Backside integrated voltage regulator for integrated circuits
The technology relates to an integrated circuit (IC) package. The IC package may include a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die may include a metal layer and a silicon layer. The metal layer may be connected to the packaging substrate. The integrated voltage regulator die may be positioned adjacent to the silicon layer and connected to the packaging substrate via one or more through mold vias or through dielectric vias. The IC die may be an application specific integrated circuit (ASIC) die.
1. An integrated circuit (IC) package comprising:
an application specific integrated circuit (ASIC) die including a silicon layer; and
an integrated power regulator die connected to the silicon layer by a power distribution network (PDN), wherein the IC package further includes a packaging substrate, wherein the integrated power regulator die is connected to the packaging substrate via one or more through mold vias (TMVs) or one or more dielectric vias (TDVs), wherein the integrated power regulator die is configured to receive power through the one or more TMVs or TDVs.
2. The IC package of claim 1 , wherein the PDN includes one or more through silicon vias (TSVs) within the silicon layer, and the integrated power regulator die is configured to provide power to the ASIC die via the TSVs.
3. The IC package of claim 2 , wherein the PDN further includes a redistribution layer configured to provide power from the integrated power regulator die to the TSVs.
4. The IC package of claim 3 , wherein the TSVs and redistribution layer form an inductor for use by the integrated power regulator die.
5. The IC package of claim 1 , wherein each of the one or more TMVs or the one or more TDVs are connected to the packaging substrate on a first end by a flip chip bump and to the integrated power regulator die at a second opposite end.
6. The IC package of claim 1 , wherein the silicon layer is connected to the packaging substrate via one or more flip chip bumps.
7. The IC package of claim 1 , wherein the packaging substrate is configured to connect to a land grid array (LGA) socket or ball grid array (BGA) socket.
8. The IC package of claim 7 , wherein power is delivered to the integrated power regulator die via the LGA socket or the BGA socket, and the packaging substrate includes a redistribution layer configured to route the power from the LGA socket or the BGA socket to the one or more TMVs or TDVs.
9. The IC package of claim 1 , further comprising deep trench capacitors embedded into the silicon layer or stacked on the silicon layer for use by the integrated power regulator die.