IP Library › Granted Patent US 12,206,392
Granted Patent B2
US 12,206,392 · App. 18/339,030 · Granted Jan 21, 2025

Transient overvoltage active clamping for semiconductor power switches

Inventor: Bora Novakovic (Thiensville, WI)
Assignee: Rockwell Automation Technologies, Inc.
H03K17/08112H03K17/162H03K17/567
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Quick Facts
Patent No.
US 12,206,392
App. No.
18/339,030
Granted
Jan 21, 2025
Kind
B2
Abstract

A system may include a switch, a gate driver, and a signal conditioner. The switch may couple to a load. The gate driver may generate one or more gating signals to control one or more operations of the switch. The signal conditioner may receive an input signal associated with the switch and generate a modification signal that may modify the one or more gating signals based on the input signal. The modified gating signal may be used to reduce an amplitude of a voltage transient received by the switch to below a voltage threshold.

Claims (45)

1. A system, comprising:

a switch configured to couple to a load;

a gate driver configured to generate one or more gating signals to control one or more operations of the switch;

a signal conditioner configured to:

receive an input signal associated with the switch; and

generate a modification signal configured to modify the one or more gating signals based on the input signal, wherein the modified gating signal is configured to reduce an amplitude of a voltage transient received by the switch to below a voltage threshold.

2. The system of claim 1 , wherein the signal conditioner comprises a dead band circuit, a high-pass filter circuit, and an attenuator circuit.

3. The system of claim 2 , wherein the signal conditioner comprises an amplifier circuit.

4. The system of claim 3 , wherein the dead band circuit comprises a plurality of Zener diodes or transient voltage suppressor (TVS) diodes.

5. The system of claim 3 , wherein the high-pass filter circuit comprises a resistor-capacitor circuit.

6. The system of claim 5 , wherein the attenuator circuit comprises an additional resistor-capacitor circuit coupled in series with a resistor.

7. The system of claim 3 , wherein the attenuator circuit comprises a plurality of resistors coupled in series with a resistor.

8. The system of claim 3 , wherein the high-pass filter circuit is configured to couple to the attenuator circuit to form a circuit, and wherein the circuit comprises a plurality of impedance blocks coupled in series with an impedance block.

9. The system of claim 3 , wherein the amplifier circuit comprises a resistor, a metal-oxide semiconductor field effect transistor (MOSFET) transistor, and a Zener diode.

10. The system of claim 3 , wherein the gate driver comprises:

a gate drive powered by a common collector voltage and a common emitter voltage;

a first resistor associated with a gate ON state of the gate driver; and

a second resistor associated with a gate OFF state of the gate driver.

11. The system of claim 3 , wherein the dead band circuit is configured to couple to a collector side of the switch and the attenuator circuit.

12. The system of claim 3 , wherein the attenuator circuit is configured to couple to a collector side of the switch and the high-pass filter circuit.

13. The system of claim 3 , wherein the attenuator circuit is configured to couple to a collector side of the switch and the dead band circuit.

14. The system of claim 3 , wherein the dead band circuit, the high-pass filter circuit, and the attenuator circuit are positioned between the amplifier circuit and a collector side of the switch, and the amplifier circuit is configured to couple to the gate driver.

15. A circuit, comprising:

a dead band circuit comprising one or more Zener diodes or one or more transient voltage suppressor (TVS) diodes;

a high-pass filter circuit comprising a resistor-capacitor circuit; and

an attenuator circuit comprising a plurality of resistors coupled in series with a resistor;

wherein the circuit is configured to couple across a semiconductor switch configured to provide power to a load component.

16. The circuit of claim 15 , comprising a shunt circuit, wherein the shunt circuit comprises a comparison circuit, a delay circuit, and a switch circuit.

17. The circuit of claim 16 , wherein the comparison circuit is configured to:

compare a gating signal with a Miller plateau voltage;

determine whether the gating signal exceeds the Miller plateau voltage;

disable the shunt circuit in response to determining that the gating signal exceeds the Miller plateau voltage; and

enable the shunt circuit in response to determining that the gating signal falls below the Miller plateau voltage.

