]
US 20020153550A1 · An et al. · 2002 [cited by applicant]
US 20030012984A1 · Ueda · 2003 [cited by applicant]
US 20030112650A1 · Kang · 2003 [cited by applicant]
US 20030119211A1 · Summerfelt et al. · 2003 [cited by applicant]
US 20030129847A1 · Celii et al. · 2003 [cited by applicant]
US 20030141528A1 · Ito · 2003 [cited by applicant]
US 20040027873A1 · Nishihara · 2004 [cited by applicant]
US 20040089854A1 · Chen et al. · 2004 [cited by applicant]
US 20040104754A1 · Bruchhaus et al. · 2004 [cited by applicant]
US 20040129961A1 · Araujo et al. · 2004 [cited by applicant]
US 20040184307A1 · Saito · 2004 [cited by examiner]
US 20040233696A1 · Kang · 2004 [cited by applicant]
US 20040245547A1 · Stipe · 2004 [cited by applicant]
US 20050012126A1 · Udayakumar et al. · 2005 [cited by applicant]
US 20050214954A1 · Maruyama et al. · 2005 [cited by applicant]
US 20050230725A1 · Aggarwal et al. · 2005 [cited by applicant]
US 20050244988A1 · Wang et al. · 2005 [cited by applicant]
US 20060001070A1 · Park et al. · 2006 [cited by applicant]
US 20060002170A1 · Kumura et al. · 2006 [cited by applicant]
US 20060006447A1 · Kim et al. · 2006 [cited by applicant]
US 20060073613A1 · Aggarwal et al. · 2006 [cited by applicant]
US 20060073614A1 · Hara · 2006 [cited by applicant]
US 20060134808A1 · Summerfelt et al. · 2006 [cited by applicant]
US 20060258113A1 · Sandhu et al. · 2006 [cited by applicant]
US 20070298521A1 · Obeng et al. · 2007 [cited by applicant]
US 20080007987A1 · Takashima · 2008 [cited by examiner]
US 20080073680A1 · Wang · 2008 [cited by applicant]
US 20080081380A1 · Celii et al. · 2008 [cited by applicant]
US 20080101107A1 · Shiga et al. · 2008 [cited by applicant]
US 20080107885A1 · Alpay et al. · 2008 [cited by applicant]
US 20080191252A1 · Nakamura et al. · 2008 [cited by applicant]
US 20090003042A1 · Lee et al. · 2009 [cited by applicant]
US 20090103348A1 · Du · 2009 [cited by examiner]
US 20120127776A1 · Kawashima · 2012 [cited by applicant]
US 20120134196A1 · Evans, Jr. et al. · 2012 [cited by applicant]
US 20120307545A1 · McAdams et al. · 2012 [cited by applicant]
US 20120313218A1 · Fujimori et al. · 2012 [cited by applicant]
US 20130147295A1 · Shimizu · 2013 [cited by applicant]
US 20140208041A1 · Hyde et al. · 2014 [cited by applicant]
US 20150069481A1 · Sun et al. · 2015 [cited by applicant]
US 20150294702A1 · Lee et al. · 2015 [cited by applicant]
US 20170069735A1 · Oh et al. · 2017 [cited by applicant]
US 20170277459A1 · Rodriguez et al. · 2017 [cited by applicant]
US 20170345831A1 · Chavan et al. · 2017 [cited by applicant]
US 20180082981A1 · Gowda · 2018 [cited by applicant]
US 20180226418A1 · Morandi et al. · 2018 [cited by applicant]
US 20180286987A1 · Lee et al. · 2018 [cited by applicant]
US 20180323309A1 · Ando et al. · 2018 [cited by applicant]
US 20180331113A1 · Liao et al. · 2018 [cited by applicant]
US 20190051642A1 · Hyde et al. · 2019 [cited by applicant]
US 20190051815A1 · Kakinuma et al. · 2019 [cited by applicant]
US 20190115353A1 · O'Brien et al. · 2019 [cited by applicant]
US 20190138893A1 · Sharma et al. · 2019 [cited by applicant]
US 20200004583A1 · Kelly et al. · 2020 [cited by applicant]
US 20200051607A1 · Pan et al. · 2020 [cited by applicant]
US 20200273867A1 · Manipatruni et al. · 2020 [cited by applicant]
US 20200357453A1 · Slesazeck et al. · 2020 [cited by applicant]
US 20210090662A1 · Mennenga et al. · 2021 [cited by applicant]
US 20210111179A1 · Shivaraman et al. · 2021 [cited by applicant]
US 20210142837A1 · Yu et al. · 2021 [cited by applicant]
