Asymmetric pads structure and test element group module
This invention provides an asymmetric pads structure using at a scribe line of a wafer, comprising a test element device electrically connected to a first pad and a second pad separately, wherein a first spacing between the second pad and the test element device is sufficient to accommodate the second pad of an another asymmetric pads structure. So, two neighboring asymmetric pads structures may cross to each other to form a cross configuration.
1 . An asymmetric pads structure using at a scribe line of a wafer, comprising:
a test element device, electrically connected to a first pad and a second pad separately;
wherein a first spacing between the second pad and the test element device is sufficient to accommodate a second pad of an another asymmetric pads structure which is a counterpart of the asymmetric pads structure, and
wherein the asymmetric pads structure and the another asymmetric pads structure are arranged in a way that the second pad of the asymmetric pads structure and the test element device of the another asymmetric pads structure are positioned between a first pad of the another asymmetric pads structure and the second pad of the another asymmetric pads structure.
2 . The asymmetric pads structure of claim 1 , wherein the first spacing is larger than a second spacing between the first pad and the test element device.
3 . The asymmetric pads structure of claim 1 , wherein the asymmetric pads structure is configured to cross the another asymmetric pads structure.
4 . The asymmetric pads structure of claim 1 , wherein a pitch between the first pad and second pad of the asymmetric pads structure is same of the another asymmetric pads structure.
5 . The asymmetric pads structure of claim 4 , wherein the pitch is defined by a distance between center lines of the first pad and the second pad.
6 . The asymmetric pads structure of claim 1 , wherein the test element device is located between the first pad and second pad.