18. The circuit of claim 16 , comprising an amplifier circuit comprising a resistor, a metal-oxide semiconductor field effect transistor (MOSFET) transistor, and a Zener diode.

19. A method, comprising:

attenuating, via an attenuator circuit of a signal conditioning circuitry, one or more voltage transients associated one or more signals received by a semiconductor switch and below a first voltage threshold;

converting, via the attenuator circuit, a voltage signal below the first voltage threshold and associated with the one or more signals into a modification signal configured to modify a gating signal generated from a gate driver circuitry;

attenuating, via a dead band circuit of the signal conditioning circuitry, a first voltage transient associated the one or more signals and above the first voltage threshold, wherein the first voltage transient is associated with a first duration greater than a threshold amount of time;

passing, via the dead band circuit, within the threshold amount of time, a second voltage transient received by the semiconductor switch and above the first voltage threshold, wherein the second voltage transient is associated with a second duration less than the threshold amount of time;

attenuating, via the dead band circuit, the second voltage transient to below a second voltage threshold, wherein the second voltage threshold corresponds to a maximum voltage allowable for the semiconductor switch and greater than the first voltage threshold;

passing, via a high-pass filter circuit, a portion of the modification signal having frequency contents higher than a frequency threshold;

determining, via a comparison circuit of a shunt circuitry of the signal conditioning circuitry, whether the gating signal exceeds a Miller plateau voltage threshold;

in response to determining that the gating signal is below the Miller plateau voltage threshold, amplifying, via an amplifier circuit, the portion of the modification signal; and

injecting, via a modulator circuit, the amplified portion of the modification signal to the gate driver circuitry to modify the gating signal into a modified gating signal, wherein the modified gating signal is configured to enable the shunt circuitry, wherein enabling the shunt circuit disables the semiconductor switch to reduce an amplitude of second voltage transient within the threshold amount of time.

20. The method of claim 19 , wherein the semiconductor switch comprises a PNP type bipolar junction transistor (BJT), or a metal-oxide semiconductor field effect transistor (MOSFET), or an insulated gate bipolar transistor (IGBT).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2023
From: NOVAKOVIC, BORA
To: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
Reel/Frame 064026/0640 →
Continuity (1)
Related Publication 20240429910A1 · Dec 26, 2024
References Cited (25)
US 4459498A · Stengl et al. · 1984 [cited by applicant]
US 4679112A · Craig · 1987 [cited by applicant]
US 5001373A · Bator et al. · 1991 [cited by applicant]
US 5079608A · Wodarczyk et al. · 1992 [cited by applicant]
US 5304802A · Kumagai · 1994 [cited by applicant]
US 5731729A · Ochi · 1998 [cited by examiner]
US 6087877A · Gonda · 2000 [cited by examiner]
US 6614633B1 · Kohno · 2003 [cited by examiner]
US 7327546B2 · Thiery · 2008 [cited by examiner]
US 7453308B2 · Tihanyi · 2008 [cited by examiner]
US 7576964B2 · Nakahara · 2009 [cited by examiner]
US 8710894B2 · Arndt · 2014 [cited by examiner]
US 8937823B2 · Jones · 2015 [cited by examiner]
US 9013848B2 · Lui · 2015 [cited by applicant]
US 9490244B2 · Barrenscheen · 2016 [cited by examiner]
US 9866211B2 · Laich · 2018 [cited by examiner]
US 10234880B1 · Li et al. · 2019 [cited by applicant]
US 10620650B2 · Iwamizu · 2020 [cited by examiner]
US 11711021B2 · Wang · 2023 [cited by examiner]
US 20010017783A1 · Bruckmann et al. · 2001 [cited by applicant]
US 20130033909A1 · Jones et al. · 2013 [cited by applicant]
US 20130155560A1 · Takeuchi · 2013 [cited by examiner]
US 20180159520A1 · Vytla · 2018 [cited by examiner]
US 20180269865A1 · Song · 2018 [cited by examiner]
US 20190260368A1 · Vytla · 2019 [cited by examiner]