Granted Patent B2

US 12,507,525 · App. 18/258,922 · Granted Dec 23, 2025

Inventors: Daiki Nakamura (Kanagawa, JP); Rai Sato (Tochigi, JP); Ryu Kokubo (Tochigi, JP); Hiroki Adachi (Tochigi, JP)

Assignee: Semiconductor Energy Laboratory Co., Ltd.

H10K59/1201H10K50/15H10K50/16H10K59/38H10K59/8051H10K59/8052H10K71/60

Abstract

Claims (96)

1 . A method for manufacturing a display apparatus comprising:

a first insulator;

a second insulator;

a third insulator;

a first conductor;

a second conductor;

a first EL layer; and

a second EL layer, the method comprising:

a first step to a twelfth step,

wherein the first step comprises a step of forming the first conductor over the first insulator,

wherein the second step comprises a step of forming the second insulator over the first insulator and over the first conductor,

wherein the third step comprises a step of forming a first opening portion reaching the first conductor in the second insulator in a region where the second insulator overlaps with the first conductor,

wherein the fourth step comprises a step of forming a sacrificial layer over the second insulator and over the first conductor positioned at a bottom surface of the first opening portion,

wherein the fifth step comprises a step of applying a photoresist over the sacrificial layer,

wherein the sixth step comprises a step of forming a second opening portion having an inverse tapered structure and reaching the sacrificial layer in a region overlapping with the first conductor in the photoresist by performing light exposure and development on the photoresist,

wherein the seventh step comprises a step of forming a third opening portion reaching the first conductor positioned at the bottom surface of the first opening portion and the second insulator in the sacrificial layer positioned at a bottom surface of the second opening portion in a region overlapping with the first opening portion and a region overlapping with the second insulator,

wherein the eighth step comprises a step of forming the first EL layer over the photoresist, over the sacrificial layer, and over the first conductor,

wherein the ninth step comprises a step of removing the photoresist, the sacrificial layer, and the first EL layer formed over each top surface of the photoresist and the sacrificial layer,

wherein the tenth step comprises a step of forming the second EL layer over the first EL layer and over the second insulator,

wherein the eleventh step comprises a step of forming the second conductor over the second EL layer, and

wherein the twelfth step comprises a step of forming the third insulator over the second conductor.

2 . A method for manufacturing a display apparatus comprising:

a first insulator;

a second insulator;

a third insulator;

a first conductor;

a second conductor;

a first EL layer; and

a second EL layer, the method comprising:

a first step to a twelfth step,

wherein the first step comprises a step of forming the first conductor over the first insulator,

wherein the second step comprises a step of forming the second insulator over the first insulator and over the first conductor,

wherein the third step comprises:

a step of forming a first opening portion reaching the first conductor in the second insulator in a region where the second insulator overlaps with the first conductor; and

a step of forming a fourth opening portion in the second insulator in a region where the second insulator does not overlap with the first conductor and overlaps with the first insulator,

wherein the fourth step comprises a step of forming a sacrificial layer over the second insulator and over the first conductor positioned at a bottom surface of the first opening portion,

wherein the fifth step comprises a step of applying a photoresist over the sacrificial layer,

wherein the sixth step comprises a step of forming a second opening portion having an inverse tapered structure and reaching the sacrificial layer in a region overlapping with the first conductor and the fourth opening portion in the photoresist by performing light exposure and development on the photoresist,

wherein the seventh step comprises a step of forming a third opening portion in the sacrificial layer positioned at a bottom surface of the second opening portion in a region overlapping with the first conductor and a region overlapping with the second insulator, the third opening portion reaching the first conductor positioned at the bottom surface of the first opening portion and the second insulator and having a side surface overlapping with one or both of a bottom surface and a side surface of the fourth opening portion,

wherein the eighth step comprises a step of forming the first EL layer over the photoresist, over the sacrificial layer, and over the first conductor,

wherein the ninth step comprises a step of removing the photoresist, the sacrificial layer, and the first EL layer formed over each top surface of the photoresist and the sacrificial layer,

wherein the tenth step comprises a step of forming the second EL layer over the first EL layer, over the second insulator, and over the fourth opening portion,

wherein the eleventh step comprises a step of forming the second conductor over the second EL layer, and

wherein the twelfth step comprises a step of forming the third insulator over the second conductor.

3 . The method for manufacturing the display apparatus according to claim 1 ,

wherein the first EL layer comprises one of a hole-transport layer and an electron-transport layer and a light-emitting layer, and

wherein the second EL layer comprises the other of the hole-transport layer and the electron-transport layer.

4 . The method for manufacturing the display apparatus according to claim 1 , further comprising:

a thirteenth step; and

a fourteenth step,

wherein the thirteenth step comprises a step of forming a resin layer over the third insulator, and

wherein the fourteenth step comprises a step of bonding a substrate to the resin layer.

5 . The method for manufacturing the display apparatus according to claim 4 ,

wherein the substrate comprises a coloring layer, and

wherein in the fourteenth step, the substrate is bonded to the resin layer in a position where the coloring layer overlaps with the first EL layer.

6 . A display apparatus comprising:

a first insulator;

a second insulator;

a third insulator;

a first conductor;

a second conductor;

a first EL layer; and

a second EL layer,

wherein the first conductor is positioned over the first insulator,

wherein the second insulator is positioned over the first insulator and over the first conductor,

wherein the second insulator comprises:

a first opening portion reaching the first conductor positioned in a region where the second insulator overlaps with the first conductor; and

a fourth opening portion positioned in a region where the second insulator does not overlap with the first conductor and overlaps with the first insulator,

wherein the first EL layer is positioned over the second insulator and over the first conductor positioned at a bottom surface of the first opening portion,

wherein the second EL layer is positioned over the first EL layer, over the second insulator, and over the first insulator positioned at a bottom surface of the fourth opening portion,

wherein the second conductor is positioned over the second EL layer, and

wherein the third insulator is positioned over the second conductor.

7 . The display apparatus according to claim 6 ,

wherein the first EL layer comprises one of a hole-transport layer and an electron-transport layer and a light-emitting layer, and

wherein the second EL layer comprises the other of the hole-transport layer and the electron-transport layer.

8 . The display apparatus according to claim 6 , further comprising:

a resin layer; and

a substrate,

wherein the resin layer is positioned over the third insulator, and

wherein the substrate is positioned over the resin layer.

9 . The display apparatus according to claim 8 ,

wherein the substrate comprises a coloring layer in a position overlapping with the first EL layer.

10 . An electronic device comprising:

the display apparatus according to claim 6 ; and

a housing.

11 . The method for manufacturing the display apparatus according to claim 2 ,

wherein the first EL layer comprises one of a hole-transport layer and an electron-transport layer and a light-emitting layer, and

wherein the second EL layer comprises the other of the hole-transport layer and the electron-transport layer.

12 . The method for manufacturing the display apparatus according to claim 2 , further comprising:

a thirteenth step; and

a fourteenth step,

wherein the thirteenth step comprises a step of forming a resin layer over the third insulator, and

wherein the fourteenth step comprises a step of bonding a substrate to the resin layer.

13 . The method for manufacturing the display apparatus according to claim 12 ,

wherein the substrate comprises a coloring layer, and

wherein in the fourteenth step, the substrate is bonded to the resin layer in a position where the coloring layer overlaps with the first EL layer.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (96)