US 20210193209A1 · Swami et al. · 2021 [cited by applicant]
US 20210398580A1 · Yuh · 2021 [cited by applicant]
EP 0798736A2 · 1997 [cited by applicant]
JP H0982907A · 1997 [cited by applicant]
JP H10242426A · 1998 [cited by applicant]
JP H10255484A · 1998 [cited by applicant]
JP H1174488A · 1999 [cited by applicant]
JP 2000174224A · 2000 [cited by applicant]
JP 2001237393A · 2001 [cited by applicant]
JP 2002026256A · 2002 [cited by applicant]
JP 2002158339A · 2002 [cited by applicant]
JP 2003123465A · 2003 [cited by applicant]
JP 2005057103A · 2005 [cited by applicant]
JP 2005142322A · 2005 [cited by applicant]
JP 2005322925A · 2005 [cited by applicant]
JP 2006164321A · 2006 [cited by applicant]
JP 3959341B2 · 2007 [cited by applicant]
JP 2008210955A · 2008 [cited by applicant]
JP 2010021544A · 2010 [cited by applicant]
JP 2011151370A · 2011 [cited by applicant]
JP 2017518632A · 2017 [cited by applicant]
KR 20050105695A · 2005 [cited by applicant]
TW 200718237A · 2007 [cited by applicant]
TW 200919705A · 2009 [cited by applicant]
TW 200935151A · 2009 [cited by applicant]
TW 201227879A · 2012 [cited by applicant]
TW 201725736A · 2017 [cited by applicant]
WO 20130147295 · 2013 [cited by applicant]
WO 2013147295A4 · 2014 [cited by applicant]
WO 2015167887A1 · 2015 [cited by applicant]
WO 2021112247A1 · 2021 [cited by applicant]
Ogiwara, R. et al, A G.5-/spl mu/m, 3-V 1T1C, 1-Mbit FRAM with a variable reference bit-line volage scherne using | a fatigue-free reference capacitor, in JEEE Journal of Solid-State Circuits, vol. 35, No. 4, po. 545-55… [cited by examiner]
Tanaka, S. et al., FRAM cell design with high imraunity to fatigue and imprint for 0.5 ‘sol mu/m SV 1T1C 7 Moi PRAM’ in HEEE Transactions on Electron Devices, vol. 47, na. 4, pp. 781-788, Apr. 2600. [cited by examiner]
Yamaoka, K. et al., A 0.9-V 1T1CG SBT-based embedded nonvolatile FeRAM wiih a reference vollage scheme and mutilayer shielded bit-line structure, in IEEE Journal of Solid-State Circuits, vol. 40, No. 1, po. 286-292, Jan… [cited by examiner]
Oh, S. etal. “Noble FeRAM technologies with MTP ceil structure and BLT ferroelectric capacitors”, IEEE international Electron Devices Meeting 2003, Washington, DC, USA, 2003, pp. 34.8.1-34.5.4. [cited by examiner]
Notice of Allowance notified Jul. 27, 2020 for U.S. Appl. No. 16/287,927. [cited by applicant]
Notice of Allowance notified Jun. 9, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Notice of Allowance notified Jun. 10, 2022 for U.S. Appl. No. 16/288,004. [cited by applicant]
Notice of Allowance notified Jun. 13, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Notice of Allowance notified Jun. 15, 2022 for U.S. Appl. No. 17/367,083. [cited by applicant]
Notice of Allowance notified Jun. 23, 2022 for U.S. Appl. No. 17/367,172. [cited by applicant]
Notice of Allowance notified Jun. 23, 2022 for U.S. Appl. No. 17/367,210. [cited by applicant]
Notice of Allowance notified Nov. 17, 2022 for U.S. Appl. No. 17/530,363. [cited by applicant]
Notice of Allowance notified Nov. 22, 2022 for U.S. Appl. No. 17/530,362. [cited by applicant]
Notice of Allowance notified Nov. 25, 2022 for U.S. Appl. No. 17/531,577. [cited by applicant]
Notice of Allowance notified Oct. 20, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Notice of Allowance notified Oct. 31, 2022 for U.S. Appl. No. 17/390,796. [cited by applicant]
Notice of Allowance notified Sep. 13, 2022 for U.S. Appl. No. 17/530,364. [cited by applicant]
