Semiconductor device
A semiconductor device includes: a first semiconductor structure including a first semiconductor substrate, one or more first conductive patterns, a plurality of first conductive plugs, and a first bonding pad; a second semiconductor structure including a second semiconductor substrate, a plurality of second conductive patterns, one or more second conductive plugs, and a second bonding pad; and two through electrodes penetrating the second semiconductor substrate and respectively connected to two second conductive patterns positioned at opposite ends of the plurality of second conductive patterns, wherein the second bonding pad is bonded to the first bonding pad so that the plurality of second conductive patterns, the one or more second conductive plugs, the second bonding pad, the first bonding pad, the plurality of first conductive plugs, and the one or more first conductive patterns form a daisy chain.
1. A semiconductor device comprising:
a first semiconductor structure including a first semiconductor substrate, one or more first conductive patterns disposed over the first semiconductor substrate, a plurality of first conductive plugs connected to each of the one or more first conductive patterns thereover, and a first bonding pad connected to each of the plurality of first conductive plugs thereover;
a second semiconductor structure including a second semiconductor substrate, a plurality of second conductive patterns disposed under the second semiconductor substrate, one or more second conductive plugs connected to each of the plurality of second conductive patterns thereunder, and a second bonding pad connected to each of the one or more second conductive plugs thereunder; and
two through electrodes penetrating the second semiconductor substrate and respectively connected to two second conductive patterns positioned at opposite ends of the plurality of second conductive patterns,
wherein the second bonding pad is bonded to the first bonding pad so that the plurality of second conductive patterns, the one or more second conductive plugs, the second bonding pad, the first bonding pad, the plurality of first conductive plugs, and the one or more first conductive patterns form a daisy chain.
2. The semiconductor device according to claim 1 , wherein electrical connection between the first semiconductor structure and the second semiconductor structure is verified according to whether current flows through one of the two through electrodes, the daisy chain, and the other of the two through electrodes.
3. The semiconductor device according to claim 1 , wherein the first semiconductor structure further includes a connection pattern interposed between at least one of the one or more first conductive patterns and the first semiconductor substrate to electrically connect them.
4. The semiconductor device according to claim 3 , wherein charges escape to the first semiconductor substrate through the connection pattern.
5. The semiconductor device according to claim 1 , wherein the second bonding pad and the first bonding pad form a metal-to-metal bond.
6. The semiconductor device according to claim 5 , wherein the first semiconductor structure further includes a first insulating layer filling a space between the first bonding pad and another first bonding pad,
wherein the second semiconductor structure further includes a second insulating layer filling a space between the second bonding pad and another second bonding pad, and
wherein the first insulating layer and the second insulating layer form an insulator-to-insulator bond.
7. The semiconductor device according to claim 1 , wherein the first bonding pad has a plate shape connected to a corresponding one of the plurality of first conductive plugs, and
wherein the second bonding pad has a plate shape connected to a corresponding one of the one or more second conductive plugs.
8. The semiconductor device according to claim 1 , wherein the first bonding pad includes a plurality of first sub-bonding pads separated from each other,
wherein the second bonding pad includes a plurality of second sub-bonding pads separated from each other, and
wherein at least one of the plurality of first sub-bonding pads and at least one of the plurality of second sub-bonding pads overlap and contact each other.
9. The semiconductor device according to claim 8 , wherein each of the plurality of first sub-bonding pads has a long side in a first direction and a short side in a second direction crossing the first direction, and
wherein each of the plurality of second sub-bonding pads has a short side in the first direction and a long side in the second direction.
10. The semiconductor device according to claim 9 , wherein a length of the long side of each of the plurality of first sub-bonding pads is equal to a length of the long side of each of the plurality of second sub-bonding pads,
wherein a length of the short side of each of the plurality of first sub-bonding pads is equal to a length of the short side of each of the plurality of second sub-bonding pads, and
wherein a number and pitch of the plurality of first sub-bonding pads are equal to a number and pitch of the plurality of second sub-bonding pads.
11. The semiconductor device according to claim 8 , wherein the plurality of first sub-bonding pads are commonly connected to a corresponding one of the plurality of first conductive plugs, and
wherein the plurality of second sub-bonding pads are commonly connected to a corresponding one of the one or more second conductive plugs.
12. The semiconductor device according to claim 1 , wherein the first semiconductor structure and the second semiconductor structure include the same type of memory.
13. The semiconductor device according to claim 1 , wherein the first semiconductor structure and the second semiconductor structure include different types of memory.