Electronic device packages with internal moisture barriers
A method of packaging an RF transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.
1. A packaged semiconductor device, comprising:
a carrier substrate;
a plurality of semiconductor devices including a transistor device and an auxiliary electronic device, wherein the transistor device and the auxiliary electronic device are attached to the carrier substrate;
an encapsulant material over one of the transistor device and the auxiliary electronic device and not over the other of the transistor device and the auxiliary electronic device, the encapsulant material extending onto the carrier substrate, wherein the encapsulant material comprises a polytetrafluoroethylene (PTFE) based material; and
a protective structure on the carrier substrate over the transistor device and the auxiliary electronic device and the encapsulant material.
2. The packaged semiconductor device of claim 1 , wherein the protective structure comprises a lid that forms a seal on the carrier substrate around the plurality of electronic devices and the encapsulant material.
3. The packaged semiconductor device of claim 2 , wherein an open-cavity is present between the lid and the plurality of electronic devices.
4. The packaged semiconductor device of claim 1 , wherein the protective structure comprises a plastic overmolding on the carrier substrate, wherein the plastic overmolding contacts the carrier substrate and covers the encapsulant material and the plurality of electronic devices.
5. The packaged semiconductor device of claim 4 , wherein the plastic overmolding contacts the encapsulant material.
6. The packaged semiconductor device of claim 4 , wherein the encapsulant material and the plastic overmolding have different coefficients of thermal expansion.
7. The packaged semiconductor device of claim 4 , wherein the encapsulant material and the plastic overmolding have different hardness.
8. The packaged semiconductor device of claim 1 , wherein the semiconductor die is attached to the carrier substrate with a sintered silver or eutectic die attach.
9. The packaged semiconductor device of claim 1 , wherein the encapsulant material comprises silicone, polyimide, benzocyclobutene and/or epoxy resin.
10. The packaged semiconductor device of claim 1 , wherein the semiconductor die is attached to the carrier substrate via solder bumps, and wherein the encapsulant material extends between the at least one of the plurality of electronic devices and the carrier substrate.
11. The packaged semiconductor device of claim 1 , wherein the encapsulant material comprises an additive that modifies a dielectric constant of the encapsulant material.
12. The packaged semiconductor device of claim 1 , wherein the semiconductor die comprises a high electron mobility transistor, a field effect transistor, a metal-oxide semiconductor field effect transistor, or a monolithic microwave integrated circuit.
13. The packaged semiconductor device of claim 1 , wherein the semiconductor die comprises a GaN-based device or a SiC-based device.
14. The packaged semiconductor device of claim 1 , wherein the semiconductor die comprises an RF transistor die having an operating frequency greater than 1 GHz.
15. A packaged semiconductor device, comprising:
a first electronic device and a second electronic device on a mounting surface;
an encapsulant material over one of the first electronic device and the second electronic device and not over the other of the first electronic device and the second electronic device, the encapsulant material extending onto the mounting surface, wherein the encapsulant material comprises a polytetrafluoroethylene (PTFE) based material; and
a protective structure on the carrier substrate over the first electronic device and the second electronic device and the encapsulant material.
16. The packaged semiconductor device of claim 15 , further comprising a wirebond connecting the first electronic device and the second electronic device, wherein the wirebond extends through the encapsulant material.
17. The packaged semiconductor device of claim 15 , wherein the mounting surface comprises a surface of a carrier substrate.
18. A packaged semiconductor device, comprising:
a carrier substrate;
a first electronic device and a second electronic device on the carrier substrate;
an encapsulant material over one of the first electronic device and the second electronic device and not over the other of the first electronic device and the second electronic device, the encapsulant material extending onto the carrier substrate, wherein the encapsulant material comprises a polytetrafluoroethylene (PTFE) based material; and
a lid on the carrier substrate over the first electronic device and the second electronic device and the encapsulant material, the lid defining an open-cavity above the carrier substrate, the first electronic device and the second electronic device.
19. The packaged semiconductor device of claim 18 , wherein the lid is scaled to the carrier substrate.