Notice of Allowance notified Sep. 14, 2022 for U.S. Appl. No. 17/530,360. [cited by applicant]
Notice of Allowance notified Sep. 21, 2022 for U.S. Appl. No. 17/530,366. [cited by applicant]
Notice of Allowance notified Sep. 23, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Notice of Allowance notified Sep. 26, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
Notice of Allowance notified Sep. 27, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Notice of Grant notified May 18, 2021 for Taiwan Patent Application No. 109106095. [cited by applicant]
Notice of Preliminary Rejection notified Oct. 28, 2022 for Korean Patent Application No. 10-2021-7027303. [cited by applicant]
Notice of Reasons for Rejection notified Dec. 6, 2022 for Japanese Patent Application No. 2021-546823. [cited by applicant]
Notice of Reasons for Rejection notified Nov. 22, 2022 for Japanese Patent Application No. 2021-546864. [cited by applicant]
Ogiwara, R. et al., “A 0.5-/spl mu/m, 3-V 1T1C, 1-Mbit FRAM with a variable reference bit-line voltage scheme using a fatigue-free reference capacitor”, in IEEE Journal of Solid-State Circuits, vol. 35, No. 4, pp. 545-5… [cited by applicant]
Oh, S. et al. “Noble FeRAM technologies with MTP cell structure and BLT ferroelectric capacitors”, IEEE International Electron Devices Meeting 2003, Washington, DC, USA, 2003, pp. 34.5.1-34.5.4. [cited by applicant]
Restriction Requirement notified Aug. 5, 2022 for U.S. Appl. No. 17/359,325. [cited by applicant]
Restriction Requirement notified Aug. 26, 2022 for U.S. Appl. No. 17/390,796. [cited by applicant]
Run-Lan et al., “Study on Ferroelectric Behaviors and Ferroelectric Nanodomains of YMno3 Thin Film”, Acta Phys. Sin. vol. 63, No. 18 (2014). Supported by the National Natural Science Foundation of China. DOI: 10.7498/ap… [cited by applicant]
Second Office Action notified Jul. 26, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Tanaka, S. et al., “FRAM cell design with high immunity to fatigue and imprint for 0.5 /spl mu/m 3 V 1T1C 1 Mbit FRAM”, in IEEE Transactions on Electron Devices, vol. 47, No. 4, pp. 781-788, Apr. 2000. [cited by applicant]
Yamaoka, K. et al., “A 0.9-V 1T1C SBT-based embedded nonvolatile FeRAM with a reference voltage scheme and multilayer shielded bit-line structure”, in IEEE Journal of Solid-State Circuits, vol. 40, No. 1, pp. 286-292, J… [cited by applicant]
1st Office Action notified Dec. 11, 2020 for Taiwan Patent Application No. 109106095. [cited by applicant]
1st Taiwan Office Action notified Mar. 3, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Advisory Action notified Jul. 25, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/287,953. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/288,006. [cited by applicant]
Chandler, T. “An adaptive reference generation scheme for 1T1C FeRAMs”, 2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No. 03CH37408), Kyoto, Japan, 2003, pp. 173-174. [cited by applicant]
Final Office Action notified Apr. 25, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Final Office Action notified Aug. 15, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Final Office Action notified Jun. 13, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Final Office Action notified May 11, 2022 for U.S. Appl. No. 16/288,004. [cited by applicant]
Final Office Action notified May 11, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/287,953. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/288,006. [cited by applicant]
Final Office Action notified Sep. 12, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
