IP Library › Granted Patent US 12,237,430
Granted Patent B2
US 12,237,430 · App. 18/236,805 · Granted Feb 25, 2025

Plasmonic field-enhanced photodetector and image sensor

Inventor: Hoon Kim (La Habra, CA)
H01L31/035209H01L27/14623H01L27/14665H01L31/103
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Quick Facts
Patent No.
US 12,237,430
App. No.
18/236,805
Granted
Feb 25, 2025
Kind
B2
Abstract

A photodetector includes a metal layer that shields incident light and generates surface plasmon polaritons (SPPs), a light absorbing layer that absorbs the generated SPPs and allows charges excited by the absorbed SPPs and a localized electric field effect to tunnel, a dielectric formed at nanoholes in which at least a part of the metal layer is opened, and a semiconductor layer that induces the photocurrent based on an electric field effect of tunneled electrons. The SPPs form localized surface plasmons (LSPs) at an interface where the metal layer meets the dielectric.

Claims (36)

1. A photodetector comprising:

a metal layer that shields incident light and generates surface plasmon polaritons (SPPs);

an insulator that absorbs the generated SPPs and allows a localized electric field effect to tunnel; and

a dielectric material formed at nanoholes of the metal layer and formed over the insulator,

wherein photons of the incident light interacts with surface plasmons (SPs) generated at an interface of the metal layer with the dielectric material to generate the SPPs,

wherein a wavelength of the incident light is compressed to increase energy when the SPs is converted to the SPPs.

2. The photodetector of claim 1 , wherein the SPPs form localized surface plasmons (LSPs) at the interface with the dielectric material to enhance localized electric field effect.

3. The photodetector according to claim 2 , wherein density of the localized electric field is configured to increase per unit area to increase photocurrent as a size of the nanoholes decreases.

4. The photodetector of claim 1 , wherein the SPPs are increased in momentum and energy based on a wave vector changed by the incident light and react with excitons of a semiconductor layer.

5. The photodetector according to claim 3 , wherein the photocurrent is generated at the semiconductor layer by absorbing the SPPs at the insulator.

6. The photodetector of claim 1 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm at the nanoholes of the metal layer.

7. The photodetector of claim 1 , wherein charges excited by the SPPs generated through interaction between the incident light and the metal layer affects a threshold voltage of an adjacent current channel to induce photocurrent.

8. The photodetector according to claim 4 , wherein the dielectric material at the nanoholes is formed of a material having a greater dielectric constant than air, and

wherein the metal layer is configured to shield the incident light propagating in air.

9. An image sensor comprising:

a metal surface;

a metal nanohole array formed on the metal surface; and

a detector array formed at a position corresponding to the metal nanohole array,

wherein the metal surface is configured to shield incident light and to generate surface plasmon polaritons (SPPs),

wherein the detector array comprises:

an insulator that absorbs the generated SPPs and allows a localized electric field effect to tunnel, and

a dielectric formed at nanoholes in which at least a part of the metal surface is opened and formed over the insulator,

wherein photons of the incident light interacts with surface plasmons (SPs) generated at an interface of the metal surface with the dielectric to generate the SPPs.

10. The image sensor of claim 9 , wherein a wavelength of the incident light is compressed to increase energy when the SPs is converted to the SPPs.

11. The image sensor of claim 9 , wherein the SPPs form localized surface plasmons (LSPs) at the interface with the dielectric material to enhance localized electric field effect.

12. The image sensor of claim 9 , wherein the SPPs are increased in momentum and energy based on a wave vector changed by the incident light and react with excitons of a semiconductor layer.

13. The image sensor of claim 9 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm at the nanoholes of the metal nanohole array.

14. A method of operating a photodetector, the method comprising:

generating, at a metal layer that shields incident light, surface plasmon polaritons (SPPs), the SPPs being generated by combining surface plasmons (SPs) with photons of a light wave;

absorbing, at an insulator layer, the generated SPPs; and

generating photocurrent, at a semiconductor layer, by using the absorbed SPPs,

wherein photons of the incident light interacts with surface plasmons (SPs) generated at an interface of the metal layer with a dielectric material formed at nanoholes of the metal layer and formed over the insulator to generate the SPPs.

15. The method of claim 14 , wherein a wavelength of the incident light is compressed to increase energy when the SPs is converted to the SPPs.

16. The method of claim 14 , wherein the SPPs form localized surface plasmons (LSPs) at the interface with the dielectric material to enhance localized electric field effect.

17. The method of claim 14 , wherein the SPPs are increased in momentum and energy based on a wave vector changed by the incident light and react with excitons of a semiconductor layer.

18. The method of claim 14 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm at the nanoholes of the metal layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2025
From: KIM, HOON, DR.
To: TMRW ELECTRONICS, SARL
Reel/Frame 072672/0352 →
Continuity (4)
Continuation 17574714 · Jan 13, 2022
Continuation 16919831 · Jul 2, 2020
Provisional Application 62961029 · Jan 14, 2020
Related Publication 20230402556A1 · Dec 14, 2023
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