International Preliminary Report on Patentability notified Sep. 10, 2021 for PCT Patent Application No. PCT/US2020/018870. [cited by applicant]
International Preliminary Report on Patentability notified Sep. 10, 2021 for PCT Patent Application No. PCT/US2020/066963. [cited by applicant]
International Search Report & Written Opinion notified Jun. 19, 2020 for U.S. Patent Application No. PCT/US2020/018879. [cited by applicant]
International Search Report & Written Opinion notified Jun. 24, 2020 for PCT Patent Application No. PCT/US2020/018870. [cited by applicant]
Jung, D. et al., “Highly manufacturable 1T1C 4 Mb FRAM with novel sensing scheme,” International Electron Devices Meeting 1999. Technical Digest (Cat. No. 99CH36318), Washington, DC, USA, 1999, pp. 279-282., Internation… [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/287,953. [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/288,004. [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/288,006. [cited by applicant]
Non-Final Office Action notified Aug. 16, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
Non-Final Office Action notified Dec. 20, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Non-Final Office Action notified Jan. 18, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Non-Final Office Action notified Jan. 19, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Non-Final Office Action notified Jun. 13, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Non-Final Office Action notified Jun. 15, 2022 for U.S. Appl. No. 17/367,101. [cited by applicant]
Non-Final Office Action notified Jun. 26, 2020 for U.S. Appl. No. 16/287,876. [cited by applicant]
Non-Final Office Action notified Mar. 7, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Non-Final Office Action notified Mar. 30, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Non-Final Office Action notified Mar. 31, 2022 for U.S. Appl. No. 17/346,087. [cited by applicant]
Non-Final Office Action notified Nov. 4, 2022 for U.S. Appl. No. 17/530,362. [cited by applicant]
Non-Final Office Action notified Nov. 21, 2022 for U.S. Patent Application No. 7/532,657. [cited by applicant]
Non-Final Office Action notified Nov. 28, 2022 for U.S. Appl. No. 17/532,552. [cited by applicant]
Non-Final Office Action notified Oct. 12, 2022 for U.S. Appl. No. 17/530,365. [cited by applicant]
Non-Final Office Action notified Oct. 26, 2022 for U.S. Appl. No. 17/531,577. [cited by applicant]
Non-Final Office Action notified Sep. 1, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Non-Final Office Action notified Sep. 7, 2022 for U.S. Appl. No. 17/530,360. [cited by applicant]
Notice of Allowance notified Apr. 20, 2022 for U.S. Appl. No. 17/359,311. [cited by applicant]
Notice of Allowance notified Aug. 8, 2022 for U.S. Appl. No. 17/529,258. [cited by applicant]
Notice of Allowance notified Aug. 17, 2022 for U.S. Appl. No. 17/346,087. [cited by applicant]
Notice of Allowance notified Aug. 22, 2022 for U.S. Patent Application No. 7/390,791. [cited by applicant]
Notice of Allowance notified Aug. 25, 2022 for U.S. Appl. No. 17/367,101. [cited by applicant]
Notice of Allowance notified Aug. 31, 2022 for U.S. Appl. No. 17/359,325. [cited by applicant]
Notice of Allowance notified Jan. 12, 2021 for U.S. Appl. No. 16/287,876. [cited by applicant]
Notice of Allowance notified Jan. 20, 2023 for U.S. Appl. No. 17/532,657. [cited by applicant]
Notice of Allowance notified Jan. 30, 2023 for U.S. Appl. No. 17/531,535. [cited by applicant]